IP Library › Granted Patent US 12,367,916
Granted Patent B2
US 12,367,916 · App. 17/954,860 · Granted Jul 22, 2025

Encoders, decoders, and semiconductor memory devices including the same

Inventor: Byongmo Moon (Seoul, KR)
Assignee: Samsung Electronics Co., Ltd.
G11C7/222G11C7/1039G11C7/106G11C7/1087G11C7/1096G11C11/4074G11C11/4085
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Quick Facts
Patent No.
US 12,367,916
App. No.
17/954,860
Granted
Jul 22, 2025
Kind
B2
Abstract

An encoder includes an encoding unit configured to receive 2n-bit read data and to generate 2m-bit read data, and an output driver configured to input m-bit first read data of the 2m-bit read data, to transmit voltage and/or current a first number of times corresponding to a number of first bits indicating a first state included in the m-bit first read data or to transmit current corresponding to the number of first bits during an activation period of a clock signal, and to transmit the voltage and/or the current a second number of times corresponding to a number of second bits indicating the first state included in m-bit second read data of the 2m-bit read data or to transmit current corresponding to the number of second bits during a deactivation period of the clock signal, wherein n is at least 2 and m is at least 3.

Claims (17)

1. A semiconductor memory device comprising:

a row decoder configured to generate a plurality of word line selection signals in response to a row address;

a column decoder configured to generate a plurality of column selection signals in response to a column address;

a memory cell array comprising a plurality of memory cells, and configured to generate multi-bit read data from selected memory cells among the plurality of memory cells in response to the plurality of word line selection signals and the plurality of column selection signals and/or to store multi-bit write data from the selected memory cells;

a read path unit configured to receive the multi-bit read data and to generate 2n-bit read data during a read operation; and

a decoder configured to detect, during a write operation, a first level of a current and/or a voltage received during an activation period of a clock signal an output a first write level, to detect a second level of a current and/or a voltage received during a deactivation period of the clock signal and output a second write level, to generate n-bit first write data of 2n-bit write data using the first write level, and to generate n-bit second write data of the 2n-bit write data using the second write level; and

a write path unit configured to receive the n-bit first write data and the n-bit second write data to generate multi-bit write data,

wherein each of the first write level and the second write level is one of at least three different levels.

2. The semiconductor memory device of claim 1 , wherein the decoder comprises:

an input driver configured to detect the first level of the current and/or the voltage received during the activation period of the clock signal to output the first write level and to detect the second level of the current and/or the voltage received during the deactivation period of the clock signal to output the second write level; and

a decoding unit configured to generate the n-bit first write data of the 2n-bit write data using the first write level and to generate the n-bit second write data of the 2n-bit write data using the second write level.

3. The semiconductor memory device of claim 2 , wherein the input driver comprises a level detector configured to accumulate the current and/or the voltage received during the activation period of the clock signal to detect the first write level and to accumulate the current and/or the voltage received during the deactivation period of the clock signal to detect the second write level.

4. The decoder of claim 3 , wherein the level detector comprises an integrator or a differentiator.

5. The semiconductor memory device of claim 4 , wherein the decoding unit comprises:

a reference voltage generator configured to generate m different reference voltages;

a comparator configured to compare the first write level with the m reference voltages to generate the n-bit first write data and to compare the second write level with the m reference voltages to generate the n-bit second write data; and

a latch unit configured to latch the n-bit first write data and the n-bit second write data in response to the clock signal to output 2n-bit write data.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2025
From: MOON, BYONGMO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 072166/0976 →
Priority Claims (1)
KR 10-2019-0144885 · Nov 13, 2019 · national
Continuity (2)
Division 16909177 · Jun 23, 2020
Related Publication 20230018451A1 · Jan 19, 2023
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