Method for cleaning a chamber
A method for cleaning a plasma processing chamber comprising one or more cycles is provided. Each cycle comprises performing an oxygen containing plasma cleaning phase, performing a volatile chemistry type residue cleaning phase, and performing a fluorine containing plasma cleaning phase.
1. A method for cleaning a plasma processing chamber comprising one or more cycles, wherein each cycle comprises:
i) performing an oxygen containing plasma cleaning phase:
ii) performing a volatile chemistry type residue cleaning phase that removes metal containing residue containing at least one of cobalt, iron, palladium, platinum, and iridium, comprising:
heating the plasma processing chamber to a temperature of at least 100° C.; and
flowing a ligand vapor into the plasma processing chamber, wherein the ligand vapor forms a ligand complex with the at least one of cobalt, iron, palladium, platinum, and iridium, wherein the ligand complex vaporizes at a temperature of at least 100° C.; and
iii) performing a fluorine containing plasma cleaning phase.
2. The method as recited in claim 1 , wherein the cleaning is performed after processing a first wafer in the plasma processing chamber and before processing a second wafer in the plasma processing chamber.
3. The method as recited in claim 1 , wherein a covering is placed in the plasma processing chamber before the cleaning.
4. The method as recited in claim 1 , wherein the oxygen containing plasma cleaning phase comprises flowing an oxygen containing gas into the plasma processing chamber and forming the oxygen containing gas into a plasma.
5. The method as recited in claim 1 , wherein the fluorine containing plasma cleaning phase comprises flowing a fluorine containing gas into the plasma processing chamber and forming the fluorine containing gas into a plasma.
6. The method, as recited in claim 1 , wherein the cleaning the plasma processing chamber further comprises a metal halide residue cleaning phase after the fluorine containing plasma phase.
7. The method, as recited in claim 6 , wherein the metal halide residue cleaning phase comprises:
flowing hydrogen containing gas into the plasma processing chamber; and
forming the hydrogen containing gas into a plasma.
8. The method, as recited in claim 6 , wherein the metal halide residue cleaning phase further comprises a metal halide pump out.
9. The method, as recited in claim 1 , wherein the cleaning the plasma processing chamber further comprises a fluorine residue pump out phase after the fluorine containing plasma phase.
10. The method, as recited in claim 1 , further comprising a volatile chemistry residue pump out phase after the volatile chemistry residue cleaning phase.
11. The method, as recited in claim 1 , wherein the oxygen containing plasma phase volatilizes ruthenium containing residue and oxidizes metal containing residues, containing at least one of iron and cobalt forming at least one of iron oxide and cobalt oxide, and wherein the oxygen containing plasma cleaning phase is before performing the volatile chemistry residue cleaning phase and wherein the volatile chemistry residue cleaning phase is performed before the fluorine containing plasma cleaning phase.
12. The method, as recited in claim 1 , wherein the volatile chemistry residue cleaning phase comprises:
flowing a chlorine containing gas into the plasma processing chamber; and
forming the chlorine containing gas into a plasma.
13. The method, as recited in claim 12 , wherein the chlorine containing gas comprises (i) Cl 2 , BCl 3 , TiCl 4 , SiCl 4 , SiHCl 3 , SiH 2 Cl 2 , SiH 3 Cl, or PF 3 , or any combination thereof, and (ii) PCl 3 .
14. The method, as recited in claim 1 , wherein the ligand vapor comprises at least one of acetylacetone (acac), hexafluoroacetylacetone (hfac), metal acetylacetonates, and amidines and wherein the volatile chemistry residue cleaning is a plasmaless process.
15. The method, as recited in claim 1 , wherein the volatile chemistry residue cleaning phase, comprises:
flowing a volatile chemistry gas comprising CO, H 2 O, methanol (MeOH), or formic acid, or any combination thereof, into the plasma processing chamber; and
forming the volatile chemistry gas into a plasma.
16. The method, as recited in claim 1 , wherein the volatile chemistry residue cleaning phase comprises:
flowing a volatile chemistry gas, comprising CO, H 2 O, NH 3 , methanol (MeOH), or formic acid, or any combination thereof into the plasma processing chamber; and
forming the volatile chemistry gas into a plasma.
17. The method, as recited in claim 1 , wherein the oxygen containing gas comprises O 2 , O 3 , CO, CO 2 , or H 2 O, or any combination thereof.
18. The method, as recited in claim 1 , wherein the volatile chemistry residue cleaning phase volatilizes at least one metal containing residue containing at least one of cobalt, iron, palladium, platinum, and iridium.
19. The method, as recited in claim 1 , wherein the fluorine containing gas comprises NF 3 , SF 6 , or CF 4 , or any combination thereof.
20. A method for processing a plurality of process wafers in a plasma processing chamber, comprising a plurality of cycles, wherein each cycle comprises:
a) processing a process wafer of the plurality of process wafers in the plasma processing chamber;
b) cleaning the plasma processing chamber, comprising:
i) an oxygen containing plasma phase
ii) a volatile chemistry residue cleaning phase that removes metal containing residue containing at least one of cobalt, iron, palladium, platinum, and iridium, comprising:
heating the plasma processing chamber to a temperature of at least 100° C.; and
flowing a ligand vapor into the plasma processing chamber, wherein the ligand vapor forms a ligand complex with the at least one of cobalt, iron, palladium, platinum, and iridium, wherein the ligand complex vaporizes at a temperature of at least 100° C.; and
iii) a fluorine containing plasma phase.
21. The method as recited in claim 20 , further comprising removing the process wafer from the plasma processing chamber.
22. The method as recited in claim 20 , further comprising placing a covering in the plasma processing chamber.