Three-dimensional device cooling
Subject matter disclosed herein may relate to devices and techniques for cooling three-dimensional integrated circuit (IC) devices. In particular embodiments, an IC device may comprise a three-dimensional structure having a first surface adapted to face a mounting surface and a second surface opposite the first surface, and having one or more cavities to extend at least below the second surface.
1. A method of manufacturing an integrated circuit device, the method comprising:
determining placement of one or more cavities in a three-dimensional structure comprising a first surface adapted to face a mounting surface and a second surface opposite the first surface, the one or more cavities to extend between the first surface and the second surface for passing air therethrough to discharge heat from the second surface; and
fabricating the three-dimensional structure to have the one or more cavities according to the determined placement.
2. The method of claim 1 , and further comprising determining the placement of the one or more cavities subject to one or more constraints.
3. The method of claim 2 , wherein the constraints comprise:
1) inter-device communication latencies;
2) placement of devices at edged of the three-dimensional structure; or
3) expected operational/runtime performance in executing one or more benchmark applications, tasks and/or operations, or a combination thereof.
4. The method of claim 3 , wherein the three-dimensional structure is to further have devices including computing devices, memory devices and circuitry to transmit signals between devices formed in the three-dimensional structure.
5. The method of claim 1 , wherein placement of the one or more cavities in the three-dimensional structure is further based, at least in part, on an availability of active cooling.
6. The method of claim 1 , and further comprising fabricating the three-dimensional structure to comprise at least one external surface comprising a porous material to enable heat from one or more circuits formed in the three-dimensional structure to be discharged therethrough.
7. The method of claim 1 , and further comprising fabricating the three-dimensional structure to comprise at least one active cooling element and at least one passive cooling element to facilitate discharge of heat from one or more circuits formed in the three-dimensional structure.
8. The method of claim 7 , wherein the at least one active cooling element comprises one or more active baffles to modulate heat exchange.
9. The method of claim 1 , and further comprising fabricating the three-dimensional structure to comprise two or more circuit layers disposed between the first and second surfaces, and wherein at least one of the one or more cavities further to extend through at least two of the two or more circuit layers.
10. The method of claim 1 , and further comprising disposing a cold reservoir to be in contact with the mounting surface and/or the first surface to enable active cooling of the three-dimensional structure, and wherein at least one of the one or more cavities to draw cooler air into the integrated circuit device and discharge warmer air from the integrated circuit device.
11. The method of claim 1 , and further comprising fabricating one or more branch channels coupling at least one of the one or more cavities to a lateral surface of the three-dimensional structure.
12. The method of claim 11 , wherein the one or more cavities and the one or more branch channels are positioned to couple an airflow external to the three-dimensional structure and an expected airflow internal to the three-dimensional structure.
13. The method of claim 12 , wherein the one or more cavities and the one or more branch channels comprise features adapted to provide a resonance matched with the expected airflow.
14. The method of claim 12 , wherein the one or more cavities and the one or more branch channels to create a pumping action and/or thermo siphon to remove heat from an interior of the three-dimensional structure.
15. The method of claim 1 , and further comprising fabricating the three-dimensional structure to comprise exposed surfaces, the exposed surfaces to include exterior surfaces and one or more interior surfaces of the one or more cavities, and a plurality of functional devices, and wherein functional devices are placed in proximity to exposed surfaces based, at least in part, on heat to be generated by the functional devices.
16. The method of claim 15 , wherein the functional devices comprise a combination of at least processing devices and memory devices.
17. The method of claim 1 , wherein fabricating the three-dimensional structure further comprises:
determining device layout and process steps based, at least in part, on the determined placement;
at a computing device, determining fabrication control parameters based, at least in part, on the device layout and process steps; and
controlling operation of a process chamber based, at least in part, on the fabrication control parameters.