IP Library › Granted Patent US 12,361,246
Granted Patent B2
US 12,361,246 · App. 17/966,586 · Granted Jul 15, 2025

RFID yarn module and method for making the same

Inventors: Chong En Dai (Taichung, TW); Cheng Hung Chang (Taichung, TW)
Assignee: Securitag Assembly Group Co., Ltd.
G06K19/027G06K19/0723G06K19/07718G06K19/07722
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Quick Facts
Patent No.
US 12,361,246
App. No.
17/966,586
Granted
Jul 15, 2025
Kind
B2
Abstract

The present invention provides an RFID yarn module comprising a polymer substrate having a first surface and a second surface opposite to the first surface, a metal layer, and a first adhesive layer formed on the metal layer, and a first polymer material layer formed on the first the adhesive layer, a second adhesive layer, and a first protection layer. The metal layer is formed on the first surface of the polymer substrate and has an RFID element electrically connected to the metal layer. The second adhesive layer is formed on the first polymer material layer and is corresponding to the RFID element. The first protection layer is formed on the second adhesive layer. Alternatively, the present invention provides a method for making the RFID yarn module in which a roll-to-roll process for mass manufacturing is utilized to make the RFID yarn module.

Claims (17)

1. An RFID yarn module, comprising:

a polymer substrate, configured to have a first surface and a second surface opposite to the first surface;

a metal layer, formed on the first surface of the polymer substrate;

an RFID element, disposed on and electrically connected to the metal layer;

a first adhesive layer, formed on the metal layer;

a first polymer layer, formed on the first adhesive layer and the RFID element;

a second adhesive layer, formed on the first polymer layer and spatially corresponding to the RFID element; and

a first protection layer, formed on the second adhesive layer.

2. The module of claim 1 , further comprising:

a third adhesive layer, formed on the second surface of the polymer substrate;

a second polymer layer, formed on the third adhesive layer;

a fourth adhesive layer, formed on the second polymer layer, and is spatially corresponding to the RFID element; and

a second protection layer, formed on the fourth adhesive layer.

3. The module of claim 2 , wherein the first polymer layer, the second polymer layer, the third polymer layer and the fourth polymer layer are respectively a PET layer.

4. The module of claim 2 , further comprising a yarn-woven layer wrapped around the polymer substrate, the metal layer, the RFID element, the first adhesive layer, the first polymer layer, the second adhesive layer, the first protection layer, the third adhesive layer, the second polymer layer, the fourth adhesive layer, and the second protection layer.

5. The module of claim 1 , further comprising a yarn-woven layer wrapped around the polymer substrate, the metal layer, the RFID element, the first adhesive layer, the first polymer layer, the second adhesive layer, and the first protection layer.

6. The module of claim 1 , wherein the first adhesive layer is surrounding the RFID element or covered onto the RFID element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2022
From: DAI, CHONG EN; CHANG, CHENG HUNG
To: SECURITAG ASSEMBLY GROUP CO., LTD
Reel/Frame 061430/0654 →
Priority Claims (1)
TW 111124965 · Jul 4, 2022 · national
Continuity (1)
Related Publication 20240005120A1 · Jan 4, 2024
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