IP Library › Granted Patent US 12,422,170
Granted Patent B2
US 12,422,170 · App. 17/802,055 · Granted Sep 23, 2025

Heat pump

Inventors: Youngmin Lee (Seoul, KR); Jihyeong Ryu (Seoul, KR); Eunjun Cho (Seoul, KR); Minsoo Kim (Seoul, KR)
Assignee: LG ELECTRONICS INC.
F25B13/00F25B41/26F25B41/31F25B2500/09
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Quick Facts
Patent No.
US 12,422,170
App. No.
17/802,055
Granted
Sep 23, 2025
Kind
B2
Abstract

A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flows; a compressor connected with the second pipe and that compresses the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with outdoor air; a bypass pipe branched from first pipe and configured to exchange heat with the second heat exchanger; and a three-way valve that directs the first refrigerant to pass through the bypass pipe. When the outdoor heat exchanger operates as an evaporator, frost formation thereon may be prevented.

Claims (21)

1. A heat pump, comprising:

a first pipe in which a first refrigerant flows;

a second pipe disposed at a side of the first pipe and in which a second refrigerant flows;

a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant;

a boiler connected with the first pipe and in which the first refrigerant flows;

a compressor connected with the second pipe and that compresses the second refrigerant;

a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with an outdoor air;

a bypass pipe branched from the second pipe and spaced apart from a first side of the second heat exchanger to perform exchange heat with the second heat exchanger;

a blowing fan disposed on a second side of the second heat exchanger, opposite to the first side, to form an air flow through the second heat exchanger; and

a three-way valve that directs the second refrigerant to pass through the bypass pipe, wherein a first flow path of the three-way valve is connected with the second pipe, a second flow path of the three-way valve is connected with the second heat exchanger, and a third flow path of the three-way valve joins to the second flow path via the bypass pipe, wherein the heat pump operates in a heating mode, in which the second refrigerant discharged from the compressor flows to the first heat exchanger, and in a cooling mode, in which the second refrigerant discharged from the compressor flows to the second heat exchanger, and wherein in the heating mode, the second refrigerant discharged from the first heat exchanger is sent to the bypass pipe.

2. The heat pump according to claim 1 , further comprising:

an accumulator disposed between the compressor and the second heat exchanger.

3. The heat pump according to claim 2 , further comprising:

an expansion valve disposed between the second pipe and the second heat exchanger.

4. The heat pump according to claim 3 , further comprising:

a four-way valve disposed between the compressor, the first heat exchanger, the accumulator, and the second heat exchanger and configured to change a flow direction of the second refrigerant between the compressor, the first heat exchanger, the accumulator, and the second heat exchanger.

5. The heat pump according to claim 3 , wherein the first heat exchanger comprises a plate heat exchanger.

6. The heat pump according to claim 5 , wherein the first refrigerant comprises water.

7. The heat pump according to claim 5 , wherein the second refrigerant comprises either R32 or R290, or a mixture thereof.

8. The heat pump according to claim 5 , further comprising:

a muffler disposed between the four-way valve and the compressor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2024
From: LEE, YOUNGMIN; RYU, JIHYEONG; CHO, EUNJUN; KIM, MINSOO
To: LG ELECTRONICS INC.
Reel/Frame 069621/0695 →
Priority Claims (1)
KR 10-2020-0023201 · Feb 25, 2020 · national
Continuity (1)
Related Publication 20230101537A1 · Mar 30, 2023
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