Packages with enlarged through-vias in encapsulant
A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.
1. A package comprising:
a device die;
an encapsulant encapsulating the device die therein;
a first plurality of through-vias penetrating through the encapsulant, wherein the first plurality of through-vias comprise a first array and a second array;
a plurality of dummy through-vias penetrating through the encapsulant, wherein the plurality of dummy through-vias separate the first array from the second array;
a first conductive feature over and contacting a top surface of a dummy through-via of the plurality of dummy through-vias;
a second conductive feature under and contacting a bottom surface of the dummy through-via, wherein the first conductive feature, the dummy through-via, and the second conductive feature are collectively electrically floating; and
redistribution lines over and electrically coupling to the first plurality of through-vias.
2. The package of claim 1 further comprising a second plurality of through-vias penetrating through the encapsulant, wherein the second plurality of through-vias are outside of the first array and the second array, and are larger than the first plurality of through-vias in a top view of the package.
3. The package of claim 2 , wherein the plurality of dummy through-vias and the second plurality of through-vias are aligned to a straight line.
4. The package of claim 3 , wherein the plurality of dummy through-vias and the second plurality of through-vias are allocated alternatingly.
5. The package of claim 3 , wherein the second plurality of through-vias are elongated, and have lengthwise directions parallel to the straight line.
6. The package of claim 2 , wherein the second plurality of through-vias are distributed on three sides of the first array.
7. The package of claim 1 , wherein the plurality of dummy through-vias are aligned to a straight line.
8. The package of claim 1 , wherein the plurality of dummy through-vias are electrically floating.
9. The package of claim 1 , wherein neighboring ones of the first plurality of through-vias are spaced by a first spacing, and neighboring ones of the plurality of dummy through-vias are spaced by a second spacing greater than the first spacing.
10. The package of claim 1 , wherein the dummy through-vias have larger lateral sizes than the first plurality of through-vias.
11. The package of claim 10 , wherein the first plurality of through-vias are rounded with each having a first diameter, and wherein the plurality of dummy through-vias are rounded with each having a second diameter greater than the first diameter.
12. The package of claim 1 , wherein the plurality of dummy through-vias fully penetrate through the encapsulant.
13. A package comprising:
a molding compound;
a device die molded in the molding compound;
a first plurality of through-vias molded in the molding compound and having a first lateral size;
a plurality of dummy through-vias molded in the molding compound and aligned to a straight line, wherein each of the plurality of dummy through-vias has a second lateral size greater than the first lateral size, and wherein the plurality of dummy through-vias are electrically floating, and wherein the plurality of dummy through-vias comprise:
first top surfaces coplanar with a second top surface of the molding compound; and
first bottom surfaces coplanar with a second bottom surface of the molding compound; and
redistribution lines over and electrically coupling to the first plurality of through-vias.
14. The package of claim 13 further comprising a second plurality of through-vias molded in the molding compound, wherein the plurality of dummy through-vias separate the first plurality of through-vias from the second plurality of through-vias.
15. The package of claim 14 , wherein the first plurality of through-vias form a first array, and the second plurality of through-vias form a second array.
16. The package of claim 13 , wherein the plurality of dummy through-vias have a greater spacing than the first plurality of through-vias.
17. The package of claim 13 further comprising:
a first conductive feature over and contacting a top surface of a dummy through-via of the plurality of dummy through-vias; and
a second conductive feature under and contacting a bottom surface of the dummy through-via, wherein the first conductive feature, the dummy through-via, and the second conductive feature are collectively electrically floating.
18. A package comprising:
a molding compound;
a device die molded in the molding compound;
a plurality of small through-vias molded in the molding compound, wherein each of the plurality of small through-vias has a first lateral size;
a plurality of enlarged through-vias molded in the molding compound, wherein each of the plurality of enlarged through-vias has a second lateral size greater than the first lateral size;
a plurality of dummy through-vias aligned to a same straight line as the plurality of enlarged through-vias, wherein the plurality of dummy through-vias and the plurality of enlarged through-vias are immediately neighboring the plurality of small through-vias; and
redistribution lines over and electrically coupling to both of the plurality of small through-vias and the plurality of enlarged through-vias.
19. The package of claim 18 , wherein the plurality of small through-vias form an array, and the same straight line is immediately neighboring, and is parallel to, a column of the array.
20. The package of claim 18 , wherein the plurality of dummy through-vias and the plurality of enlarged through-vias are interlaced.