IP Library › Granted Patent US 12,401,112
Granted Patent B2
US 12,401,112 · App. 18/375,179 · Granted Aug 26, 2025

Electronic apparatus for stable electrical connection

Inventors: Myeongsu Oh (Suwon-si, KR); Yongyoun Kim (Suwon-si, KR); Duho Chu (Suwon-si, KR); Youngjune Hong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01Q1/243H01Q1/48H04M1/0216H04M1/0268H04M1/0277H05K1/0243H05K7/1427H05K2201/10098
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Quick Facts
Patent No.
US 12,401,112
App. No.
18/375,179
Granted
Aug 26, 2025
Kind
B2
Abstract

An electronic apparatus includes: a housing including a coupling region; and a printed circuit board (PCB) including: an overlap region that overlaps the coupling region; a non-overlap region that does not overlap the coupling region; a plurality of metal layers including a plurality of lines; and a void portion in which a portion of at least one metal layer, among the plurality of metal layers, is not formed so that the at least one metal layer is discontinuous or terminated in the void portion, the at least one metal layer including a metal layer that is closest to the coupling region among the plurality of metal layers.

Claims (33)

1. An electronic device comprising:

a housing comprising a coupling region; and

a printed circuit board (PCB) comprising:

an overlap region that overlaps the coupling region;

a non-overlap region that does not overlap the coupling region;

a plurality of metal layers comprising a plurality of lines; and

a void portion in which a portion of at least one metal layer, among the plurality of metal layers, is not formed so that the at least one metal layer is discontinuous or terminated in the void portion, the at least one metal layer including a metal layer that is closest to the coupling region among the plurality of metal layers.

2. The electronic device of claim 1 , wherein the at least one metal layer does not include a metal layer that is farthest from the coupling region among the plurality of metal layers.

3. The electronic device of claim 1 , wherein the void portion is in the non-overlap region, and the at least one metal layer includes only the metal layer that is closest to the coupling region.

4. The electronic device of claim 1 , wherein the plurality of lines is provided in both the overlap region and the non-overlap region.

5. The electronic device of claim 1 , further comprising:

an antenna comprising a ground portion,

wherein the ground portion is electrically connected to the metal layer that is closest to the coupling region among the plurality of metal layers.

6. The electronic device of claim 1 , further comprising:

an antenna,

wherein the housing comprises an accommodating portion configured to accommodate the antenna,

wherein the coupling region is at a boundary of the accommodating portion.

7. The electronic device of claim 1 , wherein the plurality of lines are lines through which signals pass.

8. The electronic device of claim 1 , further comprising:

an antenna comprising a ground portion that is connected to the plurality of lines or forms at least a portion of the plurality of lines.

9. The electronic device of claim 1 , wherein the housing has a bottom surface comprising the coupling region and a non-coupling region that is different from the coupling region, and

wherein the housing further comprises a protruding rib that protrudes from the coupling region of the bottom surface and contacts the PCB.

10. The electronic device of claim 9 , wherein the housing further comprises:

a hole formed on the protruding rib; and

a fixing member coupled to the hole and configured to fix the PCB to the protruding rib.

11. The electronic device of claim 9 , wherein the protruding rib comprises a burr contacting the metal layer that is closest to the coupling region.

12. The electronic device of claim 1 , wherein the PCB further comprises at least one dielectric layer on or under at least one metal layer among the plurality of metal layers.

13. The electronic device of claim 1 , wherein the void portion is in the non-overlap region.

14. The electronic device of claim 1 , wherein the void portion is in at least a portion of the overlap region and at least a portion of the non-overlap region.

15. The electronic device of claim 1 , wherein the housing further comprises a first housing comprising the coupling region and a second housing, and

wherein the electronic device comprises:

a hinge structure connecting the first housing and the second housing; and

a display comprising a first area disposed in the first housing, a second area disposed in the second housing, and a flexible area between the first area and the second area.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2023
From: OH, MYEONGSU; KIM, YONGYOUN; CHU, DUHO; HONG, YOUNGJUNE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 065102/0104 →
Priority Claims (1)
KR 10-2021-0046941 · Apr 12, 2021 · national
Continuity (2)
Continuation PCTKR2022003839 · Mar 18, 2022
Related Publication 20240030590A1 · Jan 25, 2024
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