Semiconductor package and manufacturing method thereof
A semiconductor package includes: a package substrate; a semiconductor chip mounted above the package substrate; a chip connection terminal interposed between the semiconductor chip and the package substrate; an adhesive layer disposed on the package substrate and that covers a side and a top surface of the semiconductor chip and surrounds the chip connection terminal between the semiconductor chip and the package substrate; a molding layer disposed on the package substrate and that surrounds the adhesive layer; an interposer mounted on the adhesive layer and the molding layer, where the interposer includes an interposer substrate; and a conductive pillar disposed on the package substrate, where the conductive pillar surrounds the side of the semiconductor substrate, penetrates the molding layer in a vertical direction and connects the package substrate to the interposer substrate.
1. A semiconductor package, comprising:
a package substrate;
a semiconductor chip mounted above the package substrate;
a chip connection terminal interposed between the semiconductor chip and the package substrate and that connects the semiconductor chip to the package substrate;
an adhesive layer disposed on the package substrate, wherein the adhesive layer covers a side and a top surface of the semiconductor chip and surrounds the chip connection terminal between the semiconductor chip and the package substrate;
a molding layer disposed on the package substrate and that surrounds the adhesive layer, wherein a material of the molding layer differs from a material of the adhesive layer so that a boundary surface forms where the molding layer and the adhesive layer contact each other;
an interposer mounted on the adhesive layer and the molding layer, wherein the interposer includes an interposer substrate; and
a conductive pillar disposed on the package substrate, wherein the conductive pillar surrounds the side of the semiconductor chip and penetrates the molding layer in a vertical direction and connects the package substrate to the interposer substrate.
2. The semiconductor package of claim 1 , wherein the adhesive layer comprises:
a first adhesive portion interposed between the package substrate and the semiconductor chip and that covers the chip connection terminal;
a second adhesive portion disposed adjacent to the side of the semiconductor chip; and
a third adhesive portion interposed between the semiconductor chip and the interposer substrate.
3. The semiconductor package of claim 2 , wherein
the interposer substrate includes a trench formed in a bottom portion of the interposer substrate that accommodates at least a portion of the adhesive layer, and
at least a portion of the third adhesive portion of the adhesive layer is disposed in the trench.
4. The semiconductor package of claim 1 , wherein the adhesive layer comprises a material that softens but does not completely dissolve or melt when heat is applied thereto.
5. The semiconductor package of claim 4 , wherein the adhesive layer comprises a die adhesive film (DAF).
6. The semiconductor package of claim 1 , wherein a top surface of the adhesive layer, a top surface of the molding layer, and a bottom surface of the interposer substrate are coplanar.
7. The semiconductor package of claim 1 , wherein
the interposer substrate comprises:
an interposer insulating layer;
an interposer substrate pattern that extends in the interposer insulating layer; and
the interposer further comprises:
a first interposer substrate pad disposed on a bottom surface of the interposer insulating layer, is connected to the interposer substrate pattern, and is in contact with the conductive pillar; and
a second interposer substrate pad disposed on the top surface of the interposer insulating layer and is connected to the interposer substrate pattern.
8. The semiconductor package of claim 7 , wherein the interposer further comprises a plurality of interposers between the bottom surface of the interposer substrate and the semiconductor chip and that are spaced apart in a horizontal direction.