Semiconductor memory device
According to one embodiment, a semiconductor memory device includes a housing and terminals. The housing has a first end edge extending in a first direction and a second end edge opposite to the first end edge. The terminals include signal terminals and include first terminals, second terminals, and third terminals. The first terminals are arranged in the first direction at a position close to the first end edge. The second terminals are arranged in the first direction with intervals at a position closer to the first end edge than the second end edge. The first plurality of terminals are closer to the first end edge than the second plurality of terminals are. The third terminals are arranged in the first direction with intervals at a position closer to the second end edge than the first end edge.
1. A semiconductor memory device comprising:
a housing having a first surface, a second surface located on a side opposite to the first surface, a first end edge extending in a first direction, a second end edge located on a side opposite to the first end edge and extending in the first direction, a first side edge extending in a second direction intersecting the first direction, and a first corner portion where a notch between the first end edge and the first side edge is formed;
a nonvolatile memory;
a controller configured to control the nonvolatile memory; and
a plurality of terminals provided on the first surface,
wherein the terminals include a first plurality of terminals, a second plurality of terminals, and a third plurality of terminals,
the first plurality of terminals are arranged in the first direction with intervals at a position closer to the first end edge than the second end edge,
the third plurality of terminals are arranged in the first direction with intervals at a position closer to the second end edge than the first end edge,
the second plurality of terminals are arranged between the first plurality of terminals and the third plurality of terminals in the first direction with intervals,
the first plurality of terminals are closer to the first end edge than the second plurality of terminals are,
the first plurality of terminals include at least one pair of first signal terminals for differential data signals, the differential data signals complying with PCIe standard,
the first plurality of terminals include a first plurality of ground terminals assigned to ground,
each pair of the at least one pair of first signal terminals is located between two of the first plurality of ground terminals,
the second plurality of terminals include a second plurality of ground terminals assigned to ground,
the third plurality of terminals include differential clock signal terminals assigned to differential clock signals, a single-end signal terminal assigned to a single-end signal, a first power supply terminal assigned to a first power supply and one or more second power supply terminals assigned to a second power supply having a voltage equal to or lower than that of the first power supply,
the first power supply terminal is configured to be supplied with a current having one of a first plurality of set current values, and
the one or more second power supply terminals are configured to be supplied with a current having one of a second plurality of set current values.
2. The semiconductor memory device according to claim 1 ,
wherein the plurality of terminals include a plurality of signal terminals used for signal transmission, and
the number of at least one of the signal terminals included in the first plurality of terminals and the second plurality of terminals is larger than the number of at least one of the signal terminals included in the third plurality of terminals.
3. The semiconductor memory device according to claim 1 ,
wherein a plurality of pairs of the first signal terminals assigned to a plurality of lanes of the differential data signals are included in the first plurality of terminals.
4. The semiconductor memory device according to claim 1 ,
wherein the single-end signal terminal includes a plurality of sideband signal terminals assigned to sideband signals of PCIe standard.
5. The semiconductor memory device according to claim 1 ,
wherein the third plurality of terminals include a plurality of third power supply terminals assigned to a third power supply having a voltage equal to or lower than that of the second power supply.
6. The semiconductor memory device according to claim 1 ,
wherein the first direction and the second direction are perpendicular to each other,
a length of the semiconductor memory device in the first direction is 14±0.1 mm, and
a length of the semiconductor memory device in the second direction is 18±0.1 mm.
7. The semiconductor memory device according to claim 1 ,
wherein the housing has a second side edge located on a side opposite to the first side edge and extending in the second direction and a second corner portion between the first end edge and the second side edge, and
a shape of the first corner portion and a shape of the second corner portion are different from each other.
8. The semiconductor memory device according to claim 1 ,
wherein the second plurality of terminals include a plurality of second signal terminals used for signal transmission, and
lengths of the at least one pair of first signal terminals included in the first plurality of terminals and the plurality of second signal terminals in the second plurality of terminals in the first direction are equal to each other.
9. The semiconductor memory device according to claim 1 ,
wherein the housing has an inclined portion extending in a linear shape between the first end edge and the first surface.
10. The semiconductor memory device according to claim 1 ,
wherein the one or more second power supply terminals are located in the first direction adjacently.
11. The semiconductor memory device according to claim 10 ,
wherein the third plurality of terminals include a third plurality of ground terminals assigned to ground.
12. The semiconductor memory device according to claim 11 ,
wherein the single-end signal terminal is located between the first power supply terminal and the one or more second power supply terminals.
13. The semiconductor memory device according to claim 12 ,
wherein the single-end signal terminal includes a sideband signal terminal assigned to a sideband signal of PCIe standard.
14. The semiconductor memory device according to claim 10 ,
wherein a power supplied to the first power supply terminal is configured to be supplied to the nonvolatile memory.
15. The semiconductor memory device according to claim 10 ,
wherein a power supplied to one of the one or more second power supply terminal is configured to be supplied to the nonvolatile memory.
16. The semiconductor memory device according to claim 1 , wherein
the second plurality of terminals are arranged in the first direction at a position closer to the first end edge than to the second end edge, and
one of the first plurality of terminals and one of the second plurality of terminals are arranged in the second direction with intervals.
17. The semiconductor memory device according to claim 1 ,
wherein at least a portion of sides of the controller is located between the second plurality of terminals and the third plurality of terminals, and has a connection terminal connected to one of the second plurality of terminals through a wire line.
18. The semiconductor memory device according to claim 1 ,
wherein the nonvolatile memory is provided in the housing, and
the controller is provided in the housing.
19. The semiconductor memory device according to claim 1 ,
wherein the third plurality of terminals include a plurality of third signal terminals used for signal transmission and a third plurality of ground terminals assigned to ground.
20. The semiconductor memory device according to claim 1 ,
wherein the semiconductor memory device is connectable to a host, and
a power of the first power supply is supplied to the first power supply terminal from the host and a power of the second power supply is supplied to the one or more second power supply terminals from the host when the semiconductor memory device is connected to the host.