Method of making a piezoelectric MEMS diaphragm microphone
A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.
1. A piezoelectric microelectromechanical systems diaphragm microphone, comprising:
a substrate defining an opening between a bottom end of the substrate and a top end of the substrate;
two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure that is substantially flat and deflect when the diaphragm structure is subjected to sound pressure via the opening in the substrate, the two or more piezoelectric film layers configured to reduce residual stress of the diaphragm structure, the diaphragm structure including a through hole that extends from a top surface of the diaphragm structure to a bottom surface of the diaphragm structure, the through hole configured to define a low frequency roll off for the microphone; and
one or more electrodes disposed over the diaphragm structure.
2. The microphone of claim 1 wherein the diaphragm structure has a circular shape.
3. The microphone of claim 2 wherein the one or more electrodes disposed over the diaphragm structure include a circumferential electrode disposed over a circumference of the diaphragm structure and a center electrode disposed generally over a center of the diaphragm structure, at least a portion of the center electrode spaced apart from the circumferential electrode.
4. The microphone of claim 1 wherein the diaphragm structure has a rectangular shape.
5. The microphone of claim 4 wherein the one or more electrodes disposed over the diaphragm structure include a plurality of side electrodes disposed adjacent corresponding side edges of the diaphragm structure, the plurality of side electrodes spaced apart from each other and disposed around an area of the diaphragm structure that extends between the plurality of side electrodes.
6. The microphone of claim 1 wherein each of the one or more electrodes is divided into two or more electrode portions by one or more gaps between the electrode portions to provide a microphone with a desired sensitivity and capacitance.
7. The microphone of claim 6 wherein each pair of the two or more electrode portions is connected in series by a connection via.
8. The microphone of claim 1 further comprising a bottom electrode interposed between the substrate and the two or more piezoelectric film layers.
9. The microphone of claim 8 further comprising a a middle electrode interposed between two of the two or more piezoelectric film layers.
10. A radiofrequency module, comprising:
a printed circuit board including a substrate layer; and
one or more piezoelectric microelectromechanical systems diaphragm microphones mounted on the printed circuit board, each microphone including: a substrate defining an opening between a bottom end of the substrate and a top end of the substrate, two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure that is substantially flat, the two or more piezoelectric film layers configured to reduce residual stress of the diaphragm structure, and one or more electrodes disposed over the diaphragm structure, the diaphragm structure configured to deflect when the diaphragm structure is subjected to sound pressure via the opening in the substrate, the diaphragm structure including a through hole that extends from a top surface of the diaphragm structure to a bottom surface of the diaphragm structure, the through hole configured to define a low frequency roll off for the microphone.
11. The radiofrequency module of claim 10 wherein the diaphragm structure has a circular shape, the one or more electrodes disposed over the diaphragm structure include a circumferential electrode disposed over a circumference of the diaphragm structure and a center electrode disposed generally over a center of the diaphragm structure, at least a portion of the center electrode spaced apart from the circumferential electrode.
12. The radiofrequency module of claim 10 wherein the diaphragm structure has a rectangular shape, the one or more electrodes disposed over the diaphragm structure include a plurality of side electrodes disposed adjacent corresponding side edges of the diaphragm structure, the plurality of side electrodes spaced apart from each other and disposed around an area of the diaphragm structure that extends between the plurality of side electrodes.
13. The radiofrequency module of claim 10 wherein each of the one or more electrodes are divided into two or more electrode portions by one or more gaps between the electrode portions to provide a microphone with a desired sensitivity and capacitance, each pair of the two or more electrode portions are connected in series by a connection via.
14. The radiofrequency module of claim 10 further comprising a bottom electrode interposed between the substrate and the two or more piezoelectric film layers.
15. The radiofrequency module of claim 14 further comprising a middle electrode interposed between two of the two or more piezoelectric film layers.
16. A wireless mobile device comprising:
one or more antennas;
a front end system that communicates with the one or more antennas; and
one or more piezoelectric microelectromechanical systems diaphragm microphones mounted on a substrate layer, each microphone including: a substrate defining an opening between a bottom end of the substrate and a top end of the substrate, two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure that is substantially flat, the two or more piezoelectric film layers configured to reduce residual stress of the diaphragm structure, and one or more electrodes disposed over the diaphragm structure, the diaphragm structure configured to deflect when the diaphragm structure is subjected to sound pressure via the opening in the substrate, the diaphragm structure including a through hole that extends from a top surface of the diaphragm structure to a bottom surface of the diaphragm structure, the through hole configured to define a low frequency roll off for the microphone.
17. The wireless mobile device of claim 16 wherein the diaphragm structure has a circular shape, the one or more electrodes disposed over the diaphragm structure include a circumferential electrode disposed over a circumference of the diaphragm structure and a center electrode disposed generally over a center of the diaphragm structure, at least a portion of the center electrode spaced apart from the circumferential electrode.
18. The wireless mobile device of claim 16 wherein the diaphragm structure has a rectangular shape, the one or more electrodes disposed over the diaphragm structure include a plurality of side electrodes disposed adjacent corresponding side edges of the diaphragm structure, the plurality of side electrodes spaced apart from each other and disposed around an area of the diaphragm structure that extends between the plurality of side electrodes.
19. The wireless mobile device of claim 16 wherein each of the one or more electrodes are divided into two or more electrode portions by one or more gaps between the electrode portions to provide a microphone with a desired sensitivity and capacitance, each pair of the one or more electrodes are connected in series by a connection via.
20. The wireless mobile device of claim 16 further comprising a bottom electrode interposed between the substrate and the two or more piezoelectric film layers.