IP Library › Granted Patent US 12,389,609
Granted Patent B2
US 12,389,609 · App. 18/057,836 · Granted Aug 12, 2025

Circuit architecture using transistors with dynamic dual functionality for logic and embedded memory drivers

Inventors: Julien Frougier (Albany, NY); Ruilong Xie (Niskayuna, NY); Kangguo Cheng (Schenectady, NY); Heng Wu (Santa Clara, CA); Min Gyu Sung (Latham, NY); Chanro Park (Clifton Park, NY)
Assignee: International Business Machines Corporation
H10B61/22H03K19/1733H03K19/20H10B53/00H10B63/34H10N70/20
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Quick Facts
Patent No.
US 12,389,609
App. No.
18/057,836
Granted
Aug 12, 2025
Kind
B2
Abstract

Embodiments of the invention include a transistor coupled to a memory element, the memory element being in series with a first bistable resistive element that is configured to switch between a first low resistance state and a first high resistance state. A logic circuit is coupled to the transistor via a series connection to a second bistable resistive element, the second bistable resistive element being configured to switch between a second low resistance state and a second high resistance state.

Claims (30)

1. A semiconductor structure comprising:

a transistor coupled to a memory element, the memory element being in series with a first bistable resistive element that is configured to switch between a first low resistance state and a first high resistance state; and

a logic circuit coupled to the transistor via a series connection to a second bistable resistive element, the second bistable resistive element being configured to switch between a second low resistance state and a second high resistance state.

2. The semiconductor structure of claim 1 , wherein the memory element is configured to form a circuit with the transistor in which the circuit electrically isolates the logic circuit.

3. The semiconductor structure of claim 1 , wherein the logic circuit is configured to form a circuit with the transistor in which the circuit electrically isolates the memory element.

4. The semiconductor structure of claim 1 , wherein the memory element is coupled to a memory array circuit in a back-end-of-line network on a front side, the front side being above the transistor.

5. The semiconductor structure of claim 1 , wherein the logic circuit is part of a network for routing logic functions and delivering power.

6. The semiconductor structure of claim 1 , wherein the memory element and the logic circuit are formed on opposite sides of the transistor.

7. The semiconductor structure of claim 1 , wherein a circuit with the transistor and the memory element electrically isolates a terminal of the transistor that connects to the logic circuit.

8. The semiconductor structure of claim 1 , wherein a circuit with the transistor and the logic circuit electrically isolates a terminal of the transistor that connects to the memory element.

9. The semiconductor structure of claim 1 , wherein the first and second bistable resistive elements each comprise a unipolar, abrupt, reversible, and electrically triggered resistance switch that operates between two stable resistance states.

10. The semiconductor structure of claim 1 , wherein at least one of the first and second bistable resistive elements comprises an insulator-to-metal transition material.

11. The semiconductor structure of claim 10 , wherein the insulator-to-metal transition material comprises VO 2 , NbO 2 , Ca 2 RuO 4 , LaCoO 3 , Ti 2 O 3 , Ti 3 O 5 , SmNiO 3 , NdNiO 3 , V 2 O 3 , V 4 O 7 , Fe 3 O 4 , an oxide of the form ABO 3 -perovskite, or any combinations thereof.

12. The semiconductor structure of claim 1 , wherein at least one of the first and second bistable resistive elements comprises a threshold-switching selector formed by a combination of a thin insulator layer with a metal.

13. The semiconductor structure of claim 12 , wherein the threshold-switching selector comprises Ag-doped HfO 2 , Cu/HfO 2 , Ag/TiO 2 , CU x S, Ag/a-Si, AgTe/TiN/TiO 2 /TiN, W/Cu x S, or any combinations thereof.

14. The semiconductor structure of claim 1 , wherein the memory element comprises non-volatile memory (NVM).

15. The semiconductor structure of claim 1 , wherein the memory element comprises charge trap memory, magnetic random access memory (MRAM), ferroelectric-RAM (FRAM), phase-change memory (PCM), resistive-RAM (ReRAM), or any combinations thereof.

16. The semiconductor structure of claim 1 , wherein the transistor is one of a planar field-effect transistor (FET), a finFET, gate-all-around (GAA) FET, a vertical-transport-FET (VTFET), and a stacked-FET.

17. The semiconductor structure of claim 1 , wherein:

a first mode, to selectively operate the memory element, comprises the first bistable resistive element in the first low resistance state and the second bistable resistive element in the second high resistance state; and

a second mode, to selectively operate the logic circuit, comprises the first bistable resistive element in the first high resistance state and the second bistable resistive element in the second low resistance state, the first and second low resistance states permitting a flow of electrical current, the first and second high resistance states limiting a flow of electrical current.

18. A method comprising:

providing a transistor coupled to a memory element, the memory element being in series with a first bistable resistive element that is configured to switch between a first low resistance state and a first high resistance state; and

providing a logic circuit coupled to the transistor via a series connection to a second bistable resistive element, the second bistable resistive element being configured to switch between a second low resistance state and a second high resistance state.

19. The method of claim 18 , wherein:

the memory element is configured to form a circuit with the transistor in which the circuit electrically isolates the logic circuit; and

the logic circuit is configured to form another circuit with the transistor in which the another circuit electrically isolates the memory element.

20. The method of claim 18 , wherein:

a first mode, to selectively operate the memory element, comprises the first bistable resistive element in the first low resistance state and the second bistable resistive element in the second high resistance state; and

a second mode, to selectively operate the logic circuit, comprises the first bistable resistive element in the first high resistance state and the second bistable resistive element in the second low resistance state, the first and second low resistance states permitting a flow of electrical current, the first and second high resistance states limiting a flow of electrical current.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2022
From: FROUGIER, JULIEN; XIE, RUILONG; CHENG, KANGGUO; WU, HENG; SUNG, MIN GYU; PARK, CHANRO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 061853/0290 →
Continuity (1)
Related Publication 20240172454A1 · May 23, 2024
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