Liquid-cooling devices, and systems, to cool multi-chip modules
A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.
1. A cold plate assembly for cooling a multi-chip module, the cold plate assembly comprising:
a cold plate defining an internal passage for a flow of coolant to pass therethrough, the cold plate defining an external surface configured to be placed in thermal contact with a corresponding surface of a multi-chip module;
a thermal-interface material to span from the external surface of the cold plate to the corresponding surface of the multi-chip module;
a U-shaped retainer so sized relative to the multi-chip module, the cold plate, and the thermal-interface material as to urge the multi-chip module and the cold plate toward each other and to compress the thermal-interface material therebetween when the U-shaped retainer is installed over the multi-chip module and the cold plate.
2. The cold plate assembly according to claim 1 , wherein the multi-chip module is a first multi-chip module and wherein the external surface of the cold plate is further configured to be placed in thermal contact with a corresponding surface of a second multi-chip module.
3. The cold plate assembly according to claim 2 , wherein the U-shaped retainer is so sized relative to the first multi-chip module, the second multi-chip and the thermal-interface material as to urge the first multi-chip module and the second multi-chip module toward the cold plate when the U-shaped retainer is installed over the first multi-chip module and the second multi-chip module.
4. The cold plate assembly according to claim 3 , wherein the U-shaped retainer is configured to be placed in thermal contact with the cold plate when the U-shaped retainer is installed over the first multi-chip module and the second multi-chip module.
5. The cold plate assembly according to claim 2 , wherein the external surface of the cold plate defines a first major surface and a second major surface, wherein the first major surface and the second major surface are positioned opposite each other relative to the internal passage such that the internal passage is positioned therebetween, wherein the first major surface is configured to be placed in thermal contact with the first multi-chip module and wherein the second major surface is configured to be placed in thermal contact with the second multi-chip module.
6. The cold plate assembly according to claim 5 , wherein the thermal-interface material is a first thermal-interface material, the cold plate assembly further comprising a second thermal-interface material to span from the second major surface to the second multi-chip module.
7. The cold plate assembly according to claim 1 , wherein the thermal-interface material is a first thermal-interface material, the cold plate assembly further comprising a second thermal-interface material to span from the U-shaped retainer to the multi-chip module when the U-shaped retainer is installed over the multi-chip module and the cold plate.
8. The cold plate assembly according to claim 1 , wherein the internal passage extends from a first open end of the cold plate to an opposed second open end, wherein the external surface extends from the first open end to the opposed second open end and defines a flat thermal-contact region positioned between the first open end and the opposed second open end.