IP Library › Granted Patent US 12,382,815
Granted Patent B2
US 12,382,815 · App. 18/374,810 · Granted Aug 5, 2025

Electronic apparatus

Inventors: Youngjin Cho (Seoul, KR); Yangwan Kim (Hwaseong-si, KR); Joong-Soo Moon (Hwaseong-si, KR); Minwoo Byun (Seongnam-si, KR); Changkyu Jin (Anyang-si, KR)
Assignee: Samsung Display Co., Ltd.
H10K59/40G06F3/0412G06F3/04164G06F3/0443G06F3/0445G06F3/0446H05K1/147H10K50/844H10K59/123H10K59/124H10K59/131H10K59/805H10K59/8731H10K77/111G06F2203/04102G06F2203/04111H05K1/189H05K2201/10128H10D86/441H10D86/451H10D86/60H10K2102/311
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,382,815
App. No.
18/374,810
Granted
Aug 5, 2025
Kind
B2
Abstract

An electronic apparatus includes a base substrate having an active area and a peripheral area adjacent to the active area. A plurality of pixels is disposed on the active area. The electronic apparatus also includes a plurality of power lines connected to the pixels. A power pad is disposed on a peripheral area and is configured to receive a power voltage. A power pattern is disposed on the peripheral area and connecting the power lines to the power pad. A plurality of sensing electrodes is disposed on the pixels in the active area. A plurality of sensing pads is disposed on the peripheral area and is electrically connected to the sensing electrodes. The sensing pads overlap with the power pattern.

Claims (77)

1. An electronic apparatus comprising:

a base substrate including a bending portion that is configured to bend about a bending axis extending in one direction, and a non-bending portion adjacent to the bending portion;

a plurality of pixels disposed in an active area defined in the non-bending portion;

a plurality of power lines connected to the pixels;

a power pad disposed in a first pad area defined in the bending portion and configured to receive a power voltage;

a power pattern disposed on the non-bending portion and connecting the power lines to the power pad;

a first insulating layer, wherein the power pad and the power pattern are disposed directly on an upper surface of the first insulating layer;

a plurality of sensing electrodes disposed on the pixels in the non-bending portion;

a plurality of sensing pads disposed in a second pad area defined in the non-bending portion and electrically connected to the sensing electrodes;

a second insulating layer on which the sensing pads are disposed; and

a third insulating layer disposed on the second insulating layer,

wherein the second pad area is disposed between the first pad area and the active area,

wherein the plurality of sensing pads overlap with the power pattern in the second pad area,

the power pad is exposed through a first opening formed in the second and the third insulating layers, the plurality of sensing pads is disposed between the second and third insulating layers and exposed through a second opening formed in the third insulating layer.

2. The electronic apparatus of claim 1 , wherein each of the plurality of pixels comprises:

a thin film transistor including:

a semiconductor layer;

a control electrode spaced apart from the semiconductor layer;

an input electrode connected to the semiconductor layer; and

an output electrode disposed on the same layer as the input electrode and connected to the semiconductor layer; and

a light emitting element which is disposed on the thin film transistor, the light emitting element including:

a first electrode;

a second electrode disposed on the first electrode; and

an emission layer disposed between the first electrode and the second electrode.

3. The electronic apparatus of claim 2 , wherein the power pattern is disposed on the first insulating layer with the output electrode.

4. The electronic apparatus of claim 3 , wherein the first insulating layer is disposed between the first electrode and the output electrode and covering the output electrode,

the second insulating layer is disposed on the first insulating layer, and

the third insulating layer is disposed on the second insulating layer,

wherein the first electrode is disposed on the third insulating layer,

wherein the power pattern is covered by the first insulating layer.

5. The electronic apparatus of claim 4 , further comprising:

a connection electrode disposed between the second insulating layer and the third insulating layer,

wherein the first electrode penetrates the third insulating layer and is connected to the connection electrode, and

wherein the connection electrode penetrates the first and second insulating layers and is connected to the output electrode.

6. The electronic apparatus of claim 1 , wherein the power pattern is extended in the one direction,

a width of the power pattern in the one direction is less than a width of the active area in the one direction, and

a width of the second pad area in the one direction is equal to or less than the width of the power pattern in the one direction.

7. The electronic apparatus of claim 1 , wherein the power pattern is extended in the one direction,

a width of the power pattern in the one direction is greater than a width of the active area in the one direction, and

a width of the second pad area in the one direction is equal to or less than the width of the power pattern in the one direction.

8. The electronic apparatus of claim 1 , wherein an opening area is defined through the first insulating layer in the bending portion,

the opening area is disposed between the first pad area and the second pad area.

9. The electronic apparatus of claim 8 , wherein the second insulating layer fills the opening area and includes an organic material.

10. The electronic apparatus of claim 8 , further comprising:

a power bridge line electrically connecting the power pattern to the power pad via the opening area.

11. The electronic apparatus of claim 8 , further comprising:

a plurality of main pads disposed in the first pad area and connected to the sensing pads; and

a plurality of bridge lines connecting the main pads to the sensing pads.

12. The electronic apparatus of claim 11 , wherein the opening area is disposed between the main pads and the sensing pads and overlaps the plurality of bridge lines.

13. An electronic apparatus comprising:

an electronic panel comprising a bending portion that is configured to be bent about a bending axis and a non-bending portion adjacent to the bending portion,

wherein the electronic panel includes:

a plurality of pixels disposed in an active area defined in the non-bending portion;

data pads disposed in a first pad area defined in the bending portion;

power pads disposed in the first pad area;

a power pattern disposed in the non-bending portion, the power pattern connecting the power pads to the pixels,

a first insulating layer, wherein the power pads and the power pattern are disposed directly on an upper surface of the first insulating layer;

sensing electrodes disposed in the non-bending portion and overlapping with the pixels;

sensing pads disposed in a second pad area defined in the non-bending portion and connected to the sensing electrodes, wherein the sensing pads overlap with the power pattern in the second pad area;

a second insulating layer on which the sensing pads are disposed; and

a third insulating layer disposed on the second insulating layer,

wherein the second pad area is disposed between the first pad area and the active area,

the power pads and the data pads are exposed through a first opening formed in the second and the third insulating layers corresponding to the bending portion, the sensing pads are disposed between the second and third insulating layers and exposed through a second opening formed in the third insulating layer corresponding to the non-bending portion.

14. The electronic apparatus of claim 13 , further comprising

a first circuit board connected to the power pads in the first pad area, and

a second circuit board connected to the sensing pads in the second pad area.

15. The electronic apparatus of claim 14 , wherein the first circuit board overlaps with the second circuit board.

16. The electronic apparatus of claim 13 , wherein an opening area is defined through the first insulating layer in the bending portion,

the opening area is disposed between the first pad area and the second pad area.

17. The electronic apparatus of claim 16 , wherein the second insulating layer fills the opening area and includes an organic material.

18. The electronic apparatus of claim 13 , wherein the electronic panel further includes:

a plurality of power lines arranged and spaced apart from each other in a first direction, and

the power pattern is extended in the first direction and commonly connected to the plurality of power lines.

19. The electronic apparatus of claim 18 , wherein a width of the power pattern in the first direction is less than a width of the active area in the first direction, and

a width of the second pad area in the first direction is equal to or less than the width of the power pattern in the first direction.

20. The electronic apparatus of claim 18 , wherein a width of the power pattern in the first direction is greater than a width of the active area in the first direction, and

a width of the second pad area in the first direction is equal to or less than the width of the power pattern in the first direction.

Priority Claims (1)
KR 10-2018-0077539 · Jul 4, 2018 · national
Continuity (4)
Continuation 18115991 · Mar 1, 2023
Continuation 17315573 · May 10, 2021
Continuation 16460107 · Jul 2, 2019
Related Publication 20250031534A1 · Jan 23, 2025
References Cited (40)
US 8902178B2 · Han · 2014 [cited by applicant]
US 9046955B1 · Lee et al. · 2015 [cited by applicant]
US 9276055B1 · Son et al. · 2016 [cited by applicant]
US 9655244B1 · Tsai et al. · 2017 [cited by applicant]
US 10020464B2 · Son et al. · 2018 [cited by applicant]
US 10109686B2 · Oh et al. · 2018 [cited by applicant]
US 10109704B2 · Shin et al. · 2018 [cited by applicant]
US 10418424B2 · Oh et al. · 2019 [cited by applicant]
US 10719284B2 · Yamazaki et al. · 2020 [cited by applicant]
US 11018212B2 · Cho et al. · 2021 [cited by applicant]
US 11626472B2 · Cho et al. · 2023 [cited by applicant]
US 20150177893A1 · Lee · 2015 [cited by applicant]
US 20150248149A1 · Yamazaki et al. · 2015 [cited by applicant]
US 20170097711A1 · Aoki et al. · 2017 [cited by applicant]
US 20170352316A1 · Zhang et al. · 2017 [cited by applicant]
US 20180011586A1 · Zhang et al. · 2018 [cited by applicant]
US 20180033969A1 · Kamijo et al. · 2018 [cited by applicant]
US 20180107316A1 · Hanari · 2018 [cited by applicant]
US 20180120987A1 · Kim et al. · 2018 [cited by applicant]
US 20180275445A1 · Katagiri et al. · 2018 [cited by applicant]
US 20180329552A1 · Song et al. · 2018 [cited by applicant]
US 20190014664A1 · Ahn et al. · 2019 [cited by applicant]
US 20190189721A1 · Kim et al. · 2019 [cited by applicant]
US 20190198801A1 · Kuon et al. · 2019 [cited by applicant]
US 20190219863A1 · Tezen et al. · 2019 [cited by applicant]
US 20200013844A1 · Cho et al. · 2020 [cited by applicant]
US 20200020759A1 · Song · 2020 [cited by applicant]
US 20210313413A1 · Cho et al. · 2021 [cited by applicant]
US 20230217753A1 · Cho et al. · 2023 [cited by applicant]
EP 3291069 · 2018 [cited by applicant]
JP 2018063669 · 2018 [cited by applicant]
KR 2011013643 · 2011 [cited by applicant]
KR 101725893 · 2017 [cited by applicant]
KR 1020170047269 · 2017 [cited by applicant]
KR 1020170098275 · 2017 [cited by applicant]
KR 1020170106621 · 2017 [cited by applicant]
KR 1020170114029 · 2017 [cited by applicant]
KR 1020180006614 · 2018 [cited by applicant]
KR 101908982 · 2018 [cited by applicant]
European Search Report issued in corresponding European Application No. 19184258.2 on Nov. 22, 2019. [cited by applicant]