Granted Patent B2

US 12,368,069 · App. 18/626,565 · Granted Jul 22, 2025

Inventors: Kousei Ide (Kumamoto, JP); Naruaki Iida (Kumamoto, JP)

Assignee: TOKYO ELECTRON LIMITED

H01L21/68707B65G47/90H01L21/67178H01L21/67712

Abstract

Claims (28)

1. A substrate transfer device comprising:

a substrate holder configured to transfer a substrate to one of a plurality of processing modules that process the substrate;

a base provided to be connected to the substrate holder; and

a lift configured to move up and down the base,

wherein the lift includes:

a housing provided with a front space and a rear space that are partitioned by a partition plate in a front-rear direction, the partition plate including a hole formed at each of an upper end and a lower end of the rear space of the housing to communicate with the front space and the rear space, and a fan being provided at a position corresponding to the hole;

a plurality of rails and a plurality of seal belts provided in the front space of the housing, the plurality of rails and the plurality of seal belts being arranged side by side in a left-right direction and extending in a longitudinal direction,

a driver shared by the rails and configured to move up and down the base along an extending direction of each of the rails,

a slider provided in the front space of the housing and configured to move up and down while being supported by the lift and physically connected to the plurality of rails, and

a connecting member, and

wherein a portion of each of the plurality of seal belts is opened, and the slider and the base are connected to each other via the connecting member provided in the opening,

wherein the front space of the housing is partitioned into a first space, a second space and a third space, and the hole is provided corresponding to the first to the third spaces.

2. The substrate transfer device according to claim 1 , wherein

the plurality of processing modules include one processing module and another processing module that are transversely separated from each other, and

the lift is sandwiched between the one processing module and the another processing module.

3. A substrate transfer device comprising:

a substrate holder configured to transfer a substrate to one of a plurality of processing modules that process the substrate;

a base provided to be connected to the substrate holder; and

a lift configured to move up and down the base,

wherein the lift includes a housing including a front space and a rear space that are partitioned by a partition plate in a front-rear direction,

the partition plate includes a hole formed at each of an upper end and a lower end of the rear space of the housing to communicate with the front space and the rear space,

and a fan is provided at a position corresponding to the hole;

wherein the plurality of processing modules include one processing module and another processing module that are transversely separated from each other, and

the lift is sandwiched between the one processing module and the another processing module,

wherein the front space of the housing is partitioned into a first space, a second space and a third space, and the hole is provided corresponding to the first to the third spaces.

4. The substrate transfer device according to claim 3 , wherein

the plurality of processing modules include one processing module and another processing module that are arranged side by side in a transverse direction, and

auxiliary facilities are provided in a manner that the one processing module and the another processing module are sandwiched between the auxiliary facilities in a direction along which the one processing module and the another processing module are arranged side by side.

Assignments (1)

Priority Claims (2)

Continuity (3)

References Cited (12)