Stacked integrated circuit
A stacked integrated circuit includes a first chip including a first area and a second area that are disposed to be substantially symmetrical to each other in relation to a first rotating axis. The first area includes a first through via set and a first front pad set that are connected by using a first connection method. The second area includes a second through via set and a second front pad set that are connected by using a second connection method. The first through via set and the second through via set are disposed to be substantially symmetrical to each other in relation to the first rotating axis. The first front pad set and the second front pad set are disposed to be substantially symmetrical to each other in relation to the first rotating axis.
1. A stacked integrated circuit comprising:
a first chip comprising a first area substantially symmetrical to a second area in relation to a first rotating axis;
wherein a first through via set is connected within the first area to a first front pad set using a first connection method;
wherein a second through via set is connected within the second area to a second front pad set using a second connection method;
wherein the first through via set is disposed substantially symmetrical to the second through via set in relation to the first rotating axis; and
wherein the first front pad set is disposed substantially symmetrical to the second front pad set in relation to the first rotating axis.
2. The stacked integrated circuit of claim 1 , wherein the first connection method is different from the second connection method.
3. The stacked integrated circuit of claim 1 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method; and
through vias included in the second through via set are connected to front pads included in the second front pad set using a cross connection method.
4. The stacked integrated circuit of claim 1 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a cross connection method; and
through vias included in the second through via set are connected to front pads included in the second front pad set using a direct connection method.
5. The stacked integrated circuit of claim 1 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method, and
through vias included in the second through via set are connected to front pads included in the second front pad set using a spiral chain connection method.
6. The stacked integrated circuit of claim 1 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a spiral chain connection method, and
through vias included in the second through via set are connected to front pads included in the second front pad set using a direct connection method.
7. The stacked integrated circuit of claim 1 , wherein:
a first input and output (IO) circuit is within the first area, and
the first IO circuit is connected to a front pad included in the first front pad set.
8. The stacked integrated circuit of claim 1 , wherein each through via included in the first through via set and each through via included in the second through via set are allocated to separate channels.
9. The stacked integrated circuit of claim 1 , further comprising a second chip stacked on the first chip and comprising a third area substantially symmetrical to a fourth area in relation to a second rotating axis;
wherein a third through via set is connected within the third area to a third front pad set using the second connection method; and
wherein a second through via set is connected within the second area to a second front pad set using the first connection method.
10. The stacked integrated circuit of claim 9 , wherein:
a second IO circuit is within the fourth area, and
the second IO circuit is connected to a front pad included in the fourth front pad set.
11. The stacked integrated circuit of claim 9 , wherein:
the third through via set is disposed substantially symmetrical to the fourth through via set in relation to the second rotating axis, and
the third front pad set is disposed substantially symmetrical to the fourth front pad set in relation to the second rotating axis.
12. The stacked integrated circuit of claim 10 , wherein:
the first front pad set is bonded to the third front pad set, and
the second front pad set is bonded to the fourth front pad set.
13. A stacked integrated circuit comprising:
a second chip stacked on a first chip;
wherein the first chip comprises a first through via set connected to a first front pad set using a first connection method;
wherein the first chip comprises a second through via set connected to a second front pad set using a second connection method;
wherein the second chip comprises a third through via set connected to a third front pad set using the second connection method;
wherein the second chip comprises a fourth through via set connected to a fourth front pad set using the first connection method;
wherein the second connection method is one of a cross connection method and a spiral chain connection method.
14. The stacked integrated circuit of claim 13 , wherein:
the first through via set is disposed substantially symmetrical to the second through via set in relation to a rotating axis;
the first front pad set is disposed substantially symmetrical to the second front pad set in relation to the rotating axis;
the third through via set is disposed substantially symmetrical to the fourth through via set in relation to the rotating axis; and
the third front pad set is disposed substantially symmetrical to the fourth front pad set in relation to the rotating axis.
15. The stacked integrated circuit of claim 13 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method;
through vias included in the second through via set are connected to front pads included in the second front pad set using a cross connection method;
through vias included in the third through via set are connected to front pads included in the fourth front pad set using the cross connection method; and
through vias included in the fourth through via set are connected to front pads included in the fourth front pad set using the direct connection method.
16. The stacked integrated circuit of claim 13 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method;
through vias included in the second through via set are connected to front pads included in the second front pad set using a spiral chain connection method;
through vias included in the third through via set are connected to front pads included in the fourth front pad set using the spiral chain connection method; and
through vias included in the fourth through via set are connected to front pads included in the fourth front pad set using the direct connection method.
17. The stacked integrated circuit of claim 13 , wherein:
the first front pad set is bonded to the third front pad set, and
the second front pad set is bonded to the fourth front pad set.
18. The stacked integrated circuit of claim 13 , wherein:
the first chip comprises a first input and output (IO) circuit connected to a front pad included in the first front pad set, and
the second chip comprises a second IO circuit connected to a front pad included in the fourth front pad set.
19. A stacked integrated circuit comprising:
a base chip comprising base input and output (IO) circuits allocated to separate channels; and
a first chip and a second chip stacked on the base chip;
wherein the first chip comprises a first through via set connected to a first front pad set using a first connection method;
wherein the first chip comprises a second through via set connected to a second front pad set using a second connection method; and
wherein the first chip comprises a first IO circuit connected to a front pad included in the first front pad set.
20. The stacked integrated circuit of claim 19 , wherein through vias included in the first through via set and through vias included in the second through via set are connected to the base IO circuits and allocated to the separate channels.
21. The stacked integrated circuit of claim 19 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method; and
through vias included in the second through via set are connected to front pads included in the second front pad set using a cross connection method.
22. The stacked integrated circuit of claim 19 , wherein:
through vias included in the first through via set are connected to front pads included in the first front pad set using a direct connection method, and
through vias included in the second through via set are connected to front pads included in the second front pad set using a spiral chain connection method.
23. The stacked integrated circuit of claim 19 , wherein:
the second chip comprises a third through via set connected to a third front pad set using the second connection method; and
the second chip comprises a fourth through via set connected to a fourth front pad set using the first connection method; and
the second chip comprises a second IO circuit connected to a front pad included in the fourth front pad set.
24. The stacked integrated circuit of claim 23 , wherein:
the first through via set is disposed substantially symmetrical to the second through via set in relation to a rotating axis;
the first front pad set is disposed substantially symmetrical to the second front pad set in relation to the rotating axis;
the third through via set is disposed substantially symmetrical to the fourth through via set in relation to the rotating axis; and
the third front pad set is disposed substantially symmetrical to the fourth front pad set in relation to the rotating axis.
25. The stacked integrated circuit of claim 23 , wherein:
through vias included in the third through via set are connected to front pads included in the third front pad set using a cross connection method, and
through vias included in the fourth through via set are connected to front pads included in the fourth front pad set by using a direct connection method.
26. The stacked integrated circuit of claim 23 , wherein:
through vias included in the third through via set are connected to front pads included in third front pad set using a spiral chain connection method, and
through vias included in the fourth through via set are connected to front pads included in the fourth front pad set using a direct connection method.
27. The stacked integrated circuit of claim 23 , wherein:
the first front pad set is bonded to the third front pad set, and
the second front pad set is bonded to the fourth front pad set.