Control program, container and semiconductor device manufacturing system for charging of wafer type sensor and auto teaching
The present disclosure provides a control device for charging and auto teaching of a wafer type sensor, a control program executed by the control device, a wafer type sensor storage device, a wafer type sensor charging device, and a semiconductor device manufacturing facility. The control program is a program executed by a control device equipped with a processor, and monitors a semiconductor device manufacturing facility and its part using a wafer type sensor, and monitors the remaining battery level of the wafer type sensor.
1. A substrate processing system comprising:
a load port module configured to dispose a container which loads a sensor;
an Equipment Front End Module (EFEM) including a first transfer robot which transfers the sensor from the load port module;
a load lock chamber configured to connect to the EFEM and switching between a first environment, which is an atmospheric pressure environment, and a second environment, which is a vacuum environment;
a transfer chamber including a second transfer robot which transfers the sensor from the load lock chamber; and
a process chamber configured to connect to the transfer chamber and including an Electrostatic Chuck (ESC) and a focus ring surrounding an outer surface of the ESC,
wherein the sensor configured to be charged wirelessly based on a power of the substrate processing system,
wherein the container includes a charging unit for charging the sensor loaded on a slot therein and a contact unit configured to contact with a charging device,
wherein the charging unit is configured to charge the sensor using a magnetic resonance method,
wherein the charging device includes a power output terminal configured to supply a power for charging of the sensor,
wherein the charging unit is disposed on an upper surface of the container,
wherein the contact unit is disposed on a lower surface of the container, and
wherein the power output terminal is disposed on the load port module.
2. The substrate processing system of claim 1 ,
the container includes a plurality of slots therein, and
the sensor and a processed wafer are loaded into different slots.
3. The substrate processing system of claim 1 ,
wherein the container is equipped with the sensor configured to sense at least a part of a semiconductor device manufacturing facility and a control module,
wherein the container comprises a communication module, the control module configured to control the communication module to communicate information on a state of charge of the sensor to a control device, and
wherein the control module is configured to charge the sensor using the load port module having the battery charging device in response to receiving an instruction from the control device regarding a monitoring result of a remaining battery level of the sensor.
4. The substrate processing system of claim 1 ,
wherein the container comprises a plurality of slots installed in a vertical direction inside the container.
5. The substrate processing system of claim 1 , wherein the container comprises:
a first slot installed inside the container; and
a second slot installed under the first slot,
wherein different objects are mounted in the first slot and the second slot.
6. The substrate processing system of claim 1 , wherein the container charges the sensor using at least one of a magnetic resonance method and an electromagnetic induction method.
7. The substrate processing system of claim 1 , wherein the sensor is mounted in the container for charging the sensor.
8. The substrate processing system of claim 1 , wherein the charging device comprises,
a power supply module for supplying first power;
a power conversion module installed inside the load port module and for converting the first power into second power; and
a power output terminal installed above the load port module and connected to a connector of the container.