IP Library › Granted Patent US 12,382,713
Granted Patent B2
US 12,382,713 · App. 18/725,607 · Granted Aug 5, 2025

Semiconductor device, semiconductor device manufacturing method, and display driving device comprising semiconductor device

Inventor: Kee Joon Choi (Daejeon, KR)
Assignee: LX SEMICON CO., LTD.
H10D84/83G09G3/3648H10D84/013H10D84/0156G09G2310/0286G09G2310/0289
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,382,713
App. No.
18/725,607
Granted
Aug 5, 2025
Kind
B2
Abstract

A semiconductor device includes a first device configured to receive a first level voltage through a first terminal, and output a first output voltage through a second terminal when a gate voltage is applied through a gate terminal; a boost device configured to receive a second level voltage through a first terminal, and output a second output voltage having a higher value than the first output voltage when the first output voltage is applied as a gate voltage through a gate terminal; and a second device configured to receive a third level voltage through a first terminal, and output a third output voltage when the second output voltage is applied as a gate voltage through a gate terminal, wherein the second output voltage is greater than a threshold voltage of the second device.

Claims (49)

1. A semiconductor device comprising:

a first device configured to receive a first level voltage through a first terminal, and output a first output voltage through a second terminal when a gate voltage is applied through a gate terminal;

a boost device configured to receive a second level voltage through a first terminal, and output a second output voltage having a higher value than the first output voltage when the first output voltage is applied as a gate voltage through a gate terminal; and

a second device configured to receive a third level voltage through a first terminal, and output a third output voltage when the second output voltage is applied as a gate voltage through a gate terminal,

wherein the second output voltage is greater than a threshold voltage of the second device.

2. The semiconductor device of claim 1 , wherein the second level voltage is greater than the first level voltage and smaller than the third level voltage.

3. The semiconductor device of claim 1 , wherein the first output voltage is greater than a threshold voltage of the boost device.

4. The semiconductor device of claim 1 , wherein

each of the first device, the boost device, and the second device includes a well located in a substrate; and

wherein the well of the boost device is composed of the same material as any one of the well of the first device and the well of the second device.

5. The semiconductor device of claim 4 , wherein the well of the boost device is doped with a same doping type and has a same doping concentration as the well of the first device, or doped with a same doping type and has a same doping concentration as the well of the second device.

6. The semiconductor device of claim 1 , wherein

each of the first device, the boost device, and the second device includes a source-drain region located in a substrate, and

wherein the source-drain region of the boost device includes a same material as the source-drain region of the first device.

7. The semiconductor device of claim 6 , wherein the source-drain region of the boost device is doped with a same doping type and has a same doping concentration as the source-drain region of the first device.

8. The semiconductor device of claim 1 , further comprising:

a first isolation structure disposed between the first device and the boost device in a substrate to isolate the first device and the boost device; and

a second isolation structure disposed between the boost device and the second device in the substrate to isolate the boost device and the second device.

9. A method of manufacturing a semiconductor device, comprising:

forming a first well of a first device, a boost well of a boost device, and a second well of a second device in a substrate;

forming a source-drain region of the first device, a source-drain region of the boost device, and a source-drain region of the second device in the substrate; and

forming a gate structure of the first device, a gate structure of the boost device, and a gate structure of the second device on the substrate,

wherein the first well is formed using a first well mask and a second well mask,

the second well is formed using a third well mask and a fourth well mask, and

the boost well is formed using the first and second well masks, or using the third and fourth well masks.

10. The method of manufacturing of claim 9 , wherein

the source-drain region of the first device is formed using a first source/drain (S/D) mask and a second S/D mask;

the source-drain region of the second device is formed using a third S/D mask and a fourth S/D mask; and

the source-drain region of the boost device is formed using the first and second S/D masks or the third and fourth S/D masks.

11. A display driving apparatus configured to receive image data and output the image data through a display panel, the display driving apparatus comprising:

a latch circuit configured to sample and output the image data; and

a level shifter circuit configured to boost and output a voltage level of the image data output from the latch circuit to a predetermined level,

wherein the latch circuit includes a first device configured to receive a first level voltage through a first terminal, and output a first output voltage through a second terminal when a gate voltage is applied through a gate terminal,

wherein the level shifter circuit includes a boost device configured to receive a second level voltage through a first terminal, and output a second output voltage having a higher value than the first output voltage when the first output voltage is applied as a gate voltage through a gate terminal, and a second device configured to receive a third level voltage through a first terminal, and output a third output voltage when the second output voltage is applied as a gate voltage through a gate terminal, and

wherein the second output voltage is a value greater than a threshold voltage of the second device.

12. The display driving apparatus of claim 11 , further comprising a shift register circuit configured to generate a sampling signal for sampling the image data and output the sampling signal to the latch circuit,

wherein the shift register circuit includes the first device.

13. The display driving apparatus of claim 11 , wherein the second level voltage is greater than the first level voltage and smaller than the third level voltage.

14. The display driving apparatus of claim 11 , wherein the first output voltage is greater than a threshold voltage of the boost device.

15. The display driving apparatus of claim 11 , wherein

each of the first device, the boost device, and the second device includes a well located in a substrate, and

wherein the well of the boost device includes a same material as one of the well of the first device and the well of the second device.

16. The display driving apparatus of claim 15 , wherein the well of the boost device is doped with a same doping type and has a same doping concentration as the well of the first device, or is doped with a same doping type and has a same doping concentration as the well of the second device.

17. The display driving apparatus of claim 11 , wherein

each of the first device, the boost device, and the second device includes a source-drain region located in a substrate, and

wherein the source-drain region of the boost device is composed of the same material as the source-drain region of the first device.

18. The display driving apparatus of claim 17 , further comprising:

a first isolation structure disposed between the first device and the boost device in the substrate to isolate the first device and the boost device; and

a second isolation structure for disposed between the boost device and the second device in the substrate to isolate the boost device and the second device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: CHOI, KEE JOON
To: LX SEMICON CO., LTD.
Reel/Frame 069815/0726 →
Priority Claims (1)
KR 10-2021-0189391 · Dec 28, 2021 · national
Continuity (1)
Related Publication 20250133817A1 · Apr 24, 2025
References Cited (16)
US 8542178B2 · Yoo · 2013 [cited by examiner]
US 10497302B2 · Peng · 2019 [cited by examiner]
US 10755622B2 · Kong · 2020 [cited by examiner]
US 11189242B2 · Liao · 2021 [cited by examiner]
US 11314136B2 · Yamamoto · 2022 [cited by examiner]
US 11450257B2 · Park · 2022 [cited by examiner]
US 11749222B2 · Yamamoto · 2023 [cited by examiner]
US 20050117406A1 · Atsumi et al. · 2005 [cited by applicant]
US 20220068234A1 · Lin · 2022 [cited by examiner]
US 20220139349A1 · Park · 2022 [cited by examiner]
KR 1020020084570A · 2002 [cited by applicant]
KR 100800482B1 · 2008 [cited by applicant]
KR 101532271B1 · 2015 [cited by applicant]
KR 101788459B1 · 2017 [cited by applicant]
KR 1020210080869A · 2021 [cited by applicant]
KR 102394856B1 · 2022 [cited by applicant]