IP Library › Granted Patent US 12,382,690
Granted Patent B2
US 12,382,690 · App. 17/734,549 · Granted Aug 5, 2025

Structure and method using a single crystalline bixbyite oxide layer in a orientation

Inventors: Andrew Clark (Mountain View, CA); Rytis Dargis (Greensboro, NC)
Assignee: IQE plc
H10D62/8503H10D62/405H10D62/80H10D30/47H10F77/1246H10H20/825
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Quick Facts
Patent No.
US 12,382,690
App. No.
17/734,549
Granted
Aug 5, 2025
Kind
B2
Abstract

A layered structure including a substrate in [100] crystal orientation, a crystalline bixbyite oxide layer in [111] orientation, and a metal-containing layer crystallographically matched to the crystalline bixbyite oxide layer. Also a method of fabricating a layered structure comprising steps to: epitaxially deposit a crystalline bixbyite oxide in [111] orientation on a substrate in [100] crystal orientation; and deposit a metal-containing layer on the crystalline bixbyite oxide layer.

Claims (20)

1. A layered structure comprising:

a substrate in [100] crystal orientation or a substrate having a plane with a miscut up to an angle of 20° with respect to a [100] crystal orientation;

a crystalline bixbyite oxide layer in [111] orientation that is directly on the substrate with no intervening layers between the crystalline bixbyite oxide layer and the substrate; and

a metal-containing layer crystallographically matched to the crystalline bixbyite oxide layer.

2. The layered structure of claim 1 , wherein the substrate comprises silicon.

3. The layered structure of claim 1 , wherein the crystalline bixbyite oxide layer is epitaxial.

4. The layered structure of claim 1 , wherein the crystalline bixbyite oxide layer is a crystalline rare earth oxide layer.

5. The layered structure of claim 1 , wherein the crystalline bixbyite oxide layer is scandium oxide (Sc 2 O 3 ).

6. The layered structure of claim 1 , wherein the metal-containing layer is epitaxial.

7. The layered structure of claim 6 , wherein the metal-containing layer is a III-N material, GaN, AlN, or molybdenum.

8. The layered structure of claim 1 , wherein the metal-containing layer is sputtered.

9. The layered structure of claim 8 , wherein the metal-containing layer is molybdenum, III-N, AlN, or GaN.

10. A photonic device comprising the layered structure of claim 1 .

11. The photonic device of claim 10 , wherein the photonic device is a photoemitter, a photodetector, a combined photoemitter and photodetector, a light emitting diode (LED), or a micro-light emitting diode (μLED).

12. An electronic device, a radio frequency (RF) filter, or a high electron mobility transistor (HEMT) comprising the layered structure of claim 1 .

13. A method of fabricating a layered structure comprising steps to:

epitaxially deposit a crystalline bixbyite oxide layer in [111] orientation on a substrate in crystal orientation with no intervening layers between the crystalline bixbyite oxide layer and the substrate; and

deposit a metal-containing layer on the crystalline bixbyite oxide layer.

14. The method of claim 13 , wherein the step to deposit the metal-containing layer comprises epitaxial deposition.

15. The method of claim 13 , wherein the step to deposit the metal-containing layer comprises sputtering.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2022
From: CLARK, ANDREW; DARGIS, RYTIS
To: IQE PLC
Reel/Frame 060107/0890 →
Priority Claims (1)
GB 2106335 · May 4, 2021 · national
Continuity (1)
Related Publication 20220359668A1 · Nov 10, 2022
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