IP Library Granted Patent US 12,432,937
Granted Patent B2
US 12,432,937 · App. 18/179,976 · Granted Sep 30, 2025

Semiconductor memory device with plurality of arrays

Inventors: Hiroshi Nakaki (Yokkaichi Mie, JP); Keisuke Nakatsuka (Kobe Hyogo, JP)
Assignee: Kioxia Corporation
H10B80/00G11C16/0483G11C16/08G11C16/26
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,432,937
App. No.
18/179,976
Granted
Sep 30, 2025
Kind
B2
Abstract

According to an embodiment, a semiconductor memory device includes a first memory cell array, a second memory cell array, and a row decoder. The first memory cell array includes a first select transistor, a first memory cell, a second select transistor, a first word line, a first select gate line, and a second select gate line. The second memory cell array includes, a third select transistor, a second memory cell, a fourth select transistor, a second word line, a third select gate line, a fourth select gate line. The first word line and the second word line are commonly coupled to the row decoder. The first select gate line, the second select gate line, the third select gate line, and the fourth select gate line are separately coupled to the row decoder.

Claims (56)

1. A semiconductor memory device comprising:

a first memory cell array;

a second memory cell array arranged above the first memory cell array in a first direction; and

a row decoder,

wherein the first memory cell array includes:

a first select transistor;

a first memory cell;

a second select transistor, the first select transistor, the first memory cell, and the second select transistor being arranged along the first direction and coupled in series;

a first word line extending in a second direction crossing the first direction and coupled to the first memory cell;

a first select gate line extending in the second direction and coupled to a gate of the first select transistor; and

a second select gate line extending in the second direction and coupled to a gate of the second select transistor,

the second memory cell array includes:

a third select transistor;

a second memory cell;

a fourth select transistor, the third select transistor, the second memory cell, and the fourth select transistor being arranged along the first direction and coupled in series;

a second word line extending in the second direction and coupled to the second memory cell;

a third select gate line extending in the second direction and coupled to a gate of the third select transistor; and

a fourth select gate line extending in the second direction and coupled to a gate of the fourth select transistor,

the first word line and the second word line are commonly coupled to the row decoder,

the first select gate line, the second select gate line, the third select gate line, and the fourth select gate line are separately coupled to the row decoder,

the first memory cell array further includes:

a first contact plug extending in the first direction and provided on the first word line; and

a second contact plug passing through the first word line and the second select gate line and not electrically coupled to the first word line and the second select gate line,

the second memory cell array further includes

a third contact plug extending in the first direction and provided on the second word line, and

the first word line is electrically coupled to the second word line via the first contact plug, the second contact plug, and the third contact plug.

2. The device according to claim 1 , wherein

in a read operation of the first memory cell, the first select transistor and the second select transistor are set in an ON state, and the third select transistor and the fourth select transistor are set in an OFF state.

3. The device according to claim 1 , wherein

the first memory cell array further includes a first bit line coupled to a drain of the first select transistor, and a first source line coupled to a source of the second select transistor,

the second memory cell array further includes a second bit line coupled to a drain of the third select transistor, and a second source line coupled to a source of the fourth select transistor,

the first bit line and the second bit line are electrically coupled, and

the first source line and the second source line are electrically coupled.

4. The device according to claim 1 , wherein

the first select gate line, the first word line, and the second select gate line are stacked apart in the first direction, and end portions of the first select gate line, the first word line, and the second select gate line are arranged in a staircase shape in the second direction.

5. The device according to claim 1 , wherein

the first memory cell array further includes a memory pillar passing through the first word line, the first select gate line, and the second select gate line and extending in the first direction,

the first memory cell is formed by a combination of the first word line and the memory pillar,

the first select transistor is formed by a combination of the first select gate line and the memory pillar, and

the second select transistor is formed by a combination of the second select gate line and the memory pillar.

6. The device according to claim 5 , wherein

the memory pillar includes a semiconductor layer and a charge storage layer.

7. The device according to claim 1 , wherein

in the first direction, the first memory cell array is arranged between the row decoder and the second memory cell array.

8. The device according to claim 3 , further comprising a sense amplifier,

wherein the first bit line and the second bit line are commonly coupled to the sense amplifier.

9. The device according to claim 1 , further comprising:

a first chip including the first memory cell array;

a second chip including the second memory cell array; and

a third chip including the row decoder,

wherein the second chip is bonded to a first surface of the first chip, and

the third chip is bonded to a second surface of the first chip facing the first surface.

10. The device according to claim 1 , wherein

one end of the first word line and one end of the second word line are commonly coupled to the row decoder, and the other end of the first word line and the other end of the second word line are coupled to each other.

11. The device according to claim 10 , wherein

in a read operation of the first memory cell, the first select transistor and the second select transistor are set in an ON state, and the third select transistor and the fourth select transistor are set in an OFF state.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2023
From: NAKAKI, HIROSHI; NAKATSUKA, KEISUKE
To: KIOXIA CORPORATION
Reel/Frame 063607/0910 →
Priority Claims (1)
JP 2022-090970 · Jun 3, 2022 · national
Continuity (1)
Related Publication 20230397446A1 · Dec 7, 2023
References Cited (11)
US 5894447A · Takashima · 1999 [cited by examiner]
US 10651153B2 · Fastow et al. · 2020 [cited by applicant]
US 10741527B2 · Tagami et al. · 2020 [cited by applicant]
US 20180068732A1 · Maeda · 2018 [cited by applicant]
US 20190088331A1 · Kobayashi et al. · 2019 [cited by applicant]
US 20190088676A1 · Tagami et al. · 2019 [cited by applicant]
US 20200203329A1 · Kanamori et al. · 2020 [cited by applicant]
US 20200294958A1 · Shibata · 2020 [cited by applicant]
US 20200294971A1 · Tanaka et al. · 2020 [cited by applicant]
US 20230019022A1 · D'alessandro · 2023 [cited by examiner]
US 20230067423A1 · Lee · 2023 [cited by examiner]