Probe assembly for test and burn-in having a compliant contact element
A vertical probe assembly having a resilient compliant probe, a first guide plate, a second guide plate, and a third guide plate is disclosed. The probe may include an upper portion, a lower portion, and a stopper structure positioned between the upper and lower portions of the first probe. The first, second, and third guide plates may be formed from a non-conductive substrate and separated by one or more spacers. The first, second, and third guide plates may also include a first, second, and third hole, respectively. The first, second, and third holes may be vertically aligned. The probe may be positioned within the first, second, and third holes such that the upper portion extends through the first hole, the lower portion extends through the second and third holes, and the stopper structure contacts a surface of the second guide plate that faces the first guide plate.
1. A vertical probe assembly comprising:
a resilient compliant probe formed from a conductive material, the probe comprising an upper portion, a lower portion, and a resilient stopper structure positioned between the upper and lower portions of the probe;
a first guide plate having a first hole;
a second guide plate having a second hole, the second guide plate being positioned beneath the first guide plate; and
a third guide plate having a third hole, the third guide plate being positioned beneath the first and second guide plates,
wherein the first, second, and third guide plates are formed from a non-conductive substrate and separated by one or more spacers,
wherein the first, second, and third holes are vertically aligned to receive the probe therethrough,
wherein the upper and lower portions of the probe are non-coaxial and parallel to one another, and
wherein the probe is positioned within the first, second, and third holes such that the upper portion extends through the first hole, the lower portion extends through the second and third holes, and the stopper structure contacts a surface of the second guide plate that faces the first guide plate,
wherein the first and third guide plates are configured to move in opposing horizontal directions to tilt the probe after it has been received in the vertically aligned holes, and
wherein the upper and lower portions of the probe are configured to separately deform around the resilient stopper in response to sliding the first and third guide plates in opposing horizontal directions to tilt the probe.
2. The vertical probe assembly of claim 1 , wherein the resilient stopper structure is a flange that extends laterally beyond the second hole.
3. The vertical probe assembly of claim 1 , wherein a tip of the probe is offset.
4. The vertical probe assembly of claim 1 , wherein a tip of the probe is symmetrical.
5. The vertical probe assembly of claim 1 , wherein the upper and lower portions of the probe have rectangular cross sections.
6. The vertical probe assembly of claim 1 , further comprising:
a fourth guide plate having a fourth hole, the fourth guide plate being positioned beneath the first, second, and third guide plates,
wherein the fourth guide plate is formed from a non-conductive substrate and separated from the third guide plate by one or more spacers,
wherein the fourth hole is vertically aligned with the first, second, and third holes,
wherein the lower portion of the probe extends through the fourth hole, and
wherein at least two of the first, second, third, and fourth guide plates are configured to slide horizontally to release or secure the probe.
7. The vertical probe assembly of claim 1 , wherein the upper portion of the probe is straight.
8. The vertical probe assembly of claim 7 , wherein the lower portion of the probe is straight or bent.
9. The vertical probe assembly of claim 1 , wherein aside from a proximal tip, the upper portion of the probe has a uniform cross-section.
10. The vertical probe assembly of claim 9 , wherein aside from a distal tip, the lower portion of the probe has a uniform cross-section.
11. The vertical probe assembly of claim 10 , wherein the upper and lower portions of the probe are straight.
12. The vertical probe assembly of claim 10 , wherein the upper portion of the probe is straight, and wherein the lower portion of the probe is bent.
13. The vertical probe assembly of claim 5 , wherein the upper and lower portions of the probe are configured such that the deformation of these portions is limited to two opposing directions.
14. The vertical probe assembly of claim 1 , wherein the upper portion of the probe is shorter than the lower portion.
15. The vertical probe assembly of claim 1 , wherein moving the first and third guide plates in opposing horizontal directions increases an amount of friction between the probe and the first, second, and third guide plates.
16. A vertical probe assembly comprising:
a first resilient compliant probe formed from a conductive material, the first probe comprising an upper portion, a lower portion, and a stopper structure positioned between the upper and lower portions of the first probe;
a first guide plate having a first hole;
a second guide plate having a second hole, the second guide plate being positioned beneath the first guide plate;
a third guide plate having a third hole, the third guide plate being positioned beneath the first and second guide plates; and
a second resilient compliant probe that extends through the first, second, and third holes without contacting the first resilient compliant probe,
wherein the first, second, and third guide plates are formed from a non-conductive substrate and separated by one or more spacers,
wherein the first, second, and third holes are vertically aligned, and
wherein the first probe is positioned within the first, second, and third holes such that the upper portion extends through the first hole, the lower portion extends through the second and third holes, and the stopper structure contacts a surface of the second guide plate that faces the first guide plate.
17. The vertical probe assembly of claim 16 , wherein the first resilient compliant probe and the second resilient compliant probe each comprise a distal end for contacting a wafer during electrical testing of the wafer, and wherein the distal ends of the first and second probes are oppositely oriented.