Cooling module and electronic apparatus
A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is between the valley portion and the air introduction surface and has a greater height of the fin than the valley portion, and a second mountain portion that is between the valley portion and the air exhaust surface and has a greater height of the fin than the valley portion. The first mountain portion is disposed at a position overlapping the first heat pipe, and the second mountain portion is disposed at a position overlapping the second heat pipe.
1. A cooling module mounted on an electronic apparatus, the cooling module comprising:
a fan including an intake port and an exhaust port;
a heat sink including a plurality of fins arranged with a gap between the fins, and an air introduction surface with an air exhaust surface that intersects a bottom most surface of the heat sink on one side and a top most surface of the heat sink on another side, wherein the air introduction surface faces the exhaust port; and
a first heat pipe and a second heat pipe that are connected to the bottom most surface of the heat sink and are arranged along a flow direction of air in the heat sink from the air introduction surface toward the air exhaust surface,
wherein the heat sink includes:
a valley portion in which the second surface is recessed toward a side of the bottom most surface,
a first mountain portion that is between the valley portion and the air introduction surface and has a height greater than a height of the valley portion, and
a second mountain portion that is between the valley portion and the air exhaust surface and has a height greater than the height of the valley portion, and
the first mountain portion only overlaps the first heat pipe as between the first and second heat pipes, and the second mountain portion only overlaps the second heat pipe as between the first and second heat pipes;
wherein the first and second heat pipes are entirely external of all the plurality of fins and disposed at the bottom most surface of the heat sink.
2. The cooling module according to claim 1 ,
wherein, the valley portion overlaps a boundary portion between the first heat pipe and the second heat pipe.
3. The cooling module according to claim 1 ,
wherein the heat sink further includes a notch portion that is upstream, in terms of the air flow direction, of the first mountain portion and is configured such that a corner portion of the plurality of fins between the air introduction surface and the top most surface is notched.
4. The cooling module according to claim 1 ,
wherein the heat sink further includes a cover member on the top most surface and closes an opening of the valley portion.
5. A cooling module mounted on an electronic apparatus, the cooling module comprising:
a fan including an intake port and an exhaust port;
a heat sink including a plurality of fins arranged with a gap between the fins, and an air introduction surface with an air exhaust surface that intersect a bottom most surface of the heat sink on one side and a top most surface of the heat sink on another side, wherein the air introduction surface faces the exhaust port; and
a first heat pipe and a second heat pipe that are connected to the bottom most surface of the heat sink and are arranged along a flow direction of air in the heat sink from the air introduction surface toward the air exhaust surface,
wherein the heat sink includes:
a notch portion that is configured such that a corner portion of the fin between the air introduction surface and the top most surface is notched,
a valley portion that overlaps a boundary line between the first heat pipe and the second heat pipe, wherein the plurality of fins is recessed in a valley shape from a side of the top most surface toward a side of the bottom most surface;
wherein the first and second heat pipes are entirely external of all the plurality of fins and disposed at the bottom most surface of the heat sink.
6. The cooling module according to claim 5 ,
wherein the heat sink further includes:
the first mountain portion is between the notch portion and the valley portion, and has a height greater than a height of the valley portion, and
the second mountain portion is between the valley portion and the air exhaust surface, and has a height greater than the height of the valley portion.
7. An electronic apparatus comprising:
a chassis;
a heating element in the chassis; and
a cooling module in the chassis and that absorbs heat generated by the heating element,
wherein the cooling module includes:
a fan including an intake port and an exhaust port,
a heat sink including a plurality of fins arranged with a gap between the fins, and an air introduction surface with an air exhaust surface that intersects a bottom most surface of the heat sink on one side and a top most surface of the heat sink on another side, wherein the air introduction surface faces the exhaust port, and
a first heat pipe and a second heat pipe that are connected to the bottom most surface of the heat sink and are arranged along a flow direction of air in the heat sink from the air introduction surface toward the air exhaust surface,
the heat sink includes:
a valley portion in which the second surface is recessed toward a side of the first surface,
a first mountain portion that is between the valley portion and the air introduction surface and has a height greater than a height of the valley portion, and
a second mountain portion that is between the valley portion and the air exhaust surface and has a height greater than the height of the valley portion, and
the first mountain portion overlaps the first heat pipe, and the second mountain portion overlaps the second heat pipe;
wherein the first and second heat pipes are entirely external of all the plurality of fins and disposed at the bottom most surface of the heat sink.