IP Library › Granted Patent US 12,360,867
Granted Patent B2
US 12,360,867 · App. 18/437,707 · Granted Jul 15, 2025

Memory fault recovery method and system, and memory

Inventors: Yangbin Diao (Chengdu, CN); Lei Yuan (Chengdu, CN); Hua Chen (Dongguan, CN); Yonggui Liang (Shenzhen, CN)
Assignee: HUAWEI TECHNOLOGIES CO., LTD.
G06F11/2094
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Quick Facts
Patent No.
US 12,360,867
App. No.
18/437,707
Granted
Jul 15, 2025
Kind
B2
Abstract

A system includes a processor and a memory. The processor locates a first memory chip that is faulty in a memory. After the first memory chip is isolated or replaced, the processor may reset the first memory chip when other memory chips in the memory are maintained to work normally. When a fault occurs in a memory chip in the memory, after the first memory chip that is faulty is isolated or replaced, the processor may independently reset the first memory chip without affecting the other memory chips in the memory. Resetting the first memory chip enables the first memory chip to restore to normal. A memory chip that can be normally used is used as a redundant memory chip or may continue to be used.

Claims (37)

1. A method comprising:

locating, by a processor, a first memory chip that is faulty in a memory system;

isolating or replacing the first memory chip; and

resetting, by the processor after isolating or replacing the first memory chip, the first memory chip when second memory chips in the memory system continue to work normally.

2. The method of claim 1 , wherein the first memory chip comprises:

sending, by the processor and to a chip reset circuit, a reset instruction instructing to reset the first memory chip; and

performing, by the chip reset circuit and based on the reset instruction, an operation on a reset pin of the first memory chip, to reset the first memory chip.

3. The method of claim 1 , further comprising further isolating or replacing, by a memory controller, the first memory chip.

4. The method of claim 3 , further comprising further replacing, by the memory controller, the first memory chip with a third memory chip in the second memory chips.

5. The method of claim 4 , wherein resetting the first memory chip, the method further comprises instructing, by the processor, the memory controller to migrate data of the third memory chip back to the first memory chip and replace the third memory chip with the first memory chip.

6. The method of claim 3 , wherein after isolating the first memory chip and resetting the first memory chip, the method further comprises instructing, by the processor, the memory controller to de-isolate the first memory chip.

7. The method of claim 1 , wherein after resetting the first memory chip, the method further comprises:

locating, by the processor, a third memory chip that is faulty in the memory system; and

instructing, by the processor, a memory controller to replace the third memory chip with the first memory chip.

8. The method of claim 1 , wherein after resetting the first memory chip, the method further comprises performing, by the processor and using a memory controller, data writing and reading on the first memory chip to determine that the first memory chip is working normally.

9. A system comprising:

a memory system comprising a first memory chip and second memory chips; and

a processor is coupled to the memory system and configured to:

locate the first memory chip that is faulty; and

reset, after the first memory chip is isolated or replaced, the first memory chip when the second memory chips continue to work normally.

10. The system of claim 9 , wherein the first memory chip comprises a first reset pin, wherein the system further comprises a chip reset circuit, wherein the processor is further coupled to the first reset pin using the chip reset circuit, wherein the processor is further configured to send to the chip reset circuit, a reset instruction instructing to reset the first memory chip, and wherein the chip reset circuit is configured to perform, based on the reset instruction, an operation on the first reset pin to reset the first memory chip.

11. The system of claim 10 , wherein the second memory chips comprise second reset pins, wherein the chip reset circuit is a serial-to-parallel conversion circuit, and wherein the chip reset circuit is connected to the first reset pin and the second reset pins.

12. The system of claim 9 , further comprising a memory controller coupled to the memory system and configured to replace or isolate the first memory chip.

13. The system of claim 12 , wherein the memory controller is further configured to further replace the first memory chip with a third memory chip in the second memory chips.

14. The system of claim 13 , wherein after resetting the first memory chip, the processor is further configured to instruct the memory controller to migrate data of the third memory chip back to the first memory chip and replace the third memory chip with the first memory chip.

15. The system of claim 12 , wherein after the memory controller isolates the first memory chip and the processor resets the first memory chip, the processor is further configured to instruct the memory controller to de-isolate the first memory chip.

16. The system of claim 9 , further comprising a memory controller, wherein after the processor resets the first memory chip, the processor is further configured to:

locate a third memory chip that is faulty in the memory system; and

instruct the memory controller to replace the third memory chip with the first memory chip.

17. The system of claim 9 , further comprising a memory controller coupled to the memory system, and wherein after resetting the first memory chip, the processor is further configured to perform, on the first memory chip and using the memory controller, data writing and reading to determine that the first memory chip is working normally.

18. A memory system comprising:

memory chips comprising a first memory chip and second memory chips; and

a chip reset circuit coupled to the and configured to:

receive a reset instruction instructing to reset the first memory chip, and

reset the first memory chip based on the reset instruction when the second memory chips are working normally.

19. The memory system of claim 18 , wherein the chip reset circuit is further configured to further reset the first memory chip by performing an operation on a reset pin of the first memory chip.

20. The memory system of claim 18 , wherein the chip reset circuit is a serial-to-parallel conversion circuit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2025
From: DIAO, YANGBIN; YUAN, LEI; CHEN, HUA; LIANG, YONGGUI
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 070983/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2025
From: GEPNER, ADAM
To: WISCONSIN ALUMNI RESEARCH FOUNDATION; UNITED STATES GOVERNMENT AS REPRESENTED BY THE DEPARTMENT OF VETERANS AFFAIRS
Reel/Frame 070191/0360 →
Priority Claims (2)
CN 202110943369.6 · Aug 17, 2021 · national
CN 202210214956.6 · Mar 7, 2022 · national
Continuity (2)
Continuation PCTCN2022092017 · May 10, 2022
Related Publication 20240176714A1 · May 30, 2024
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