IP Library Granted Patent US 12,431,272
Granted Patent B2
US 12,431,272 · App. 17/645,959 · Granted Sep 30, 2025

Inductor device

Inventor: Hsiao-Tsung Yen (Hsinchu, TW)
Assignee: Realtek Semiconductor Corporation
H01F17/0013H01F27/29H01F2017/004H01F2017/0073
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Quick Facts
Patent No.
US 12,431,272
App. No.
17/645,959
Granted
Sep 30, 2025
Kind
B2
Abstract

An inductor device includes a first trace, a second trace, a first connection member, and a second connection member. The first trace includes a first sub-trace and a second sub-trace. The second sub-trace is disposed adjacent to the first sub-trace directly. The second trace includes a third sub-trace. The third sub-trace is disposed adjacent to the second sub-trace directly. The first connection member is configured to couple to the first sub-trace. The second connection member is disposed adjacent to the first connection member, and configured to couple to the second sub-trace.

Claims (17)

1. An inductor device, comprising:

a first trace, comprising:

a first sub-trace; and

a second sub-trace, disposed directly adjacent to the first sub-trace;

a second trace, comprising:

a third sub-trace, disposed directly adjacent to the second sub-trace; and

a fourth sub-trace, disposed directly adjacent to the third sub-trace;

a first connection member, configured to couple to the first sub-trace;

a second connection member, disposed adjacent to the first connection member, and configured to couple to the second sub-trace;

a third connection member, configured to couple to the third sub-trace; and

a fourth connection member, disposed directly adjacent to the third connection member and the first connection member, and configured to couple to the fourth sub-trace, wherein the first connection member is disposed directly adjacent to the second connection member;

wherein the first sub-trace, the second sub-trace, and the third sub-trace are located on a first layer, and the first connection member and the second connection member are located on a second layer, wherein the first layer and the second layer are different layers.

2. The inductor device of claim 1 , wherein at a first side of a first area, the first sub-trace and the second sub-trace are disposed at an outer side of the inductor device, and the third sub-trace and the fourth sub-trace are disposed at an inner side of the inductor device.

3. The inductor device of claim 2 , wherein at a second side of the first area, the first sub-trace and the second sub-trace are disposed at an inner side of the inductor device, and the third sub-trace and the fourth sub-trace are disposed at an outer side of the inductor device, wherein the first side is corresponding to the second side.

4. The inductor device of claim 3 , wherein at a third side of a second area, the first sub-trace and the second sub-trace are disposed at an outer side of the inductor device, and the third sub-trace and the fourth sub-trace are disposed at an inner side of the inductor device.

5. The inductor device of claim 4 , wherein at a fourth side of the second area, the first sub-trace and the second sub-trace are disposed at an inner side of the inductor device, and the third sub-trace and the fourth sub-trace are disposed at an outer side of the inductor device, wherein the first area is adjacent to the second area, and the third side is corresponding to the fourth side.

6. The inductor device of claim 1 , wherein the fourth sub-trace is located on the first layer, and the third connection member and the fourth connection member are located on the second layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2021
From: YEN, HSIAO-TSUNG
To: REALTEK SEMICONDUCTOR CORPORATION
Reel/Frame 058577/0318 →
Priority Claims (1)
TW 110126602 · Jul 20, 2021 · national
Continuity (1)
Related Publication 20230027844A1 · Jan 26, 2023
References Cited (10)
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