Compression structures for IC packages
Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.
1. An electronic device comprising: a board; a component attached to a first side of the board; an edge bond between a corner of the component and the first side of the board; a first housing portion; and a first compressible support between the component and the first housing portion.
2. The electronic device of claim 1 wherein the board comprises a printed circuit board.
3. The electronic device of claim 2 wherein the component is attached to the board by a plurality of solder-ball contacts.
4. The electronic device of claim 3 wherein the first compressible support extends from the component to the first housing portion.
5. The electronic device of claim 4 wherein the first compressible support comprises foam.
6. The electronic device of claim 5 wherein the first compressible support is attached to the component using an adhesive.
7. The electronic device of claim 3 wherein the first compressible support comprises a spring.
8. The electronic device of claim 3 further comprising a second compressible support between a second side of the board and a second housing.
9. The electronic device of claim 3 wherein the first housing portion comprises a portion of enclosure that at least partially houses the electronic device.
10. The electronic device of claim 3 wherein the first compressible support extends from the component to a pillar formed as part of the first housing portion.
11. The electronic device of claim 10 wherein the first compressible support comprises foam.
12. The electronic device of claim 10 wherein the first compressible support comprises a spring.
13. An electronic device comprising: a board; a component attached to a first side of the board, wherein the component comprises an integrated circuit and a substrate; a loading structure attached to the first side of the board and having a beam portion extending over an edge of the component; and a compressible support in contact with the substrate of the component and extending to the beam portion of the loading structure.
14. The electronic device of claim 13 wherein the board comprises a printed circuit board and the component is attached to the board by a plurality of solder-ball contacts.
15. The electronic device of claim 14 further comprising an edge bond between a corner of the component and the board.
16. The electronic device of claim 15 wherein the compressible support comprises foam.
17. The electronic device of claim 15 wherein the compressible support comprises a spring.
18. The electronic device of claim 15 wherein the compressible support comprises a dashpot.
19. An electronic device comprising: a board; a component attached to a first side of the board; an edge bond between a corner of the component and the first side of the board; and a securing structure to secure the component to the board, wherein the securing structure comprises a spring finger having a first end attached to the board and including a bend, such that a second end of the spring finger contacts the component and provides a force to the component in the direction of the board.
20. The electronic device of claim 19 wherein the component comprises an integrated circuit and a substrate, and the second end of the spring finger contacts the substrate of the component.