Method for operating an ultrasonic connecting device
A method for operating an ultrasonic bonding apparatus, the ultrasonic bonding apparatus providing an ultrasonic transducer with a carrier, displaceable in a z direction, including an ultrasound generating device which is movable relative to the carrier and is held thereon, and including an ultrasonic tool which is excitable to ultrasonic vibrations by the ultrasound generating device.
1. A method for operating an ultrasonic bonding apparatus, the ultrasonic bonding apparatus comprising an ultrasound head that is displaceable in a z direction, the ultrasound head having a carrier, an ultrasound generating device held on the carrier and movable relative thereto, and an ultrasonic tool fixed to the ultrasound generating device to be excited to ultrasonic vibrations by the ultrasound generating device, the method comprising:
positioning an electrically conductive connection conductor above an electrically conductive bonding region provided on a bonding component such that a gap having a determined clearance in the z direction is formed between the connection conductor and a connecting surface of the bonding region facing the connection conductor;
positioning the ultrasound head relative to the connection conductor and the bonding component such that a contact surface of the ultrasonic tool, designed for contact with the connection conductor, faces the connection conductor;
applying a bonding force, active in the z direction, to the ultrasound generating device to press the ultrasound generating device against the carrier;
and subsequently lowering the ultrasound head in the z direction, and determining a displacement position of the ultrasound head in the z direction as well as a relative position of the ultrasound generating device with respect to the carrier in the z direction; and
taking into account the displacement position and the relative position, a contact point in time is determined at which the connection conductor is lowered so far by the ultrasonic tool so as to touch the bonding region of the bonding component.
2. The method according to claim 1 , wherein the contact point in time is determined by determining a difference between a temporal change in the displacement position and the relative position and detecting a zero value for the difference.
3. The method according to claim 1 , wherein the bonding force is determined as a function of the relative position of the ultrasound generating device with respect to the carrier and comprises a bond path force component dependent on the relative position of the ultrasound generating device with respect to the carrier.
4. The method according to claim 3 , wherein the bonding force is additively derived from a bonding basic force component applied to the ultrasound head and the bond path force component.
5. The method according to claim 4 , wherein a known and linear dependency is present between the bonding force and/or the bond path force component and the relative position of the ultrasound generating device with respect to the carrier.
6. The method according to claim 3 , wherein the bond path force component is applied and/or settable by an actuator.
7. The method according to claim 1 , wherein the ultrasound generating device is pressed against the carrier by a supporting force, the supporting force being determined for the contact point in time.
8. The method according to claim 7 , wherein the supporting force is measured at the contact point in time and/or continuously.
9. The method according to claim 4 , wherein a closing force is determined for the contact point in time, which is applied to close the gap between the connection conductor and the bonding component.
10. The method according to claim 9 , wherein the closing force is determined as a sum of a bonding basic force component and the bond path force component at the contact point in time.
11. The method according to claim 7 , wherein a process force active between the connection conductor and the bonding component, during an establishment of an ultrasonic bond between the connection conductor and the bonding component, is determined from the bonding force and the supporting force and/or a closing force determined for the contact point in time, the closing force being applied to close the gap between the connection conductor and the bonding component.
12. The method according to claim 11 , wherein the process force is determined as a difference between the bonding force and the closing force.
13. The method according to claim 1 , wherein the relative position and/or the displacement position is/are detected by measuring.
14. The method according to claim 1 , wherein after the contact point in time, the ultrasound generating device is activated so that the ultrasonic tool is excited to ultrasonic vibrations.
15. The method according to claim 1 , wherein the ultrasonic bonding apparatus is provided to electrically conductively bond the connection conductor to the bonding region of the bonding component, wherein the bonding component is a power electronics assembly.