Sensor die package
View Patent ↗The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.
1. A device, comprising:
a die including:
a sensor on a first surface of the die;
a first contact pad adjacent to the sensor; and
a second contact pad spaced further from the sensor than the first contact pad;
a transparent layer on the first surface of the die, the transparent layer having:
an exterior facing surface opposite the first surface of the die; and
a first sidewall transverse the exterior facing surface;
a molding compound around the die and the transparent layer, the molding compound having an outer surface that is further from the sensor than the exterior facing surface of the transparent layer, the first sidewall of the transparent layer contacting the molding compound;
a non-conductive layer including a plurality of stacked non-conductive layers, the non-conductive layer having:
a second surface coplanar with the molding compound;
a third surface coplanar with the transparent layer;
a fourth surface opposite the second and third surfaces;
a first thickness between the second and fourth surfaces; and
a second thickness between the third and fourth surfaces, the first thickness is less than the second thickness; and
a conductive structure extending from the second contact pad through the transparent layer to the non-conductive layer.
2. The device of claim 1 , further comprising:
a conductive layer extending through the non-conductive layer and coupled to the conductive structure, the conductive layer overlapping the exterior facing surface of the transparent layer, the non-conductive layer partially covers the exterior facing surface of the transparent layer and is on the outer surface of the molding compound.
3. The device of claim 2 , further comprising a bond pad coupled to the conductive layer, the bond pad overlapping the exterior facing surface of the transparent layer.
4. The device of claim 2 , further comprising an opening in the non-conductive layer partially exposing the exterior facing surface of the transparent layer.
5. The device of claim 4 , wherein the transparent layer has a second sidewall opposite to the first sidewall, a first dimension along a first direction between the first and second sidewalls, the first dimension being greater than a second dimension of the opening along the first direction.
6. The device of claim 1 , further comprising a conductive layer extending into a fifth surface of the die opposite the first surface of the die, the conductive layer being coupled to second the contact pad.
7. A device, comprising:
a die including:
a first surface and a second surface opposite to the first surface;
a plurality of first sidewalls that extend from the first surface to the second surface;
a sensor at the first surface, the sensor having a first dimension that extends in a first direction transverse to the plurality of first sidewalls; and
a conductive pad at the first surface;
a transparent layer on the first surface, the transparent layer having a second dimension extending in the first direction greater than the first dimension, and the transparent layer having a plurality of second sidewalls;
a molding compound on the plurality of first sidewalls of the die and on the plurality of second sidewalls of the transparent layer;
a non-conductive layer on and coplanar with the molding compound and the transparent layer, the non-conductive layer having a first thickness less than a second thickness, the first thickness being on the molding compound and the second thickness being on the transparent layer; and
a conductive structure extends into the transparent layer to the conductive pad.
8. The device of claim 7 , wherein the plurality of first sidewalls of the die are coplanar with the plurality of second sidewalls of the transparent layer.
9. The device of claim 7 , further comprising:
an opening that extends through the non-conductive layer to the transparent layer, the opening having a third dimension extending in the first direction greater than the first dimension and less than the second dimension.
10. The device of claim 7 , wherein:
the molding compound includes:
a third surface coplanar with the second surface of the die,
a fourth surface opposite to the first surface, and
a third dimension that extends in a second direction directed from the third surface to the fourth surface; and
the transparent layer includes a fifth surface opposite the first surface of the die, a fourth dimension that extends in the second direction between the fifth surface of the transparent layer and the second surface of the die, the fourth dimension being less than the third dimension.
11. A device, comprising:
a die including:
a first surface and a second surface opposite to the first surface;
a plurality of first sidewalls that extend from the first surface to the second surface;
a contact pad at the first surface of the die; and
a sensor at the first surface of the die;
a transparent layer on the first surface of the die, the transparent layer includes:
a third surface on the first surface of the die and on the sensor;
a fourth surface opposite the third surface and facing away from die; and
a plurality of second sidewalls that that extend from the third surface to the fourth surface;
a conductive structure extending into the fourth surface of the transparent layer to the contact pad at the first surface of the die;
a molding compound is on and covers the plurality of first sidewalls and the plurality of second sidewalls;
at least one non-conductive layer stacked on the molding compound and the fourth surface of the transparent layer, the at least one non-conductive layer having a fifth surface opposite the first surface of the die, a first thickness between the fifth surface and the molding compound is less than a second thickness between the fifth surface and the transparent layer;
an insulating layer extends into the second surface to the contact pad of the die; and
an electrical via extends into the insulating layer to the contact pad and is coupled to the contact pad of the die.
12. The device of claim 11 , wherein the plurality of first sidewalls is coplanar with the plurality of second sidewalls.
13. The device of claim 11 , further comprising an opening extending into and through the at least one non-conductive layer to the fourth surface of the transparent layer, the opening being aligned with the sensor at the first surface of the die.
14. The device of claim 13 , wherein:
the sensor has a first dimension extending in a first direction directed from respective opposite second sidewalls of the plurality of second sidewalls; and
the opening has a second dimension extending in the first direction, the second dimension being greater than the first dimension.
15. The device of claim 13 , wherein the opening fully and completely overlaps the sensor.
16. The device of claim 11 , further comprising a bond pad that is electrically coupled to the conductive structure and is on the at least one non-conductive layer.
17. The device of claim 16 , further comprising:
a first solder ball coupled to an exposed portion of the electrical via exposed from the insulating layer; and
a second solder ball coupled to the bond pad.
18. The device of claim 11 , wherein a plurality of third sidewalls of the at least one non-conductive layer are spaced inward from a plurality of fourth sidewalls of the molding compound.
19. The device of claim 11 , wherein the at least one non-conductive layer includes a plurality of stacked non-conductive layers.