IP Library › Granted Patent US 12,721,223
Granted Patent B2
US 12,721,223 · App. 18/301,706 · Granted Aug 25, 2026

Semiconductor package and method of fabricating the same

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Quick Facts
Patent No.
US 12,721,223
App. No.
18/301,706
Filed
Apr 17, 2023
Granted
Aug 25, 2026
Kind
B2
Art Unit
2899
USPC
257/774
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2023
From: KWEON, JUN YUN; KO, YEONG BEOM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063354/0060 →
Priority Claims (1)
KR 10-2022-0098374 · Aug 8, 2022 · national
Continuity (1)
Related Publication 20240047425A1 · Feb 8, 2024
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