In-resist process for high density contact formation
A method of microfabrication includes forming a first relief pattern on a target layer of a substrate, coating the first relief pattern with a first solubility-shifting agent, layering a first polymeric fill on the first relief pattern, and diffusing the first solubility-shifting agent into the first polymeric fill to provide a solubility-shifted region of the first polymeric fill. Then the method includes forming a second relief pattern over the first relief pattern, coating the second relief pattern with a second solubility-shifting agent, layering a second polymeric fill on the second relief pattern, and diffusing the second solubility-shifting into the second polymeric fill to provide a solubility-shifted region of the second polymeric fill. Finally, the solubility-shifted regions of the first polymeric fill and the second polymeric fill are developed and the target layer is etched.
1. A method of microfabrication comprising: providing a substrate having a target layer formed thereon; forming a first relief pattern on the substrate, wherein the first relief pattern comprises a first resist; coating the first relief pattern with a first solubility-shifting agent; layering a first polymeric fill on the first relief pattern; diffusing the first solubility-shifting agent a predetermined distance into the first polymeric fill to provide a solubility-shifted region of the first polymeric fill, wherein the solubility-shifted region of the first polymeric fill borders the first relief pattern and wherein the solubility-shifted region of the first polymeric fill is soluble in a first developer; forming a second relief pattern over the first relief pattern, wherein the second relief pattern comprises a second resist; coating the second relief pattern with a second solubility-shifting agent;
layering a second polymeric fill on the second relief pattern; diffusing the second solubility-shifting a predetermined distance into the second polymeric fill to provide a solubility-shifted region of the second polymeric fill, wherein the solubility-shifted region of the second polymeric fill borders the second relief pattern and wherein the solubility-shifted region of the second polymeric fill is soluble in a second developer; developing the first polymeric fill and the second polymeric fill such that the solubility-shifted region of the first polymeric fill and the solubility-shifted region of the second polymeric fill are dissolved providing gaps between the first relief pattern,
the first polymeric fill, the second relief pattern, and the second polymeric fill where a portion of the target layer is exposed; and etching the target layer using the first relief pattern, the first polymeric fill, the second relief pattern, and the second polymeric fill as a combined etch mask.
2. The method of claim 1 , wherein the first relief pattern comprises features separated by gaps between the features, wherein the features comprise the first resist.
3. The method of claim 1 , wherein the first polymeric fill fills the gaps of the first relief pattern.
4. The method of claim 1 , wherein the second relief pattern comprises features separated by gaps between the features, wherein the features comprise the second resist.
5. The method of claim 1 , wherein the second polymeric fill fills the gaps of the second relief pattern.
6. The method of claim 1 , wherein providing the first relief pattern on the target layer comprises:
forming a first pattern of lines on the target layer;
depositing a layer of the first resist over the first pattern of lines;
exposing the first resist to a pattern of actinic radiation and developing the first resist such that the first relief pattern is formed over the first pattern of lines.
7. The method of claim 1 , wherein the first solubility-shifting agent is selected from the group consisting of an acid generator, an acid, a matrix polymer, and a solvent.
8. The method of claim 1 , wherein the second solubility-shifting agent is selected from the group consisting of an acid generator, an acid, a matrix polymer, and a solvent.
9. The method of claim 1 , wherein the first resist comprises a polymer made from monomers selected from the group consisting of styrene, p-hydroxystyrene, methacrylate, norbornene, and combinations thereof.
10. The method of claim 1 , wherein the second resist comprises a polymer made from monomers selected from the group consisting of styrene, p-hydroxystyrene, methacrylate, norbornene, and combinations thereof.
11. A method of microfabrication comprising:
providing a substrate having a target layer formed thereon;
forming a first relief pattern on the substrate, wherein the first relief pattern comprises a first resist;
coating the first relief pattern with a first solubility-shifting agent;
layering a first polymeric fill on the first relief pattern;
diffusing the first solubility-shifting agent a predetermined distance into the first polymeric fill to provide a solubility-shifted region of the first polymeric fill, wherein the solubility-shifted region of the first polymeric fill borders the first relief pattern;
developing the first polymeric fill such that the solubility-shifted region of the first polymeric fill is dissolved, providing gaps between the first relief pattern and the first polymeric fill where a portion of the target layer is exposed;
etching the target layer using the first relief pattern and the first polymeric fill as a combined etch mask;
forming a second relief pattern on the substrate wherein the second relief pattern comprises a second resist;
coating the second relief pattern with a second solubility-shifting agent;
layering a second polymeric fill on the second relief pattern;
diffusing the second solubility-shifting a predetermined distance into the second polymeric fill to provide a solubility-shifted region of the second polymeric fill, wherein the solubility-shifted region of the second polymeric fill borders the second relief pattern;
developing the second polymeric fill such that the solubility-shifted region of the second polymeric fill is dissolved providing gaps between the second relief pattern and the second polymeric fill where a portion of the target layer is exposed; and
etching the target layer of the substrate using the second relief pattern and the second polymeric fill as a combined etch mask.
12. The method of claim 11 , wherein the first relief pattern comprises features separated by gaps between the features, wherein the features comprise the first resist.
13. The method of claim 11 , wherein the first polymeric fill fills the gaps of the first relief pattern.
14. The method of claim 11 , wherein the second relief pattern comprises features separated by gaps between the features, wherein the features comprise the second resist.
15. The method of claim 11 , wherein the second polymeric fill fills the gaps of the second relief pattern.
16. The method of claim 11 , wherein providing the first relief pattern on the target layer comprises:
forming a first pattern of lines on the target layer;
depositing a layer of the first resist over the first pattern of lines;
exposing the first resist to a pattern of actinic radiation and developing the first resist such that the first relief pattern is formed over the first pattern of lines.
17. The method of claim 11 , wherein the first solubility-shifting agent is selected from the group consisting of acid generators, acids, matrix polymers, and solvents.
18. The method of claim 11 , wherein the second solubility-shifting agent is selected from the group consisting of acid generators, acids, matrix polymers, and solvents.
19. The method of claim 11 , wherein the first resist comprises a polymer made from monomers selected from the group consisting of styrene, p-hydroxystyrene, methacrylate, norbornene, and combinations thereof.
20. The method of claim 11 , wherein the second resist comprises a polymer made from monomers selected from the group consisting of styrene, p-hydroxystyrene, methacrylate, norbornene, and combinations thereof.