Electronic device package and method for manufacturing the same
An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.
1. An electronic device package, comprising:
a circuit structure;
an encapsulation layer over the circuit structure;
a photonic component comprising a region overhanging the encapsulation layer and an optical path within the region, wherein the photonic component has an active surface facing the encapsulation layer; and
an electronic component disposed between the photonic component and the circuit structure, wherein a first side of the photonic component is substantially coplanar with a first side of the encapsulation layer, wherein the first side of the photonic component is perpendicular to the active surface of the photonic component.
2. The electronic device package of claim 1 , further comprising an optical coupler over the photonic component, wherein the photonic component comprises a first reflector and the optical coupler comprises a second reflector, wherein the optical path is extended between the active surface of the photonic component and a surface of the photonic component opposite to the active surface.
3. The electronic device package of claim 2 , wherein the optical path is extended between the first reflector and the second reflector.
4. The electronic device package of claim 1 , wherein the photonic component comprises a waveguide layer providing the optical path.
5. The electronic device package of claim 4 , further comprising an optical fiber optically coupled to the waveguide layer, wherein an upper surface of the optical fiber is disposed over an upper surface of the photonic component.
6. The electronic device package of claim 5 , wherein the optical fiber overhangs the photonic component and a second side of the photonic component is substantially coplanar with a first side of the optical fiber, wherein the second side of the photonic component is opposite to the first side of the photonic component.
7. An electronic device package, comprising:
an electronic component having a first side;
a circuit layer disposed under the electronic component and having a first side protruding by a first distance from the first side of the electronic component;
an encapsulation layer over the circuit layer and having a first side; and
a photonic component disposed over the circuit layer and having a first side protruding by a second distance from the first side of the electronic component, wherein the second distance is greater than the first distance, wherein the photonic component comprises a second side opposite to the first side thereof, and the second side of the photonic component is substantially coplanar with the first side of the encapsulation layer, wherein the first side of the photonic component is perpendicular to an active surface of the photonic component.
8. The electronic device package of claim 7 , wherein a first portion of an upper surface of the circuit layer is exposed from the encapsulation layer and wherein the first side of the encapsulation layer is orthogonal to the first portion of the upper surface of the circuit layer.
9. The electronic device package of claim 7 , further comprising an optical coupler over the photonic component and an optical fiber optically coupled to the optical coupler, wherein an elevation of an upper surface of the optical coupler is lower than an elevation of an upper surface of the optical fiber.
10. The electronic device package of claim 7 , further comprising a plurality of electrical conductors disposed on a bottom surface of the circuit layer.
11. The electronic device package of claim 10 , further comprising a first conductive structure between the electronic component and the photonic component and a second conductive structure between the photonic component and the circuit layer, wherein an electrical connection path is established among the electronic component, the first conductive structure, the photonic component, the second conductive structure, the circuit layer, and one of the plurality of electrical conductors.
12. The electronic device package of claim 7 , further comprising an optical fiber overhanging the photonic component and the first side of the photonic component is substantially coplanar with a first side of the optical fiber.
13. An electronic device package, comprising:
a circuit structure;
an encapsulation layer over the circuit structure;
a photonic component overhanging the circuit structure, wherein the photonic component has an active surface facing the encapsulation layer;
an electronic component disposed under the photonic component and over the circuit structure, wherein a first side of the photonic component is substantially coplanar with a first side of the encapsulation layer, wherein the first side of the photonic component is perpendicular to the active surface of the photonic component.
14. The electronic device package of claim 13 , further comprising an optical coupler over the photonic component, wherein the photonic component comprises a first reflector and the optical coupler comprises a second reflector.
15. The electronic device package of claim 14 , wherein the photonic component comprises an optical path extended between the first reflector and the second reflector.
16. The electronic device package of claim 15 , further comprising an optical fiber optically coupled to the optical path, wherein an upper surface of the optical fiber is disposed over an upper surface of the photonic component.
17. The electronic device package of claim 16 , wherein a second side of the photonic component is substantially coplanar with a first side of the optical fiber, wherein the second side of the photonic component is opposite to the first side of the photonic component.
18. The electronic device package of claim 13 , wherein the photonic component overhangs the electronic component.
19. The electronic device package of claim 13 , further comprising a first conductive structure disposed over the electronic component and under the photonic component, wherein the first conductive structure includes a first portion more proximal to the photonic component than a second portion, wherein a width of the first portion is greater than a width of the second portion.
20. The electronic device package of claim 13 , wherein a first portion of an upper surface of the circuit structure is exposed from the encapsulation layer and wherein the first side of the encapsulation layer is orthogonal to the first portion of the upper surface of the circuit structure.