Semiconductor patterning and resulting structures
A method includes depositing a hard mask over a target layer. Depositing the hard mask includes depositing a first hard mask layer having a first density and depositing a second hard mask layer over the first hard mask layer, the second hard mask layer having a second density greater than the first density. The method further includes forming a plurality of mandrels over the hard mask; depositing a spacer layer over and along sidewalls of the plurality of mandrels; patterning the spacer layer to provide a plurality of spacers on the sidewalls of the plurality of mandrels; after patterning the spacer layer, removing the plurality of mandrels; transferring a patterning the plurality of spacers to the hard mask; and patterning the target layer using the hard mask as a mask.
1. A method comprising:
forming a material layer;
patterning the material layer, wherein patterning the material layer comprises:
depositing a first hard mask layer over the material layer;
depositing a second hard mask layer over the first hard mask layer, the second hard mask layer being denser than the first hard mask layer, the first hard mask layer and the second hard mask layer each comprising oxygen;
forming a plurality of mandrels over the second hard mask layer;
forming spacers on sidewalls of the plurality of mandrels;
removing the plurality of mandrels;
transferring a pattern of the spacers to the first hard mask layer; and
etching the material layer using the first hard mask layer as a mask.
2. The method of claim 1 , wherein the first hard mask layer and the second hard mask layer each comprises silicon oxide.
3. The method of claim 1 , wherein the first hard mask layer comprises silicon oxide, and wherein the second hard mask layer comprises silicon oxynitride or silicon oxycarbon nitride.
4. The method of claim 1 , wherein depositing the second hard mask layer comprises a performing a different type of deposition process as depositing the first hard mask layer.
5. The method of claim 1 , wherein depositing the second hard mask layer comprises performing a same type of deposition process as depositing the first hard mask layer.
6. The method of claim 1 , wherein the first hard mask layer has a first thickness, wherein the second hard mask layer has a second thickness, and wherein a ratio of the second thickness to the first thickness is in a range of 1:6 to 1:4.
7. The method of claim 1 , wherein removing the plurality of mandrels comprises etching a recess in the second hard mask layer, the recess having a first depth, and wherein the second hard mask layer is deposited to a thickness greater than the first depth.
8. The method of claim 7 , wherein the first depth is less than 3 nm.
9. The method of claim 1 , wherein the second hard mask layer has a density of at least 1.8 g/cm 3 .
10. A method comprising:
depositing a first hard mask layer over a target layer, wherein the first hard mask layer comprises silicon oxide;
depositing a second hard mask layer over and contacting the first hard mask layer, wherein a density of the second hard mask layer is at least 1.8 g/cm 3 , wherein the second hard mask layer comprises silicon oxide, and wherein the second hard mask layer is thinner than the first hard mask layer, and wherein a density of the first hard mask layer is less than a density of the second hard mask layer;
forming a plurality of mandrels over the second hard mask layer;
forming spacers on sidewalls of the plurality of mandrels;
removing the plurality of mandrels to define openings between the spacers;
using the spacers as a mask to pattern the first hard mask layer; and
using the first hard mask layer to pattern the target layer.
11. The method of claim 10 , wherein the openings between the spacers extend into the second hard mask layer.
12. The method of claim 11 , wherein a depth that the openings between the spacers extend into the second hard mask layer is less than 3 nm.
13. The method of claim 10 , wherein using the spacers as the mask to pattern the first hard mask layer comprises consuming the second hard mask layer while patterning the first hard mask layer.
14. The method of claim 10 , wherein depositing the second hard mask layer comprises depositing the second hard mask layer in a same process chamber as depositing the first hard mask layer.
15. The method of claim 10 , wherein depositing the second hard mask layer comprises depositing the second hard mask layer in a different process chamber as depositing the first hard mask layer.
16. A method comprising:
depositing a first oxide layer over a semiconductor layer;
depositing a second oxide layer over and contacting the first oxide layer, wherein the second oxide layer is denser than the first oxide layer;
forming a plurality of mandrels over the second oxide layer;
forming spacers along sides of the plurality of mandrels;
removing the plurality of mandrels;
using the spacers as a mask to pattern the first oxide layer, wherein the second oxide layer is removed while patterning the first oxide layer; and
using the first oxide layer as a mask to pattern a plurality of fins in the semiconductor layer.
17. The method of claim 16 , wherein removing the plurality of mandrels partially etches the second oxide layer.
18. The method of claim 17 , wherein removing the plurality of mandrels partially etches the second oxide layer to a depth of less than 3 nm.
19. The method of claim 16 , wherein a density of the second oxide layer is at least 1.8 g/cm 3 .
20. The method of claim 16 , wherein the plurality of mandrels comprises amorphous silicon, wherein the first oxide layer comprises silicon oxide, and wherein the second oxide layer comprises silicon oxide, silicon oxynitride, or silicon oxycarbon nitride.