Transistor including dielectric barrier and manufacturing method thereof
An integrated circuit includes a first nanostructure transistor and a second nanostructure transistor on a substrate. The source/drain regions of the first nanostructure are electrically isolated from the semiconductor substrate by dielectric barriers. The source/drain regions of the second nanostructure transistor in direct contact with the semiconductor substrate.
1. A method, comprising:
defining a first channel region of a first transistor by forming a first trench in a semiconductor layer over a semiconductor substrate;
forming a dielectric barrier on the semiconductor substrate in a bottom of the first trench; and
growing a first source/drain region of the first transistor over the dielectric barrier and in contact with the first channel region, wherein the dielectric barrier electrically isolates the first source region from the semiconductor substrate;
forming a second channel region of a second transistor by forming a second trench in the semiconductor layer over the semiconductor substrate;
selectively forming a masking layer over the first transistor; and
growing a second source/drain region of the second transistor in contact with the semiconductor substrate at a bottom of the second trench, wherein the first source/drain region and the second source/drain region have a same first conductivity type.
2. The method of claim 1 , further comprising:
doping the semiconductor substrate under the first channel region with the first conductivity type; and
doping the semiconductor substrate under the second channel region with a second conductivity type opposite the first conductivity type.
3. The method of claim 1 , wherein growing the first source/drain region of the first transistor over the dielectric barrier includes:
growing the first source/drain region to form a void between the first source/drain region and the dielectric barrier.
4. The method of claim 1 , wherein growing the first source/drain region of the first transistor over the dielectric barrier includes:
growing the first source/drain region to cover and contact an entirety of a top surface of the dielectric barrier.
5. The method of claim 1 , wherein forming the dielectric barrier on the semiconductor substrate includes:
partially removing a sacrificial semiconductor nanostructure to form a recess between a first semiconductor nanostructure and a second semiconductor nanostructure;
depositing an inner spacer layer to fill in the recess, wherein the inner spacer layer is over a bottom portion of the first trench; and
partially removing the inner spacer layer to form the dielectric barrier.
6. The method of claim 5 , wherein partially removing the inner spacer layer includes:
partially removing the inner spacer layer to laterally expose the first semiconductor nanostructure and the second semiconductor nanostructure, wherein a bottommost portion of the inner spacer layer is in contact with the dielectric barrier.
7. The method of claim 5 , wherein partially removing the inner spacer layer includes:
partially removing the inner spacer layer to laterally expose the first semiconductor nanostructure and the second semiconductor nanostructure, wherein a bottommost portion of the inner spacer layer is separated from the dielectric barrier.
8. A method, comprising:
forming a pair of stacked first channels of a first transistor above a semiconductor substrate;
forming a pair of stacked second channels of a second transistor above the semiconductor substrate;
forming a first recess between the pair of stacked first channels;
forming a second recess between the pair of stacked second channels;
depositing a dielectric layer in a first trench adjacent to the first channels and in a second trench adjacent to the second channels;
forming, from the dielectric layer, a first inner spacer in the first recess, a second inner spacer in the second recess, a first dielectric barrier in contact with the semiconductor substrate in the first trench, and a second dielectric barrier in contact with the semiconductor substrate in the second trench by etching a portion of the dielectric layer;
removing the second dielectric barrier from the second trench;
forming a first source/drain region of the first transistor in the first trench above and in contact with the first dielectric barrier and coupled to the first and second channels, wherein the dielectric barrier electrically isolates the first source/drain region from the semiconductor substrate; and
forming, after removing the second dielectric barrier, a second source/drain region of the second transistor in the second trench in contact with semiconductor substrate.
9. The method of claim 8 , wherein a conductivity type of the second source/drain region is the same as that of the first source/drain region, and a channel length of the second transistor is different than that of the first transistor.
10. The method of claim 8 , comprising forming a shallow trench isolation region in the semiconductor substrate between the first source/drain region and the second source/drain region and including recess in a top surface of the shallow trench isolation region between the first source/drain region and the second source/drain region, wherein the first source/drain region and the second source/drain region are of differing conductivity types.
11. The method of claim 8 , wherein the dielectric barrier includes at least one of SiN, SiON, and SiOCN.
12. The method of claim 8 , further comprising forming a void between the first source/drain region and the first dielectric barrier.
13. The method of claim 8 , wherein the first source/drain region has a first conductivity type and the second source/drain region has a second conductivity type different than the first conductivity type.
14. The method of claim 13 , wherein the first channels have a same length as the second channels.
15. The method of claim 13 , wherein the first channels have a different length than the second channels.
16. The method of claim 13 , wherein the semiconductor substrate below the first channels has the first conductivity type, wherein the semiconductor substrate below the second channels has the first conductivity type.
17. The method of claim 13 , wherein the semiconductor substrate below the first channels has the first conductivity type, wherein the semiconductor substrate below the second channels has the second conductivity type.
18. A method, comprising:
defining a first channel region of a first transistor by forming a first trench in a semiconductor layer over a semiconductor substrate, the semiconductor substrate below the first channel region being doped with a first conductivity type;
defining a second channel region of a second transistor by forming a second trench in the semiconductor layer over the semiconductor substrate, the semiconductor substrate below the second channel region being doped with a second conductivity type opposite the first conductivity type;
forming a dielectric barrier on the semiconductor substrate in a bottom of the first trench;
forming a first source/drain region of the first transistor in the first trench over the dielectric barrier and in contact with the first channel region, wherein the dielectric barrier electrically isolates the first source/drain region from the semiconductor substrate, and
forming a second source/drain region of the second transistor in the second trench in contact with the semiconductor substrate in a bottom of the second trench and in contact with the second channel region, wherein the first source/drain region and the second source/drain region both have the first conductivity type.
19. The method of claim 18 , wherein the dielectric barrier includes at least one of SiN, SiON, and SiOCN.
20. The method of claim 18 , wherein the first channel region and the second channel region have a same length.