IP Library Granted Patent US 12,352,801
Granted Patent B2
US 12,352,801 · App. 18/349,780 · Granted Jul 8, 2025

Wafer testing for current property of a power transistor

Inventors: Iman Abdali Mashhadi (Kanata, CA); Thomas William MacElwee (Nepean, CA); Mohammad Bozorgi (Kanata, CA); Ting-Hsiang Hsu (Hsinchu, TW); Meng-ta You (Hsinchu, TW); Regina Inyangat Akudo (Kanata, CA); Yueh Lin Chiang (Ottawa, CA)
Assignee: Infineon Technologies Canada Inc.
G01R31/2621G01R31/2601G01R31/2644
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Quick Facts
Patent No.
US 12,352,801
App. No.
18/349,780
Granted
Jul 8, 2025
Kind
B2
Abstract

Wafer testing of a power transistor for a current property of the power transistor. Wafer testing of a power transistor is performed by using a sense transistor constructed using the same epitaxial stack as was used to construct the power transistor. The current property of the sense transistor is then measured, and the current property of the power transistor can be determined from that measurement. Furthermore, the sense transistor is pre-conditioned prior to the measurement by alternately turning on and off the sense transistor multiple cycles while allowing a source terminal of the power transistor to float. This simulates operating conditions of the power transistor, thereby allowing for measurement of the current property of the power transistor as it would likely be in operation.

Claims (33)

1. A method for determining a current property of a power transistor while the power transistor is still on a wafer, the method comprising:

applying a first probe, a drain probe, to a drain terminal of a sense transistor that shares a drain node with the power terminal, the sense transistor being constructed using at least part of a same epitaxial stack as was used to construct which the power transistor, the sense transistor having a lower current flow area than the power transistor;

applying a second probe, a source probe, to a source terminal of the sense transistor;

applying a third probe, a gate probe, to a gate terminal of the sense transistor;

pre-conditioning the sense transistor by alternate turning on and off the sense transistor multiple cycles while allowing a source terminal of the power transistor to float,

wherein turning on the sense transistor comprises 1) applying an on gate voltage via the gate probe to the gate terminal of the sense transistor, 2) applying an on drain voltage via the drain probe to the drain terminal of the sense transistor, and 3) applying an on source voltage via the second probe to the source terminal of the sense transistor;

wherein turning off the sense transistor comprises 1) applying an off gate voltage via the gate probe to the gate terminal of the sense transistor, 2) applying an off drain voltage via the drain probe to the drain terminal of the sense transistor, the off drain voltage greater than the on drain voltage, and 3) applying an off source voltage via the second probe to the source terminal of the sense transistor;

after pre-conditioning the sense transistor, turning on the sense transistor and measuring at least one of 1) the current passing through the sense transistor from the drain terminal of the sense transistor to the source terminal of the sense transistor as the current increases, and 2) a drain-source voltage between the drain terminal of the sense transistor and the source terminal of the sense transistor as the drain-source voltage increases; and

determining a current property of the power transistor based on the measurement.

2. The method in accordance with claim 1 , the current property comprising a current at which the current exits a linear region by a particular amount.

3. The method in accordance with claim 1 , the current property comprising a saturation current.

4. The method in accordance with claim 1 , the current property comprising a current slope verses time when operating in a linear region.

5. The method in accordance with claim 1 , the power transistor having a Gallium Nitride (GaN) channel layer, the sense transistor also having a GaN channel layer formed of the same epitaxial layer as the GaN channel layer of the power transistor.

6. The method in accordance with claim 1 , a current flow area of the power transistor being at least 100 times a current flow area of the sense transistor.

7. The method in accordance with claim 1 , a current flow area of the power transistor being at least 1000 times a current flow area of the sense transistor.

8. The method in accordance with claim 1 , each cycle being repeated at a rate of at least 10,000 per second.

9. The method in accordance with claim 1 , the measure comprising measuring both of 1) the current passing through the sense transistor from the drain terminal of the sense transistor to the source terminal of the sense transistor as the current increases, and 2) a drain-source voltage between the drain terminal of the sense transistor and the source terminal of the sense transistor as the drain-source voltage increases.

10. The method in accordance with claim 1 , the multiple cycles comprises at least twenty cycles.

11. The method in accordance with claim 1 , the off source voltage and the on source voltage both being the same.

12. The method in accordance with claim 1 , the off source voltage and the on source voltage both being ground.

13. The method in accordance with claim 1 , the on drain voltage and the off drain voltage being applied during the pre-conditioning using a circuit connected to the drain probe.

14. The method in accordance with claim 13 , the circuit comprising:

a resistor connected in series between a first voltage source and the drain probe;

an inductor coupled in series between a second voltage source and the drain probe;

a first diode that is connected in series between the inductor and the drain probe and that has a forward direction from the inductor to the drain probe; and

a second diode that is connected between the both ends of the inductor and that has a forward direction towards the second voltage source; a maximum voltage of the first voltage source being higher than a maximum voltage of the first voltage source.

15. The method in accordance with claim 14 , the first voltage source providing a fixed voltage.

16. The method in accordance with claim 14 , the first voltage source providing a first voltage when the transistor is off, and a second voltage when the power transistor is on, the first voltage being higher than the second voltage.

17. The method in accordance with claim 13 , the circuit comprising:

a first voltage source providing a first voltage when the transistor is off, and a second voltage when the power transistor is on, the first voltage being higher than the second voltage;

an inductor coupled in series between a second voltage source and the drain probe, the second voltage source providing a higher voltage;

a first diode that is connected in series between the inductor and the drain probe and that has a forward direction from the inductor to the drain probe; and

a second diode that is connected between both ends of the inductor and that has a forward direction towards the second voltage source; a maximum voltage of the first voltage source being higher than a maximum voltage of the first voltage source.

Assignments (2)
COURT ORDER Recorded Aug 23, 2024
From: GAN SYSTEMS INC.
To: INFINEON TECHNOLOGIES CANADA INC.
Reel/Frame 068763/0324 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2024
From: ABDALI MASHHADI, IMAN; MACELWEE, THOMAS WILLIAM; BOZORGI, MOHAMMAD; AKUDO, REGINA INYANGAT; HSU, TING-HSIANG; YOU, MENG-TA; CHIANG, YUEH LIN
To: GAN SYSTEMS INC.
Reel/Frame 066756/0377 →
Continuity (1)
Related Publication 20250020712A1 · Jan 16, 2025
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