Semiconductor device including source/drain contact having height below gate stack
A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.
1. A semiconductor structure comprising:
a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region;
a first separation spacer disposed on the first gate structure; and
a plurality of first vias on the first gate structure, wherein the plurality of first vias, that are arranged on opposite sides of the first separation spacer, are isolated from each other and apart from the first separation spacer by different distances.
2. The semiconductor structure of claim 1 , further comprising:
a second separation spacer disposed on the second gate structure to isolate an electronic signal transmitted through a plurality of second vias that are disposed on the second gate structure.
3. The semiconductor structure of claim 2 , wherein the plurality of first vias and the plurality of second vias are disposed outside the non-active region.
4. The semiconductor structure of claim 1 , further comprising:
a first contact arranged above the first active region; and
a second contact arranged above the second active region, wherein the at least one local interconnect is configured to couple the first contact to the second contact.
5. The semiconductor structure of claim 4 , wherein the at least one local interconnect, the first contact, and the second contact are disposed between the first gate structure and the second gate structure.
6. The semiconductor structure of claim 1 , further comprising:
a first contact and a second contact that are coupled to each other through the at least one local interconnect,
wherein the first contact and the second contact are disposed outside the non-active region.
7. The semiconductor structure of claim 1 , wherein the first separation spacer overlaps the first gate structure and the at least one local interconnect.
8. The semiconductor structure of claim 1 , further comprising:
a plurality of second vias that are disposed on the second gate structure,
wherein the at least one local interconnect is adjacent to the first gate structure or the second gate structure,
wherein a first pitch between the plurality of first vias is substantially equal to a second pitch between the plurality of second vias.
9. The semiconductor structure of claim 1 , wherein the first separation spacer crosses the at least one local interconnect.
10. The semiconductor structure of claim 1 , wherein the first separation spacer overlaps the non-active region, without overlapping the first active region and the second active region.
11. A semiconductor structure, comprising:
a plurality of gate structures and a plurality of local interconnects that are interlaced along a first direction and overlap a non-active region;
a plurality of first vias arranged on the plurality of gate structures and separated from each other in a second direction by a first distance;
a plurality of second vias arranged on the plurality of local interconnects and separated from each other in the second direction by a second distance greater than the first distance; and
a plurality of separation spacers that are configured to electrically isolate the plurality of first vias from each other and overlap the non-active region, the plurality of gate structures, and the plurality of local interconnects.
12. The semiconductor structure of claim 11 , wherein the plurality of separation spacers align with each other along the first direction.
13. The semiconductor structure of claim 12 , wherein the plurality of separation spacers extend in the first direction.
14. The semiconductor structure of claim 11 , wherein the plurality of gate structures and the plurality of local interconnects extend in the second direction and overlap a first active area and a second active area,
wherein the first active area and the second active area are separated by the non-active region.
15. The semiconductor structure of claim 11 , wherein the plurality of first vias and the plurality of second vias are disposed outside of the non-active region.
16. The semiconductor structure of claim 11 , wherein a length of the plurality of separation spacers is greater than that of the plurality of first vias and the plurality of second vias along the first direction.
17. A semiconductor structure, comprising:
a first gate structure and a first separation spacer extending across the first gate structure, wherein widths of the first gate structure and the first separation spacer are different;
a plurality of first vias arranged on opposite sides of the first separation spacer;
a first local interconnect disposed over a first region and coupled to the plurality of first vias, wherein the first region is part of a non-doped region; and
a plurality of second vias that are arranged on opposite sides of the first separation spacer and on the first gate structure, wherein a portion, above the first region, of the first gate structure has no vias thereon.
18. The semiconductor structure of claim 17 , further comprising:
a second gate structure and a second separation spacer extending across the second gate structure, wherein a width of the second gate structure is smaller than the second separation spacer,
wherein the first local interconnect is interposed between the first gate structure and the second gate structure.
19. The semiconductor structure of claim 17 , further comprising:
a second local interconnect that is overlapped by the first separation spacer and configured to couple a plurality of third vias, arranged on opposite sides of the first separation spacer, with each other.
20. The semiconductor structure of claim 19 , further comprising:
a second separation spacer that is interposed between the plurality of third vias; and
a third local interconnect that is overlapped by the second separation spacer and configured to couple a plurality of fourth vias, arranged on opposite sides of the second separation spacer, with each other.