Display device including semiconductor light emitting device
A display device can include first and second assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed between the first assembly electrode and the second assembly electrode, an assembly barrier wall disposed on the first assembly electrode, the second assembly electrode, the insulating layer and having an assembly hole, an annealed light-transmitting electrode layer disposed on the first assembly electrode and a semiconductor light emitting device disposed in contact with the annealed light-transmitting electrode layer.
1. A display device comprising:
a first assembly electrode and a second assembly electrode spaced apart and disposed on a substrate;
an insulating layer disposed between the first assembly electrode and the second assembly electrode;
an assembly barrier wall having an assembly hole disposed on the first assembly electrode, the second assembly electrode, and the insulating layer;
an annealed light-transmitting electrode layer disposed on the insulating layer in the assembly hole and on the first assembly electrode; and
a semiconductor light emitting device disposed in contact with the annealed light-transmitting electrode layer.
2. The display device according to claim 1 , wherein a horizontal width of the annealed light-transmitting electrode layer is equal to or greater than that of the semiconductor light emitting device, and is less than that of the assembly hole.
3. The display device according to claim 2 , wherein a surface of the annealed light-transmitting electrode layer is hydrophilic.
4. The display device according to claim 1 , further comprising a conductive bonding layer disposed between a bonding metal of the semiconductor light emitting device and the annealed light-transmitting electrode layer.
5. The display device according to claim 4 , wherein the conductive bonding layer comprises an intermetallic compound of the bonding metal and the annealed light-transmitting electrode layer.
6. The display device according to claim 5 , wherein a thickness of the conductive bonding layer is in a range of approximately 1.0 nm˜2.0 nm.
7. The display device according to claim 4 , wherein the bonding metal comprises a protruding bonding portion extending away from the bonding metal.
8. The display device according to claim 7 , wherein the conductive bonding layer is disposed between the protruding bonding portion and the annealed light-transmitting electrode layer.
9. The display device according to claim 4 , wherein a horizontal width of the annealed light-transmitting electrode layer is equal to or greater than that of the semiconductor light emitting device, and is less than a horizontal width of the assembly hole.
10. The display device according to claim 9 , wherein a surface of the annealed light-transmitting electrode layer is hydrophilic.
11. A display device comprising:
a first assembly electrode and a second assembly electrode spaced apart and disposed on a substrate;
an insulating layer disposed between the first assembly electrode and the second assembly electrode;
an annealed light-transmitting electrode layer disposed on the insulating layer and the first assembly electrode; and
a semiconductor light emitting device disposed in contact with the annealed light-transmitting electrode layer.
12. The display device according to claim 11 , wherein a horizontal width of the annealed light-transmitting electrode layer is equal to or greater than that of the semiconductor light emitting device, and is less than that of the assembly hole.
13. The display device according to claim 12 , wherein a surface of the annealed light-transmitting electrode layer is hydrophilic.
14. The display device according to claim 11 , further comprising a conductive bonding layer disposed between a bonding metal of the semiconductor light emitting device and the annealed light-transmitting electrode layer.
15. The display device according to claim 14 , wherein the conductive bonding layer comprises an intermetallic compound of the bonding metal and the annealed light-transmitting electrode layer.
16. The display device according to claim 15 , wherein a thickness of the conductive bonding layer is in the range of approximately 1.0 nm˜2.0 nm.
17. The display device according to claim 14 , wherein the bonding metal comprises a protruding bonding portion extending away from the bonding metal.
18. The display device according to claim 17 , wherein the conductive bonding layer is disposed between the protruding bonding portion and the annealed light-transmitting electrode layer.
19. The display device according to claim 14 , wherein a horizontal width of the annealed light-transmitting electrode layer is equal to or greater than that of the semiconductor light emitting device, and is less than a horizontal width of the assembly hole.
20. The display device according to claim 19 , wherein a surface of the annealed light-transmitting electrode layer is hydrophilic.