Carrier and method for manufacturing substrate
View Patent ↗A carrier has a plate-shaped carrier body that has an inner hole and is made of a first material, and an insertion member that is shaped such that the insertion member fits between the substrate and an inner circumference of the inner hole, that has a substrate holding hole, and that is made of a second material that is different from the first material. The insertion member has a region that bulges toward the carrier main body side, and when a radius of an inscribed circle inscribed to an inner circumference of the substrate holding hole of the insertion member is R, the center of gravity of the insertion member is located 0.1×R or more away from the center of an inner circumferential shape of the substrate holding hole of the insertion member.
1. A carrier that is provided with a substrate holding hole and is configured to hold a substrate in the substrate holding hole and to be used in processing for polishing or grinding a main surface of the substrate, the carrier comprising:
a plate-shaped carrier main body that has an inner hole and is made of a first material; and
an insertion member that is shaped such that the insertion member fits between the substrate and an inner circumference of the inner hole, that has the substrate holding hole for holding the substrate, and that is made of a second material that is different from the first material,
wherein the insertion member includes a non-protruding portion that has a constant radial width along a circumference of the insertion member and a protrusion portion that protrudes outward from an outer circumference of the non-protruding portion,
a center of gravity of the insertion member is shifted from a center of an inner circumferential shape of the substrate holding hole due to the protrusion portion, and
when a radius of an inscribed circle inscribed to an inner circumference of the substrate holding hole of the insertion member is R, the center of gravity of the insertion member is located 0.1×R or more away from the center of the inner circumferential shape of the substrate holding hole of the insertion member.
2. The carrier according to claim 1 ,
wherein hardness of the second material is lower than that of the first material.
3. The carrier according to claim 1 ,
wherein a size of the protrusion portion is smaller than a size of the substrate.
4. The carrier according to claim 1 ,
wherein a length occupied by the protrusion portion extending along the inner circumference of the substrate holding hole is 5% to 50% of the total circumferential length of the inner circumference.
5. The carrier according to claim 1 ,
wherein the protrusion portion is provided with a through-hole passing through the insertion member in a thickness direction of the insertion member.
6. The carrier according to claim 1 ,
wherein the first material contains metal, and the second material contains resin.
7. The carrier according to claim 1 ,
wherein the insertion member and the carrier main body are fixed to each other through adhesion using an adhesive, or engagement between a recess and a protrusion in a thickness direction, at portions where the insertion member and the carrier main body are in contact with each other.
8. A method for manufacturing a substrate, the method comprising processing for polishing or grinding a main surface of a substrate using a carrier that is provided with a substrate holding hole and is configured to hold the substrate in the substrate holding hole,
wherein the carrier is the carrier according to claim 1 .
9. A carrier that is provided with a substrate holding hole and is configured to hold a substrate in the substrate holding hole and to be used in processing for polishing or grinding a main surface of the substrate, the carrier comprising:
a plate-shaped carrier main body that has an inner hole and is made of a first material; and
an insertion member that is shaped such that the insertion member fits between the substrate and an inner circumference of the inner hole, that has the substrate holding hole for holding the substrate, and that is made of a second material that is different from the first material,
wherein the insertion member has a non-protruding portion that has a constant radial width along a circumference of the insertion member and a region that bulges from an outer circumference of the non-protruding portion toward the carrier main body, and
when a radius of an inscribed circle inscribed to an inner circumference of the substrate holding hole of the insertion member is R, a center of gravity of the insertion member is located 0.1×R or more away from a center of an inner circumferential shape of the substrate holding hole of the insertion member, and
the region is provided with a through-hole passing through the insertion member in a thickness direction of the insertion member.
10. The carrier according to claim 9 ,
wherein hardness of the second material is lower than that of the first material.
11. The carrier according to claim 9 ,
wherein a size of the region is smaller than a size of the substrate.
12. The carrier according to claim 9 ,
wherein a length occupied by the region extending along the inner circumference of the substrate holding hole is 5% to 50% of the total circumferential length of the inner circumference.
13. The carrier according to claim 9 ,
wherein the first material contains metal, and the second material contains resin.
14. The carrier according to claim 9 ,
wherein the insertion member and the carrier main body are fixed to each other through adhesion using an adhesive, or engagement between a recess and a protrusion in the thickness direction, at portions where the insertion member and the carrier main body are in contact with each other.
15. A method for manufacturing a substrate, the method comprising processing for polishing or grinding a main surface of a substrate using a carrier that is provided with a substrate holding hole and is configured to hold the substrate in the substrate holding hole,
wherein the carrier is the carrier according to claim 9 .