IP Library Granted Patent US 12,402,409
Granted Patent B2
US 12,402,409 · App. 18/234,678 · Granted Aug 26, 2025

Semiconductor integrated circuit device

Inventor: Hiroyuki Shimbo (Yokohama, JP)
Assignee: SOCIONEXT INC.
H10D84/907H10D62/10H10D84/85H10D89/10H10D84/0186H10D84/038H10D84/912H10D84/961H10D84/964H10D84/966
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,402,409
App. No.
18/234,678
Granted
Aug 26, 2025
Kind
B2
Abstract

Provided is a semiconductor integrated circuit device including a nanowire field effect transistor (FET) and having a layout configuration effective for making manufacturing the device easy. A standard cell having no logical function is disposed adjacent to a standard cell having a logical function. The standard cell includes nanowire FETs having nanowires and pads. The standard cell further includes dummy pads, which have no contribution to a logical function of a circuit.

Claims (72)

1. A semiconductor integrated circuit device, comprising:

a first standard cell including a first nanowire field effect transistor (FET) in a first type transistor area and a second nanowire FET in a second type transistor area and having a logical function; and

a second standard cell disposed adjacent to the first standard cell in a first direction,

wherein the first nanowire FET includes:

a first pad and a second pad,

a plurality of first nanowires extending in the first direction and each connected to the first and second pads,

the second nanowire FET includes:

a third pad and a fourth pad,

a plurality of second nanowires extending in the first direction and each connected to the third and fourth pads, and

the second standard cell includes:

a first dummy pad and a second dummy pad in the first type transistor area,

a plurality of third nanowires extending in the first direction and each connected to the first and second dummy pads,

a third dummy pad and a fourth dummy pad in the second type transistor area, and

a plurality of fourth nanowires extending in the first direction and each connected to the third and fourth dummy pads,

the first, second, third and fourth dummy pads, the plurality of third nanowires and the plurality of fourth nanowires having no contribution to a logical function of a circuit, and

the first pad and the second pad are arranged at a first pitch in the first direction, the third pad and the fourth pad are arranged at the first pitch in the first direction, the first dummy pad and the second dummy pad are arranged at the first pitch in the first direction, and the third dummy pad and the fourth dummy pad are arranged at the first pitch in the first direction.

2. The semiconductor integrated circuit device of claim 1 , the first standard cell further comprising:

a fifth pad, and

a plurality of fifth nanowires extending in the first direction and each connected to the second and fifth pads,

the second pad and the fifth pad are arranged at the first pitch in the first direction.

3. The semiconductor integrated circuit device of claim 1 , the first standard cell further comprising a first gate line extending in a second direction perpendicular to the first direction and surrounding a periphery of the plurality of first nanowires, and a second gate line extending in the second direction and surrounding a periphery of the plurality of second nanowires.

4. The semiconductor integrated circuit device of claim 3 , the plurality of first nanowires are arranged in a third direction perpendicular to the first and second direction, and the plurality of second nanowires are arranged in the third direction.

5. The semiconductor integrated circuit device of claim 3 , the second standard cell further comprising a first dummy gate line extending in the second direction between the first dummy pad and the second dummy pad and a second dummy gate line extending in the second direction between the third dummy pad and the fourth dummy pad.

6. A semiconductor integrated circuit device, comprising:

a first standard cell including a first nanowire field effect transistor (FET) in a first type transistor area and a second nanowire FET in a second type transistor area and having a logical function; and

a cell-row-terminating cell disposed adjacent to the first standard cell in a first direction,

wherein the first nanowire FET includes:

a first pad and a second pad, and

a plurality of first nanowires extending in the first direction and each connected to the first and second pads,

the second nanowire FET includes:

a third pad and a fourth pad, and

a plurality of second nanowires extending in the first direction and each connected to the third and fourth pads, and

the cell-row-terminating cell includes:

a first dummy pad and a second dummy pad in the first type transistor area,

a plurality of third nanowires extending in the first direction and each connected to the first and second dummy pads,

a third dummy pad and a fourth dummy pad in the second type transistor area, and

a plurality of fourth nanowires extending in the first direction and each connected to the third and fourth dummy pads,

the first, second, third and fourth dummy pads, the plurality of third nanowires and the plurality of fourth nanowires having no contribution to a logical function of a circuit, and

the first pad and the second pad are arranged at a first pitch in the first direction, the third pad and the fourth pad are arranged at the first pitch in the first direction, the first dummy pad and the second dummy pad are arranged at the first pitch in the first direction, and the third dummy pad and the fourth dummy pad are arranged at the first pitch in the first direction.

7. The semiconductor integrated circuit device of claim 6 , the first standard cell further comprising:

a fifth pad, and

a plurality of fifth nanowires extending in the first direction and each connected to the second and fifth pads,

the second pad and the fifth pad are arranged at the first pitch in the first direction.

8. The semiconductor integrated circuit device of claim 6 , the first standard cell further comprising a first gate line extending in a second direction perpendicular to the first direction and surrounding a periphery of the plurality of first nanowires, and a second gate line extending in the second direction and surrounding a periphery of the plurality of second nanowires.

9. The semiconductor integrated circuit device of claim 8 , the plurality of first nanowires are arranged in a third direction perpendicular to the first and second direction, and the plurality of second nanowires are arranged in the third direction.

10. The semiconductor integrated circuit device of claim 8 , the cell-row-terminating cell further comprising a first dummy gate line extending in the second direction between the first dummy pad and the second dummy pad and a second dummy gate line extending in the second direction between the third dummy pad and the fourth dummy pad.

11. A semiconductor integrated circuit device, comprising:

a first standard cell including a first nanowire field effect transistor (FET) in a first type transistor area and a second nanowire FET in a second type transistor area and having a logical function; and

a second standard cell disposed adjacent to the first standard cell in a first direction,

wherein the first nanowire FET includes:

a first pad and a second pad, and

a plurality of first nanowires extending in the first direction and each connected to the first and second pads,

the second nanowire FET includes:

a third pad and a fourth pad, and

a plurality of second nanowires extending in the first direction and each connected to the third and fourth pads, and

the second standard cell includes:

a first dummy pad and a second dummy pad in the first type transistor area,

a plurality of third nanowires extending in the first direction and each connected to the first and second dummy pads,

a third dummy pad and a fourth dummy pad in the second type transistor area, and

a plurality of fourth nanowires extending in the first direction and each connected to the third and fourth dummy pads,

the first, second, third and fourth dummy pads, the plurality of third nanowires and the plurality of fourth nanowires having no contribution to a logical function of a circuit, and

the first standard cell is supplied with first and second power supply potentials, and the first dummy pad is supplied with the first power supply potential.

12. The semiconductor integrated circuit device of claim 11 , the first standard cell further comprising:

a fifth pad, and

a plurality of fifth nanowires extending in the first direction and each connected to the second and fifth pads,

the second pad and the fifth pad are arranged at the first pitch in the first direction.

13. The semiconductor integrated circuit device of claim 11 , the first standard cell further comprising a first gate line extending in a second direction perpendicular to the first direction and surrounding a periphery of the plurality of first nanowires, and a second gate line extending in the second direction and surrounding a periphery of the plurality of second nanowires.

14. The semiconductor integrated circuit device of claim 13 , the plurality of first nanowires are arranged in a third direction perpendicular to the first and second direction, and the plurality of second nanowires are arranged in the third direction.

15. The semiconductor integrated circuit device of claim 13 , the second standard cell further comprising a first dummy gate line extending in the second direction between the first dummy pad and the second dummy pad and a second dummy gate line extending in the second direction between the third dummy pad and the fourth dummy pad.

16. The semiconductor integrated circuit device of claim 11 , wherein the first pad and the second pad are arranged at a first pitch in the first direction, the third pad and the fourth pad are arranged at the first pitch in the first direction, the first dummy pad and the second dummy pad are arranged at the first pitch in the first direction, and the third dummy pad and the fourth dummy pad are arranged at the first pitch in the first direction.

17. The semiconductor integrated circuit device of claim 11 , wherein the third dummy pad is supplied with the second power supply potential.

18. The semiconductor integrated circuit device of claim 15 , wherein the first dummy gate line is supplied with the second power supply potential.

Priority Claims (1)
JP 2016-151125 · Aug 1, 2016 · national
Continuity (5)
Continuation 17887913 · Aug 15, 2022
Continuation 17104563 · Nov 25, 2020
Continuation 16262183 · Jan 30, 2019
Continuation PCTJP2017024918 · Jul 7, 2017
Related Publication 20230395604A1 · Dec 7, 2023
References Cited (25)
US 10879270B2 · Shimbo · 2020 [cited by applicant]
US 11450688B2 · Shimbo · 2022 [cited by applicant]
US 11764224B2 · Shimbo · 2023 [cited by examiner]
US 20100044755A1 · Tsuda et al. · 2010 [cited by applicant]
US 20110057163A1 · Liu et al. · 2011 [cited by applicant]
US 20150014775A1 · Seo et al. · 2015 [cited by applicant]
US 20160079358A1 · Doornbos et al. · 2016 [cited by applicant]
US 20160190138A1 · Shimbo · 2016 [cited by applicant]
CN 104282655A · 2015 [cited by applicant]
CN 105531813A · 2016 [cited by applicant]
JP 2015015502A · 2015 [cited by applicant]
JP 2015019067A · 2015 [cited by applicant]
WO 2009150999A1 · 2009 [cited by applicant]
WO 2015033490A1 · 2015 [cited by applicant]
S. Bangsaruntip, et al. “High performance and highly uniform gate-all-around silicon nanowire MOSFETs with wire size dependent scaling”, Electron Devices Meeting (IEDM), 2009 IEEE International, Jan. 2010, pp. 297-300. [cited by applicant]
I. Lauer, et al. “Si Nanowire CMOS Fabricated with Minimal Deviation from RMG Fin FET Technolody Showing Record Performance”, 2015 Symposium on VLSI Technology Digest of Technical Papers (Abstract). [cited by applicant]
International Search Report issued in Application No. PCT/JP2017/024918 dated Sep. 26, 2017, with English translation. [cited by applicant]
Written Opinion issued in Application No. PCT/JP2017/024918 dated Sep. 26, 2017, with partial English translation. [cited by applicant]
Non-Final Office Action issued in U.S. Appl. No. 16/262,183 dated Mar. 27, 2020. [cited by applicant]
Notice of Allowance issued in U.S. Appl. No. 16/262,183 dated Aug. 26, 2020. [cited by applicant]
Non-Final Office Action issued in U.S. Appl. No. 17/104,563 dated Mar. 24, 2022. [cited by applicant]
Notice of Allowance issued in U.S. Appl. No. 17/104,563 dated May 24, 2022. [cited by applicant]
Chinese Office Action issued in Chinese Application No. 201780045986.6 on Sep. 5, 2022, with partial English translation. [cited by applicant]
Notice of Allowance issued in U.S. Appl. No. 17/887,913, dated May 24, 2023. [cited by applicant]
Non-Final Office Action issued in U.S. Appl. No. 17/887,913, dated Mar. 2, 2023. [cited by applicant]