Metal coated resin particles, method for producing same, conductive paste containing metal coated resin particles, and conductive film
View Patent ↗Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (Sn x O y ), and tin hydroxide (Sn x (OH) y ) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.
1. Metal coated resin particles comprising:
spherical core resin particles; and
a metal coated layer provided on a surface of each of the core resin particles,
wherein the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (Sn x O y ), and tin hydroxide (Sn x (OH) y ) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.
2. The metal coated resin particles according to claim 1 ,
wherein the first silver layer has an average thickness of 10 nm to 100 nm, the tin intermediate layer has an average thickness of 2 nm to 20 nm, the second silver layer has an average thickness of 50 nm to 150 nm, and the spherical core resins particles have an average particle size from 1 μm to 110 μm.
3. A conductive paste comprising:
70 mass % to 90 mass % of the metal coated resin particles according to claim 1 ; and
10 mass % to 30 mass % of a binder resin.
4. A conductive paste comprising:
10 mass % to 80 mass % of the metal coated resin particles according to claim 1 ;
10 mass % to 70 mass % of spherical silver particles or flat silver particles having an aspect ratio (major axis/minor axis) of 5 or less; and
10 mass % to 30 mass % of a binder resin,
in a case where a content of the conductive paste is set as 100 mass %.
5. A conductive paste comprising:
70 mass % to 90 mass % of the metal coated resin particles according to claims 2 ; and
10 mass % to 30 mass % of a binder resin.
6. A conductive paste comprising:
10 mass % to 80 mass % of the metal coated resin particles according to claim 2 ;
10 mass % to 70 mass % of spherical silver particles or flat silver particles having an aspect ratio (major axis/minor axis) of 5 or less; and
10 mass % to 30 mass % of a binder resin,
in a case where a content of the conductive paste is set as 100 mass %.
7. A method for producing metal coated resin particles, the method comprising:
a step of mixing spherical core resin particles with an aqueous solution of a tin compound and adsorbing tin to a surface of each of the core resin particles to form a tin adsorption layer;
a step of dripping a part of a predetermined amount of an aqueous solution containing silver salt and silver complexing agent together with a reducing agent and a pH adjusting agent to a slurry obtained by dispersing the core resin particles having the tin adsorption layer formed on the surface of each thereof in water to mix them to obtain a mixed solution, and subjecting the core resin particles to electroless silver plating in the mixed solution to substitute the tin adsorption layer with a first silver layer;
a step of holding the mixed solution for a predetermined period of time while stirring the mixed solution to form a tin intermediate layer on a surface of the first silver layer; and
a step of further dripping a remainder of the predetermined amount of the aqueous solution containing the silver salt and the silver complexing agent together with the reducing agent and the pH adjusting agent to the mixed solution to mix them, and subsequently subjecting the core resin particles to electroless silver plating in the mixed solution to form a second silver layer on a surface of the tin intermediate layer.
8. The method for producing metal coated resin particles according to claim 7 ,
wherein, in a case where the predetermined amount is 100 mass %, an amount of the part of the aqueous solution containing the silver salt and the silver complexing agent is greater than 5 mass % and 70 mass % or less, and an amount of the remainder of the aqueous solution containing the silver salt and the silver complexing agent is 30 mass % or more and less than 95 mass %.
9. The method for producing metal coated resin particles according to claim 7 ,
wherein a temperature of the aqueous solution of the tin compound is higher than 45° C. and 90° C. or lower when the spherical core resin particles are mixed with the aqueous solution of the tin compound.
10. The method for producing metal coated resin particles according to claim 8 ,
wherein a temperature of the aqueous solution of the tin compound is higher than 45° C. and 90° C. or lower when the spherical core resin particles are mixed with the aqueous solution of the tin compound.