IP Library › Granted Patent US 12,359,424
Granted Patent B2
US 12,359,424 · App. 17/849,884 · Granted Jul 15, 2025

Sound insulating structure

Inventors: Naoyuki Uchida (Tokyo, JP); Kazuma Inoue (Tokyo, JP); Masanari Nakayama (Tokyo, JP)
Assignee: Mitsubishi Chemical Corporation
E04B1/82B60R13/0815
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Quick Facts
Patent No.
US 12,359,424
App. No.
17/849,884
Granted
Jul 15, 2025
Kind
B2
Abstract

The present invention addresses the problem of providing a sound insulating structure which provides a sufficient sound insulating effect even when an adhesive layer is arranged therein, and in which a shift in the frequency band where the sound insulating effect is generated is unlikely to occur. This sound insulating structure includes, at least: a sound insulating member that includes a sheet-like sheet section and plural projections arranged on the sheet section; and an adhesive layer arranged on a surface of the sheet section on the opposite side of the side provided with the projections, and the sound insulating structure satisfies the following Formula (1): E_glue/I_glue>0.5×(E_membrane/H) (1) (wherein, E_glue (MPa): storage modulus of adhesive layer, I_glue (mm): average thickness of adhesive layer, E_membrane (MPa): storage modulus of sheet section and projections, and H (mm): average height of sheet section and projections).

Claims (55)

1. A sound insulating structure, comprising, at least:

a sound insulating member that comprises a sheet-like sheet section and plural projections arranged on one side of the sheet section; and

an adhesive layer arranged on a surface of the sheet section on the opposite side of the side provided with the projections, and

an adherend to which the sound insulating member is adhered via the adhesive layer,

wherein

a storage modulus of the adherend is not less than 500 MPa,

the adherend includes:

at least one selected from the group consisting of polyacetal (POM), polyamide (PA), polycarbonate (PC), modified polyphenylene ether (m-PPE), polybutylene terephthalate (PBT), ultrahigh-molecular-weight polyethylene (UHPE), syndiotactic polystyrene (SPS), amorphous polyarylate (PAR), polysulfone (PSF), polyether sulfone (PES), polyphenylene sulfide (PPS), polyether ketone (PEEK), polyimide (PI), polyether imide (PEI), fluororesins (fluorocarbon polymers), and liquid crystal polymers (LCP), and/or

at least one metal selected from the group consisting of aluminum, iron, stainless steel and alloys thereof,

the sound insulating structure satisfies the following Formula (1):

E _glue/ I _glue>0.5×( E _membrane/ H )  (1)

E_glue (MPa): storage modulus of adhesive layer

I_glue (mm): average thickness of adhesive layer

E_membrane (MPa): storage modulus of sheet section and projections

H (mm): average height of sheet section and projections, and

the E glue (MPa) of the storage modulus of adhesive layer and the E membrane (MPa) of storage modulus of sheet section and projections are measured in a measurement atmosphere having a temperature of 23° C. and a humidity of 50% RH.

2. The sound insulating structure according to claim 1 ,

wherein an amount of normalized natural frequency shift satisfying the following formula is 0 to 30%:

Amount of normalized natural frequency shift (%)=((Design natural frequency)−(Natural frequency))÷(Design natural frequency)

Design natural frequency (Hz): natural frequency determined in a condition without adhesive layer

Natural frequency (Hz): natural frequency determined in a condition with adhesive layer.

3. The sound insulating structure according to claim 1 ,

wherein the adhesive layer has an elastic modulus of more than 10 MPa.

4. The sound insulating structure according to claim 1 , satisfying the following Formulae (2) and (3):

7,000 ≥E _glue/ E _membrane≥0.5  (2)

50.0 ≥E _glue/ E _adh≥0.00002  (3)

E_glue (MPa): storage modulus of adhesive layer

E_membrane (MPa): storage modulus of sheet section and projections

E_adh (MPa): storage modulus of adherend.

5. The sound insulating structure according to claim 1 , satisfying the following Formula (4):

1.0≥ I _glue≥0.005  (4)

I_glue (mm): average thickness of adhesive layer.

6. The sound insulating structure according to claim 1 , wherein Formula (1) satisfies the following Formula (1)′:

E _glue/ I _glue>β×( E _membrane/ H )  (1)′

wherein, E_glue, I_glue, E_membrane, and H have the same meanings as in Formula (1), and β=5.

7. The sound insulating structure according to claim 1 , wherein the E_glue is more than 10 MPa.

8. The sound insulating structure according to claim 1 , wherein

the adhesive layer comprises one or more resins selected from the group consisting of silicone resins, epoxy resins, and cyanoacrylate resins, and

a total content ratio of these resins in the adhesive layer is 10% by weight or more.

9. The sound insulating structure according to claim 1 , wherein

the adhesive layer comprises an inorganic filler, and

a content ratio of the inorganic filler in the adhesive layer is 1% by weight or more.

10. A method of producing the sound insulating structure according to claim 1 ,

the method comprises:

forming the sound insulating member having plural projections on the one side of the sheet section; and

arranging the adhesive layer on the sound insulating member, and

arranging the adherend to which the sound insulating member is adhered via the adhesive layer.

11. The sound insulating structure according to claim 1 , wherein the adherend is not a part of another sound insulating member.

12. The sound insulating structure according to claim 1 , wherein the adhesive layer adheres to a product or component to be sound-insulated.

13. The sound insulating structure according to claim 1 , wherein the adhesive layer comprises silicone resin.

14. The sound insulating structure according to claim 1 , wherein the adhesive layer comprises cyanoacrylate resin.

15. The sound insulating structure according to claim 1 , wherein the adherend includes polyacetal (POM).

16. The sound insulating structure according to claim 1 , wherein the adherend includes polyamide (PA).

17. The sound insulating structure according to claim 1 , wherein the adherend includes polycarbonate (PC).

18. The sound insulating structure according to claim 1 , wherein the adherend includes modified polyphenylene ether (m-PPE).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2022
From: UCHIDA, NAOYUKI; INOUE, KAZUMA; NAKAYAMA, MASANARI
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 060319/0174 →
Priority Claims (1)
JP 2019-239424 · Dec 27, 2019 · national
Continuity (2)
Continuation PCTJP2020049129 · Dec 28, 2020
Related Publication 20220333372A1 · Oct 20, 2022
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