IP Library › Granted Patent US 12,362,469
Granted Patent B2
US 12,362,469 · App. 18/340,124 · Granted Jul 15, 2025

Antenna device

Inventor: Hsien-Te Chen (Taipei, TW)
Assignee: PANELSEMI CORPORATION
H01Q1/38
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Quick Facts
Patent No.
US 12,362,469
App. No.
18/340,124
Granted
Jul 15, 2025
Kind
B2
Abstract

An antenna device includes a first substrate, plural antenna elements, a second substrate, plural circuit units, plural circuit patterned layers and plural conductive structures. The first substrate is defined with a first surface and a second surface opposite to each other. The antenna elements are arranged on the first surface of the first substrate. The second substrate is connected to the second surface of the first substrate. The circuit units are arranged at the second substrate. The circuit patterned layers are arranged on the first substrate and the second substrate. The conductive structures are connected to at least ones of the circuit patterned layers. One of the circuit patterned layers includes plural induction units corresponding to the antenna elements, at least ones of the circuit units correspond to the induction units, and the induction units and the antenna elements transmit a carrier signal to each other by electromagnetic induction.

Claims (17)

1. An antenna device, comprising:

a first substrate defined with a first surface and a second surface opposite to each other;

a plurality of antenna elements arranged on the first surface of the first substrate;

a second substrate connected to the second surface of the first substrate;

a plurality of circuit units arranged at the second substrate;

a plurality of circuit patterned layers arranged on the first substrate and the second substrate; and

a plurality of conductive structures connected to at least ones of the circuit patterned layers;

wherein one of the circuit patterned layers comprises a plurality of induction units corresponding to the antenna elements, at least ones of the circuit units correspond to the induction units, and the induction units and the antenna elements transmit a carrier signal to each other by electromagnetic induction.

2. The antenna device of claim 1 , wherein the first substrate is a multi-layer substrate structure.

3. The antenna device of claim 1 , wherein the first substrate comprises glass, polytetrafluoroethene, ceramic materials, polyphenylene oxide, or a combination of any of the above materials.

4. The antenna device of claim 1 , wherein the second substrate is a single-layer substrate structure.

5. The antenna device of claim 1 , wherein the second substrate is made of polyimide or polyphenylene oxide.

6. The antenna device of claim 1 , wherein the circuit units arranged at the second substrate comprise a plurality of thin-film transistors, and the thin-film transistors are electrically connected to one of the circuit patterned layers arranged on the second substrate.

7. The antenna device of claim 1 , wherein ones of the circuit patterned layers are arranged on the second substrate, and a plurality of insulation layer are arranged between the circuit patterned layers.

8. The antenna device of claim 1 , wherein the carrier signal defines a carrier frequency, and the carrier frequency is not less than 10 GHz.

9. The antenna device of claim 1 , wherein each of the conductive structures defines a hole and comprises a conductive member arranged in the hole.

10. The antenna device of claim 1 , wherein an adhesive layer is provided between the first substrate and the second substrate for adhering the first substrate and the second substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2023
From: CHEN, HSIEN-TE
To: PANELSEMI CORPORATION
Reel/Frame 065061/0001 →
Priority Claims (1)
TW 111123737 · Jun 24, 2022 · national
Continuity (1)
Related Publication 20230420832A1 · Dec 28, 2023
References Cited (3)
US 20190319349A1 · Loeher · 2019 [cited by examiner]
US 20200328167A1 · Chang Chien · 2020 [cited by examiner]
US 20240022004A1 · Sakurai · 2024 [cited by examiner]