Inspection device and inspection method for detecting formation of a solder bridge over adjacent electrodes
The present disclosure provides an inspection device for use in a mounting system including a mounting device for disposing a component on a board, including a control section configured to extract a mass area included in a captured image resulting from imaging a processing target object where a viscous fluid is formed at a predetermined part, obtain a center of gravity of the mass area so extracted, and determine whether the center of gravity is included in a normal range of the predetermined part as a reference of the captured image to thereby determine whether a bridge has occurred where the viscous fluid is formed over adjacent predetermined parts.
1. An inspection device for use in a mounting system including a mounting device for disposing a processing target object on a board, comprising:
a processor; and
a memory storing instructions executable by the processor,
wherein the processor is configured to:
capture an image by imaging the processing target object;
extract a mass area included in the captured image of the processing target object where a viscous fluid is formed at a predetermined part;
obtain a location of a center of gravity of the mass area;
determine whether the location of the center of gravity is within boundaries of an area of the predetermined part relative to a reference image of the predetermined part with the viscous fluid present;
detect a brightness difference between a plurality of detection lines crossing between an inside area of the predetermined part and an outside area of the predetermined part;
detect a state of disposition of the processing target object based on detection lines of the plurality of detection lines that satisfy a predetermined tolerance ratio;
determine, based on the location of the center of gravity and the state of disposition of the processing target object, whether a bridge has occurred, wherein the bridge is a formation of the viscous fluid over adjacent predetermined parts; and
execute a discard process of discarding the processing target object in response to determining that the bridge has occurred.
2. The inspection device according to claim 1 ,
wherein the processing target object is a component having two or more electrodes,
wherein the viscous fluid is solder, and
wherein the processor is further configured to determine whether a bridge of the solder has occurred.
3. An inspection method for use in a mounting system including a mounting device for disposing a processing target object on a board, comprising:
capturing an image by imaging the processing target object;
extracting a mass area included in the captured image of the processing target object where a viscous fluid is formed at a predetermined part;
obtaining a location of a center of gravity of the mass area;
determining whether the location of the center of gravity is within boundaries of an area of the predetermined part relative to a reference image of the predetermined part with the viscous fluid present;
detecting a brightness difference between a plurality of detection lines crossing between an inside area of the predetermined part and an outside area of the predetermined part;
detecting a state of disposition of the processing target object based on detection lines of the plurality of detection lines that satisfy a predetermined tolerance ratio;
determining, based on the location of the center of gravity and the state of disposition of the processing target object, whether a bridge has occurred, wherein the bridge is a formation of the viscous fluid over adjacent predetermined parts; and
executing a discard process of discarding the processing target object in response to determining that the bridge has occurred.