Optical diffuser and its method of manufacture
Methods of manufacture of an optical diffuser. In one embodiment, an optical diffuser is formed by providing a wafer including a silicon slice of which an upper face is covered with a first layer made of a first material itself covered with a second layer made of a second selectively etchable material with respect to the first material. The method further includes forming openings in the second layer extending up to the first layer and filling the openings in the second layer with a third material. The method yet further includes bonding a glass substrate to the wafer on the side of its upper face and removing the silicon slice.
1. A method of forming an optical passive device, comprising:
forming a first layer, which includes a first material, on a wafer;
forming a second layer, which includes a second material, on the first layer;
forming a masking layer on the second layer, the masking layer having a plurality of openings;
forming a plurality of openings in the second layer through the plurality of openings in the masking layer;
filling the plurality of openings in the second layer with a third layer, which includes a third material;
forming a fourth layer, which includes the second material, on masking layer, the fourth layer having a plurality of openings; and
filling the plurality of openings in the fourth layer with a fifth layer, which includes the third material.
2. The method of claim 1 , further comprising:
forming sixth layer, which include the first material, on the fourth and fifth layers.
3. The method of claim 2 , further comprising:
bonding, while the first, second, masking, third, fourth, fifth, and sixth layers are physically coupled to the wafer, a glass substrate to the sixth layer.
4. The method of claim 3 , further comprising:
removing the wafer from the first layer.
5. The method of claim 3 , further comprising:
thinning the glass substrate.
6. The method of claim 3 , further comprising:
forming an adhesive film on the glass substrate.
7. The method of claim 1 wherein the first material includes silicon oxide, the second material includes silicon nitride, and the third material includes polycrystalline or amorphous silicon.
8. The method of claim 1 wherein at least one of the plurality of openings in the second layer has a shape that lacks symmetry, and at least one of the plurality of openings in the fourth layer has a shape that lacks symmetry.
9. The method of claim 1 wherein the masking layer includes the first material.
10. An optical passive device, comprising:
a first layer of a first material;
a second layer, which includes a second material, on the first layer, the second layer having a plurality of openings;
a masking layer on the second layer, the masking layer having a plurality of openings;
a third layer, which includes a third material, in the plurality of openings in the second layer;
a fourth layer, which includes the second material, on masking layer, the fourth layer having a plurality of openings; and
a fifth layer, which includes the third material, in the plurality of openings in the fourth layer.
11. The optical passive device of claim 10 wherein the plurality of openings in the masking layer and the plurality of openings in the second layer are aligned with each other.
12. The optical passive device of claim 10 , further comprising:
a sixth layer, which include the first material, on the fourth and fifth layers.
13. The optical passive device of claim 12 , further comprising:
a glass substrate on the sixth layer.
14. The optical passive device of claim 10 wherein the first material includes silicon oxide, the second material includes silicon nitride, and the third material includes polycrystalline or amorphous silicon.
15. The optical passive device of claim 10 wherein at least one of the plurality of openings in the second layer has a shape that lacks symmetry, and at least one of the plurality of openings in the fourth layer has a shape that lacks symmetry.
16. The optical passive device of claim 10 wherein the masking layer includes the first material.
17. A method, comprising:
forming a first layer, which includes a first material;
forming a second layer, which includes a second material, on the first layer;
forming a plurality of openings in the second layer with a masking layer;
forming a third layer, which includes a third material, in the plurality of openings in the second layer;
forming a fourth layer, which includes the second material, on masking layer, the fourth layer having a plurality of openings; and
forming a fifth layer, which includes the third material, in the plurality of openings in the fourth layer.
18. The method of claim 17 , further comprising:
forming sixth layer, which include the first material, on the fourth and fifth layers; and
bonding a glass substrate to the sixth layer.
19. The method of claim 17 wherein at least one of the plurality of openings in the second layer has a shape that lacks symmetry, and at least one of the plurality of openings in the fourth layer has a shape that lacks symmetry.
20. The method of claim 17 wherein the first material includes silicon oxide, the second material includes silicon nitride, and the third material includes polycrystalline or amorphous silicon.