IP Library Granted Patent US 12,346,022
Granted Patent B2
US 12,346,022 · App. 17/933,769 · Granted Jul 1, 2025

Method of fabricating pellicle structure

Inventors: Mun Ja Kim (Hwaseong-si, KR); Ji Beom Yoo (Seoul, KR); Ki Bong Nam (Suwon-si, KR); Jin Ho Yeo (Suwon-si, KR); Changyoung Jeong (Yongin-si, KR); Qicheng Hu (Suwon-si, KR)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
G03F1/62G03F7/70983
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Quick Facts
Patent No.
US 12,346,022
App. No.
17/933,769
Granted
Jul 1, 2025
Kind
B2
Abstract

A method of fabricating a pellicle structure includes forming a metal layer on a temporary substrate, forming a membrane on the metal layer, exposing a bottom surface of the metal layer by separating the temporary substrate from the metal layer, and exposing a bottom surface of the membrane by etching the exposed bottom surface of the metal layer.

Claims (62)

1. A method of fabricating a pellicle structure, the method comprising:

forming a metal layer on a temporary substrate;

forming a membrane on the metal layer;

submerging the temporary substrate, the metal layer, and the membrane in a solution;

exposing a bottom surface of the metal layer by physically separating the temporary substrate from the metal layer in the solution; and

exposing a bottom surface of the membrane by etching the bottom surface of the metal layer.

2. The method of claim 1 , further comprising forming a first support layer on a top surface of the membrane,

wherein the first support layer comprises:

a body part on an edge region of the membrane; and

a handling part connected to the body part, the handling part extending from the body part,

wherein, in a plan view, the handling part is spaced apart from the membrane.

3. The method of claim 2 , wherein separating the temporary substrate from the metal layer comprises applying a force to the handling part of the first support layer to separate the temporary substrate from the metal layer.

4. The method of claim 1 , further comprising forming a buffer layer between the metal layer and the temporary substrate,

wherein the solution is configured to reduce a bonding force between the buffer layer and the metal layer.

5. The method of claim 1 , further comprising:

forming a first support layer on an edge region of the membrane; and

forming a second support layer on the first support layer,

wherein the second support layer is spaced apart from a central region of the membrane.

6. The method of claim 5 , wherein

an internal space is formed by the first support layer, the second support layer, and the membrane,

a top surface of the membrane at the central region of the membrane faces the internal space, and

the top surface of the membrane at the central region of the membrane is not exposed to the solution.

7. The method of claim 1 , further comprising attaching a pellicle frame to the bottom surface of the membrane.

8. The method of claim 1 , further comprising forming a sublimation support layer on a top surface of the membrane at a central region of the membrane prior to exposing the bottom surface of the membrane.

9. The method of claim 1 , further comprising forming a buffer layer between the temporary substrate and the metal layer,

wherein separating the temporary substrate from the metal layer comprises separating the buffer layer from the metal layer.

10. The method of claim 7 , wherein the pellicle frame exposes at least a portion of the bottom surface of the membrane,

the temporary substrate is separated from the metal layer at a separation rate of about 0.1 mm/s to about 2 mm/s, and

the etching is performed for about 5 minutes to about 15 minutes.

11. A method of fabricating a pellicle structure, the method comprising:

forming a metal catalytic layer on a temporary substrate;

forming a membrane on the metal catalytic layer;

forming a first support layer on a top surface of the membrane;

forming a second support layer on the first support layer, wherein an internal space is formed by the first support layer, the second support layer, and the membrane; and

exposing a bottom surface of the metal catalytic layer by separating the temporary substrate from the metal catalytic layer,

wherein the first support layer comprises:

a body part on an edge region of the membrane; and

a handling part connected to the body part,

wherein, in a plan view, the handling part is spaced apart from the membrane.

12. The method of claim 11 , wherein separating the temporary substrate from the metal catalytic layer comprises applying a force to the handling part of the first support layer to separate the temporary substrate from the metal catalytic layer.

13. The method of claim 11 , further comprising exposing a bottom surface of the membrane by etching the bottom surface of the metal catalytic layer.

14. The method of claim 11 , wherein

a top surface of the metal catalytic layer has a (100) plane, and

a thickness of the metal catalytic layer is in a range of about 400 nm to about 5 μm.

15. The method of claim 11 , wherein the second support layer is in direct contact with the first support layer.

16. A method of fabricating a pellicle structure, the method comprising:

forming a metal layer on a temporary substrate;

forming a membrane on the metal layer, wherein the membrane comprises an edge region and a central region;

forming a first support layer on the edge region of the membrane;

forming a second support layer on the first support layer, wherein the second support layer is spaced apart from a top surface of the membrane at the central region of the membrane;

exposing a bottom surface of the metal layer by separating the temporary substrate from the metal layer;

separating the second support layer from the first support layer;

forming a sublimation support layer on the top surface of the membrane at the central region of the membrane;

exposing a bottom surface of the membrane by etching the bottom surface of the metal layer;

attaching a pellicle frame to the bottom surface of the membrane, the pellicle frame overlapping the central region of the membrane; and

removing the edge region of the membrane.

17. The method of claim 16 , wherein separating the temporary substrate from the metal layer is performed in a solution.

18. The method of claim 16 , wherein an internal space is formed by the membrane, the first support layer, and the second support layer, and

wherein the top surface of the membrane at the central region of the membrane faces the internal space.

19. The method of claim 16 , wherein forming the sublimation support layer on the top surface of the membrane precedes exposing the bottom surface of the membrane and attaching the pellicle frame to the bottom surface of the membrane.

20. The method of claim 16 , further comprising forming a third support layer on the bottom surface of the membrane,

wherein the third support layer overlaps the edge region of the membrane and is spaced apart from the pellicle frame.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED AT REEL: 061156 FRAME: 0837. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 23, 2022
From: YOO, JI BEOM; NAM, KI BONG; YEO, JIN HO; HU, QICHENG
To: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
Reel/Frame 061746/0951 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2022
From: KIM, MUN JA; JEONG, CHANGYOUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061156/0785 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2022
From: YOO, JI BEOM; NAM, KI BONG; YEO, JIN HO; HU, QICHENG
To: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
Reel/Frame 061156/0837 →
Priority Claims (1)
KR 10-2022-0026288 · Feb 28, 2022 · national
Continuity (1)
Related Publication 20230273515A1 · Aug 31, 2023
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