Infrared device and method for manufacturing the same
An infrared device is provided. The infrared device includes a substrate, a metal layer, a first semiconductor layer, an absorber layer, and a second semiconductor layer. The metal layer is disposed on the substrate. The first semiconductor layer is disposed on the substrate and electrically connected to the metal layer. A cavity is formed between the first semiconductor layer and the metal layer. The absorber layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the absorber layer and electrically connected to the first semiconductor layer. The TCR of the first semiconductor layer is different from that of the second semiconductor layer.
1. An infrared device, comprising:
a substrate;
a metal layer disposed on the substrate;
a first semiconductor layer disposed on the substrate, wherein a cavity is formed between the first semiconductor layer and the metal layer, and the first semiconductor layer is electrically connected to the metal layer;
an absorber layer disposed on the first semiconductor layer; and
a second semiconductor layer disposed on the absorber layer and electrically connected to the first semiconductor layer, wherein a temperature coefficient of resistance (TCR) of the first semiconductor layer is different from that of the second semiconductor layer.
2. The infrared device as claimed in claim 1 , wherein the first semiconductor layer and the second semiconductor layer comprise silicon germanium (SiGe).
3. The infrared device as claimed in claim 1 , wherein the temperature coefficient of resistance (TCR) of the first semiconductor layer is smaller than that of the second semiconductor layer.
4. The infrared device as claimed in claim 3 , wherein the temperature coefficient of resistance (TCR) of the second semiconductor layer is 20 to 40 times that of the first semiconductor layer.
5. The infrared device as claimed in claim 1 , wherein the absorber layer comprises silicon oxide, silicon nitride or silicon oxynitride.
6. The infrared device as claimed in claim 1 , further comprising a third semiconductor layer disposed on the second semiconductor layer.
7. The infrared device as claimed in claim 6 , wherein a total temperature coefficient of resistance (TCR) of the second semiconductor layer and the third semiconductor layer is 20 to 40 times the temperature coefficient of resistance (TCR) of the first semiconductor layer.
8. An infrared device, comprising:
a substrate;
a metal layer disposed on the substrate;
a first silicon-germanium layer disposed on the substrate, wherein a cavity is formed between the first silicon-germanium layer and the metal layer, and the first silicon-germanium layer is electrically connected to the metal layer;
an absorber layer disposed on the first silicon-germanium layer; and
a second silicon-germanium layer disposed on the absorber layer and electrically connected to the first silicon-germanium layer, wherein a temperature coefficient of resistance (TCR) of the first silicon-germanium layer is different from that of the second silicon-germanium layer.
9. The infrared device as claimed in claim 8 , wherein the temperature coefficient of resistance (TCR) of the first silicon-germanium layer is smaller than that of the second silicon-germanium layer.
10. The infrared device as claimed in claim 9 , wherein the temperature coefficient of resistance (TCR) of the second silicon-germanium layer is 20 to 40 times that of the first silicon-germanium layer.
11. The infrared device as claimed in claim 8 , further comprising a third silicon-germanium layer disposed on the second silicon-germanium layer.
12. The infrared device as claimed in claim 11 , wherein a total temperature coefficient of resistance (TCR) of the second silicon-germanium layer and the third silicon-germanium layer is 20 to 40 times the temperature coefficient of resistance (TCR) of the first silicon-germanium layer.
13. A method for manufacturing an infrared device, comprising:
providing a substrate;
forming a metal layer on the substrate;
forming a sacrificial layer on the metal layer;
forming a first silicon-germanium layer on the sacrificial layer and electrically connected to the metal layer;
forming an absorber layer on the first silicon-germanium layer;
forming a second silicon-germanium layer on the absorber layer and electrically connected to the first silicon-germanium layer, wherein a temperature coefficient of resistance (TCR) of the first silicon-germanium layer is different from that of the second silicon-germanium layer; and
removing the sacrificial layer to form a cavity between the first silicon-germanium layer and the metal layer.
14. The method for manufacturing an infrared device as claimed in claim 13 , wherein the step of forming the first silicon-germanium layer is performed at a temperature that is between 400° C. and 470° C.
15. The method for manufacturing an infrared device as claimed in claim 13 , wherein a flow rate of silane (SiH 4 ) gas in the step of forming the first silicon-germanium layer is between 5 sccm and 50 sccm.
16. The method for manufacturing an infrared device as claimed in claim 13 , wherein a flow rate of germane (GeH 4 ) gas in the step of forming the first silicon-germanium layer is between 1 sccm and 12 sccm.
17. The method for manufacturing an infrared device as claimed in claim 13 , wherein the step of forming the second silicon-germanium layer is performed at a temperature that is between 350° C. and 420° C.
18. The method for manufacturing an infrared device as claimed in claim 13 , wherein a flow rate of silane (SiH 4 ) gas in the step of forming the second silicon-germanium layer is between 20 sccm and 200 sccm.
19. The method for manufacturing an infrared device as claimed in claim 13 , wherein a flow rate of germane (GeH 4 ) gas in the step of forming the second silicon-germanium layer is between 2 sccm and 40 sccm.
20. The method for manufacturing an infrared device as claimed in claim 13 , further comprising forming a third silicon-germanium layer on the second silicon-germanium layer.