Semiconductor substrate processing apparatus with a temperature sensor to measure the temperature of a bearing
A semiconductor substrate processing apparatus is provided with a reaction chamber; a heater to heat the reaction chamber; and a substrate support assembly. The substrate support assembly comprising: a substrate support defining an outer support surface for supporting a substrate or substrate carrier in the reaction chamber; and a base assembly including a door for sealing the reaction chamber of the apparatus. The substrate support being connected to the base assembly through a bearing that facilitates rotation of the substrate support. The substrate support assembly is provided with a temperature sensor to measure the temperature of the bearing.
1. A semiconductor substrate processing apparatus, comprising:
a reaction chamber;
a heater to heat the reaction chamber; and,
a substrate support assembly, comprising:
a substrate support defining an outer support surface for supporting a substrate or a substrate carrier in the reaction chamber; and
a base assembly including a door for sealing the reaction chamber of the semiconductor substrate processing apparatus, the substrate support being connected to the base assembly through a bearing that facilitates rotation of the substrate support relative to the base assembly around a rotation axis,
wherein the substrate support assembly is provided with a temperature sensor constructed and arranged to measure the temperature of the bearing,
wherein the temperature sensor is provided to the door and operably connected to an alarm system,
wherein the temperature sensor is operably connected to a door contact pad provided to the door, and
wherein the temperature sensor is a resistance temperature sensor operably connected to two door contact pads provided to the door so that the electrical resistance between the two door contact pads is a function of the temperature.
2. The apparatus according to claim 1 , wherein the bearing is a roller bearing comprising circular and coaxial races.
3. The apparatus according to claim 2 , wherein the substrate support is supported on a downwardly protruding drive shaft that extends through a passage through the door, and the bearing engages an outer circumference of the downwardly protruding drive shaft.
4. The apparatus according to claim 3 , wherein the downwardly protruding drive shaft is operationally connected to a rotation motor to rotate the downwardly protruding drive shaft, the substrate support defining an outer support surface for supporting a substrate and/or substrate carrier thereon in the reaction chamber.
5. The apparatus according to claim 1 , wherein the temperature sensor is operably connected to an alarm system.
6. The apparatus according to claim 5 , wherein the alarm system comprises a processor and a memory.
7. The apparatus according to claim 6 , wherein the memory is constructed and arranged to store an overheating temperature and the processor compares the temperature of the temperature sensor with the overheating temperature stored in the memory to signal an alarm when the temperature indicated by the temperature sensor is higher than the stored overheating temperature.
8. The apparatus according to claim 1 , wherein the reaction chamber defines a reaction space and an opening via which the substrate support assembly is at least partly receivable in said reaction chamber, such that, in a received state of the substrate support assembly, a substrate and/or the substrate carrier supported thereon is received in the reaction space and the door substantially seals said opening.
9. The apparatus according to claim 1 , wherein the apparatus is provided with an elevator comprising an elevator arm moveable in a substantially vertical direction to move the substrate support assembly.
10. The apparatus according to claim 9 , wherein a top surface of the elevator arm is provided with an elevator arm contact pad constructed and arranged to engage with the door connection pad provided to the door.
11. The apparatus according to claim 10 , wherein the top surface of the elevator arm is provided with two elevator arm contact pads constructed and arranged to engage with the two door connection pads provided to the door.
12. The apparatus according to claim 11 , wherein the temperature sensor is operably connected to an alarm system comprising a processor and a memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity.
13. The apparatus according to claim 1 , wherein the temperature sensor is operably connected to an alarm system comprising a processor and a memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity and the memory is constructed and arranged to store an overheating temperature and the processor compares the temperature of the temperature sensor with the overheating temperature stored in the memory to signal an alarm when the temperature indicated by the temperature sensor is higher than the stored overheating temperature.
14. The apparatus according to claim 9 , wherein the elevator comprises a substantial vertical glider and ball-screw rotatable by an elevator motor to move the elevator arm in a substantially vertical direction to move the substrate support assembly.
15. The apparatus according to claim 9 , wherein the elevator arm is provided with the rotation motor constructed and arranged to rotate the downwardly protruding drive shaft and the substrate support for supporting a substrate or substrate carrier thereon in the reaction chamber.
16. A semiconductor substrate processing apparatus, comprising:
a reaction chamber;
a heater to heat the reaction chamber; and,
a substrate support assembly, comprising:
a substrate support defining an outer support surface for supporting a substrate or a substrate carrier in the reaction chamber; and
a base assembly including a door for sealing the reaction chamber of the semiconductor substrate processing apparatus, the substrate support being connected to the base assembly through a bearing that facilitates rotation of the substrate support relative to the base assembly around a rotation axis,
wherein the substrate support assembly is provided with a temperature sensor constructed and arranged to measure the temperature of the bearing,
wherein the temperature sensor is operably connected to an alarm system comprising a processor and a memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity and the memory is constructed and arranged to store an overheating temperature and the processor compares the temperature of the temperature sensor with the overheating temperature stored in the memory to signal an alarm when the temperature indicated by the temperature sensor is higher than the stored overheating temperature, and
wherein the memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity and the memory is constructed and arranged to store a below the range resistivity and the processor compares the resistivity of the temperature sensor with the below the range resistivity stored in the memory to signal the presence of the door without rotatable boat when the resistivity is below the range.
17. A semiconductor substrate processing apparatus, comprising:
a reaction chamber;
a heater to heat the reaction chamber; and,
a substrate support assembly, comprising:
a substrate support defining an outer support surface for supporting a substrate or a substrate carrier in the reaction chamber; and
a base assembly including a door for sealing the reaction chamber of the semiconductor substrate processing apparatus, the substrate support being connected to the base assembly through a bearing that facilitates rotation of the substrate support relative to the base assembly around a rotation axis,
wherein the substrate support assembly is provided with a temperature sensor constructed and arranged to measure the temperature of the bearing,
wherein the temperature sensor is operably connected to an alarm system comprising a processor and a memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity and the memory is constructed and arranged to store an overheating temperature and the processor compares the temperature of the temperature sensor with the overheating temperature stored in the memory to signal an alarm when the temperature indicated by the temperature sensor is higher than the stored overheating temperature, and
wherein the memory and the processor is constructed and arranged to measure a temperature as a function of the resistivity and the memory is constructed and arranged to store an above the range resistivity and the processor compares the resistivity of the temperature sensor with the above the range resistivity stored in the memory to signal the absence of the door when the resistivity is above the range.