Plasma treatment apparatus
There is provided a plasma processing apparatus comprising: a chamber; a gas supply configured to supply gas into the chamber; a substrate support provided in the chamber; a ground electrode electrically grounded and provided in the chamber; an upper electrode provided above the substrate support and the ground electrode; a first high-frequency power supply electrically connected to the upper electrode to generate a plasma from the gas in the chamber; a second high-frequency power supply electrically connected to the upper electrode; and a rectifier configured to block application of a negative voltage to the upper electrode by the second high-frequency power supply.
1. A plasma processing apparatus comprising:
a chamber;
a gas supply configured to supply gas into the chamber;
a substrate support provided in the chamber;
a ground electrode electrically grounded and provided in the chamber;
an upper electrode provided above the substrate support and the ground electrode;
a first high-frequency power supply electrically connected to the upper electrode, the first high-frequency power supply configured to generate a plasma from the gas in the chamber;
a second high-frequency power supply electrically connected to the upper electrode; and
a rectifier configured to block application of a negative voltage to the upper electrode by the second high-frequency power supply,
wherein the rectifier includes a diode, and
a cathode of the diode is connected to a feed line connected between the second high-frequency power supply and the upper electrode, and an anode of the diode is connected to ground.
2. The plasma processing apparatus of claim 1 , further comprising:
a pressure controller configured to control a pressure of gas in the chamber,
wherein the pressure controller is configured to set the pressure of gas in the chamber to 13.3 Pa or higher when plasma is generated in the chamber.
3. The plasma processing apparatus of claim 1 , wherein the substrate support includes a lower electrode which is the ground electrode.
4. The plasma processing apparatus of claim 1 , wherein a frequency of a high-frequency power output from the second high-frequency power supply is 100 kHz or higher.
5. A plasma processing apparatus comprising:
a chamber;
a gas supply configured to supply gas into the chamber;
a substrate support provided in the chamber;
a ground electrode electrically grounded and provided in the chamber;
an upper electrode provided above the substrate support and the ground electrode;
a first high-frequency power supply electrically connected to the upper electrode, the first high-frequency power supply configured to generate a plasma from the gas in the chamber;
a second high-frequency power supply electrically connected to the upper electrode;
a rectifier configured to block application of a negative voltage to the upper electrode by the second high-frequency power supply; and
another rectifier configured to block application of a positive voltage to the upper electrode by the first high-frequency power supply.
6. The plasma processing apparatus of claim 5 , wherein said another rectifier includes a diode,
an anode of the diode of said another rectifier is connected to a feed line connected between the first high-frequency power supply and the upper electrode, and
a cathode of the diode of said another rectifier is connected to ground.
7. A plasma processing apparatus comprising:
a chamber;
a gas supply configured to supply gas into the chamber;
a substrate support provided in the chamber;
a ground electrode electrically grounded and provided in the chamber;
an upper electrode provided above the substrate support and the ground electrode;
a first high-frequency power supply electrically connected to the upper electrode, the first high-frequency power supply configured to generate a plasma from the gas in the chamber;
a second high-frequency power supply electrically connected to the upper electrode; and
a rectifier configured to block application of a negative voltage to the upper electrode by the second high-frequency power supply,
wherein the substrate support includes a lower electrode, and
the plasma processing apparatus further comprises an impedance circuit connected between the lower electrode and ground, and the ground electrode is provided around the substrate support.