Semiconductor devices having air spacer
A semiconductor device includes: a stack including a conductive structure and an insulation structure stacked on each other on a substrate, wherein the stack extends in a first direction substantially parallel to an upper surface of the substrate; first, second and third spacers sequentially stacked on each other on a sidewall of the stack in a second direction substantially parallel to the upper surface of the substrate and crossing the first direction; and a capping pattern disposed on the second spacer, wherein: the second spacer is an air spacer including air, and an upper surface of a portion of the third spacer is substantially coplanar with an upper surface of the capping pattern.
1. A semiconductor device comprising:
a stack including a conductive structure and an insulation structure stacked on each other on a substrate, wherein the stack extends in a first direction substantially parallel to an upper surface of the substrate;
first, second and third spacers sequentially stacked on each other on a sidewall of the stack in a second direction substantially parallel to the upper surface of the substrate and crossing the first direction; and
a capping pattern disposed on the second spacer,
wherein:
the second spacer is an air spacer including air, and
an upper surface of a portion of the third spacer is substantially coplanar with an upper surface of the capping pattern.
2. The semiconductor device according to claim 1 , wherein the first and third spacers include a nitride, and the capping pattern includes an oxide.
3. The semiconductor device according to claim 1 , further comprising a fourth spacer disposed on the capping pattern and the third spacer, wherein the fourth spacer contacts an outer sidewall of the first spacer.
4. The semiconductor device according to claim 1 , wherein the conductive structure includes first, second and third conductive patterns sequentially stacked in a vertical direction with respect to the upper surface of the substrate,
wherein the first conductive pattern includes doped polysilicon, wherein the second conductive pattern includes a metal nitride, and wherein the third conductive pattern includes a metal.
5. The semiconductor device according to claim 1 , wherein the insulation structure includes first, second and third insulation patterns sequentially stacked in a vertical direction with respect to the upper surface of the substrate, and
wherein each of the first to third insulation patterns includes silicon nitride.
6. The semiconductor device according to claim 1 , wherein the first spacer entirely covers the sidewall of the stack in the second direction, and the second spacer overlaps in the second direction a central sidewall of the stack.
7. The semiconductor device according to claim 6 , further comprising first and second insulation patterns disposed between the first spacer and the second spacer,
wherein the first insulation pattern includes silicon oxide, and the second insulation pattern includes silicon nitride.
8. The semiconductor device according to claim 1 , further comprising a contact plug structure disposed on a portion of the substrate adjacent to the stack in the second direction,
wherein the contact plug structure includes a lower contact plug, a metal silicide pattern and an upper contact plug sequentially stacked on each other in a vertical direction with respect to the upper surface of the substrate.
9. The semiconductor device according to claim 8 , wherein an upper surface of the metal silicide pattern is substantially coplanar with or higher than an upper surface of the capping pattern.
10. A semiconductor device comprising:
an active pattern disposed on a substrate;
a gate structure buried in an upper portion of the active pattern, wherein the gate structure extends in a first direction parallel to an upper surface of the substrate;
a bit line structure disposed on the active pattern and extending in a second direction parallel to the upper surface of the substrate and substantially perpendicular to the first direction;
first, second and third spacers sequentially stacked on each other in the first direction on a sidewall of the bit line structure;
a capping pattern disposed on the second spacer;
a fourth spacer disposed on the capping pattern and the third spacer, wherein the fourth spacer contacts an outer sidewall of the first spacer;
a contact plug structure disposed on an upper surface of each end portion of the active pattern; and
a capacitor disposed on the contact plug structure,
wherein:
the second spacer is an air spacer including air, and
an upper surface of a portion of the third spacer, which is adjacent to the capping pattern, is substantially coplanar with an upper surface of the capping pattern.
11. The semiconductor device according to claim 10 , wherein the contact plug structure includes a lower contact plug, a metal silicide pattern and an upper contact plug sequentially stacked on each other, and
wherein an upper surface of the metal silicide pattern is substantially coplanar with or higher than the upper surface of the capping pattern.
12. The semiconductor device according to claim 10 , wherein the bit line structure includes a conductive structure and an insulation structure stacked on each other on the substrate, and
wherein the first spacer entirely covers the sidewall in the second direction, and the second spacer overlaps in the second direction a central sidewall of the bit line structure.