Acoustic wave filter with multiple acoustic wave devices on a subtrate
An acoustic wave filter includes a piezoelectric layer. A first acoustic wave device includes a portion of the piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion of the piezoelectric layer. Additional acoustic wave devices are coupled to the first acoustic wave device, the additional acoustic wave devices including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion of the piezoelectric layer. At least one of the plurality of multi-layer interdigital transducer electrodes includes a layer that is thinner than a corresponding layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.
1. An acoustic wave filter comprising:
a piezoelectric layer;
a first acoustic wave device including a first portion of the piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion; and
a plurality of additional acoustic wave devices coupled to the first acoustic wave device and including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion, at least one of the plurality of multi-layer interdigital transducer electrodes including a metal layer that is thinner than a corresponding metal layer of a same material of the first multi-layer interdigital transducer electrode, the metal layer being a top layer and having a greater density than any other metal layer of the first multi-layer interdigital transducer electrode, and the metal layer being a top layer and having a greater density than any other metal layer of said at least one of the plurality of multi-layer interdigital transducer electrode.
2. The acoustic wave filter of claim 1 wherein the plurality of additional acoustic wave devices define a multi-mode surface acoustic wave filter coupled to the acoustic wave device, the multi-mode surface acoustic wave filter including a plurality of multi-layer interdigital transducer electrodes longitudinally coupled to each other and including a metal layer that is a top layer of the plurality of multi-layer interdigital transducer electrodes and is thinner than said corresponding metal layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.
3. The acoustic wave filter of claim 1 wherein the first multi-layer interdigital transducer electrode and plurality of multi-layer interdigital transducer electrodes include a first layer of a first material density and the metal layer of a second material density that is greater than the first material density.
4. The acoustic wave filter of claim 1 wherein a thickness of the metal layer in a gap region of the first multi-layer interdigital transducer electrode is smaller than a thickness of the metal layer in a center region of the first multi-layer interdigital transducer electrode to thereby reduce a mass loading of the first multi-layer interdigital transducer electrode in the gap region.
5. The acoustic wave filter of claim 1 wherein the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes include a first bus bar, first fingers extending from the first bus bar, a second bus bar, and second fingers extending from the second bus bar.
6. The acoustic wave filter of claim 1 further comprising a temperature compensation layer disposed over the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes.
7. The acoustic wave filter of claim 6 further comprising a passivation layer disposed over the temperature compensation layer.
8. The acoustic wave filter of claim 1 further comprising a pair of mass loading strips disposed over each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes, an edge of the mass loading strips aligned with end regions of each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes.
9. A radio frequency module comprising:
a package substrate;
an acoustic wave filter configured to filter a radiofrequency signal and including a first acoustic wave device including a first portion of a piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion, and a plurality of additional acoustic wave devices coupled to the first acoustic wave device and including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion, at least one of the plurality of multi-layer interdigital transducer electrodes including a metal layer that is thinner than a corresponding metal layer of a same material of the first multi-layer interdigital transducer electrode, the metal layer being a top layer and having a greater density than any other metal layer of the first multi-layer interdigital transducer electrode, and the metal layer being a top layer and having a greater density than any other metal layer of said at least one of the plurality of multi-layer interdigital transducer electrode; and
additional circuitry, the acoustic wave filter and the additional circuitry disposed on the package substrate.
10. The radio frequency module of claim 9 wherein the plurality of additional acoustic wave devices define a multi-mode surface acoustic wave filter coupled to the acoustic wave device, the multi-mode surface acoustic wave filter including a plurality of multi-layer interdigital transducer electrodes longitudinally coupled to each other and including a metal layer that is a top layer of the plurality of multi-layer interdigital transducer electrodes and is thinner than said corresponding metal layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.
11. The radio frequency module of claim 9 wherein the first multi-layer interdigital transducer electrode and plurality of multi-layer interdigital transducer electrodes include a first layer of a first material density and the metal layer of a second material density that is greater than the first material density.
12. The radio frequency module of claim 11 wherein a thickness of the metal layer in a gap region of the first multi-layer interdigital transducer electrode is smaller than a thickness of the metal layer in a center region of the first multi-layer interdigital transducer electrode to thereby reduce a mass loading of the first multi-layer interdigital transducer electrode in the gap region.
13. The radio frequency module of claim 9 wherein the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes include a first bus bar, first fingers extending from the first bus bar, a second bus bar, and second fingers extending from the second bus bar.
14. The radio frequency module of claim 9 further comprising a pair of mass loading strips disposed over each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes, an edge of the mass loading strips aligned with end regions of each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes.
15. A wireless communication device comprising:
an antenna; and
a front end module including an acoustic wave filter configured to filter a radio frequency signal associated with the antenna, the acoustic wave filter including a first acoustic wave device including a first portion of a piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion, and a plurality of additional acoustic wave devices coupled to the first acoustic wave device and including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion, at least one of the plurality of multi-layer interdigital transducer electrodes including a metal layer that is thinner than a corresponding metal layer of a same material of the first multi-layer interdigital transducer electrode, the metal layer being a top layer and having a greater density than any other metal layer of the first multi-layer interdigital transducer electrode, and the metal layer being a top layer and having a greater density than any other metal layer of said at least one of the plurality of multi-layer interdigital transducer electrode.
16. The wireless communication device of claim 15 wherein the plurality of additional acoustic wave devices define a multi-mode surface acoustic wave filter coupled to the acoustic wave device, the multi-mode surface acoustic wave filter including a plurality of multi-layer interdigital transducer electrodes longitudinally coupled to each other and including a metal layer that is a top layer of the plurality of multi-layer interdigital transducer electrodes and is thinner than said corresponding metal layer of the same material of the first multi-layer interdigital transducer electrode of the first acoustic wave device.
17. The wireless communication device of claim 15 wherein the first multi-layer interdigital transducer electrode and plurality of multi-layer interdigital transducer electrodes include a first layer of a first material density and the metal layer of a second material density that is greater than the first material density.
18. The wireless communication device of claim 17 wherein a thickness of the metal layer in a gap region of the first multi-layer interdigital transducer electrode is smaller than a thickness of the metal layer in a center region of the first multi-layer interdigital transducer electrode to thereby reduce a mass loading of the first multi-layer interdigital transducer electrode in the gap region.
19. The wireless communication device of claim 15 wherein the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes include a first bus bar, first fingers extending from the first bus bar, a second bus bar, and second fingers extending from the second bus bar.
20. The wireless communication device of claim 15 further comprising a pair of mass loading strips disposed over each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes, an edge of the mass loading strips aligned with end regions of each of the first multi-layer interdigital transducer electrode and the plurality of multi-layer interdigital transducer electrodes.