High-speed spatial light modulation and quantum control
An atom control architecture based on VIS-IR photonic integrated circuit (PIC) technology is characterized by (1) visible (VIS) and near-infrared (IR) wavelength operation, (2) channel counts extensible beyond 1000s of individually addressable atoms, (3) high intensity modulation extinction and (4) repeatability compatible with low gate errors, and (5) fast switching times. A 16-channel SiN-based APIC with (5.8±0.4) ns response times and <−30 dB extinction ratio at a wavelength of 780 nm. Based on a complementary metal-oxide-semiconductor (CMOS) fabrication process, this atom-control PIC (APIC) technology can be used for atomic, molecular, and optical physics and emerging applications, from quantum computers with cold atoms or ions to quantum networks with solid-state color centers. This APIC technology is especially suitable for scalable quantum information processing based on optically programmable atomic systems.
1. A method of addressing a qubit in an array of qubits, the method comprising:
coupling an excitation beam in a first polarization state into a resonator in an array of resonators integrated into a chip;
modulating the excitation beam with the resonator;
coupling the excitation beam from the resonator out of the chip and into free space in a second polarization state orthogonal to the first polarization state; and
illuminating the qubit with the excitation beam.
2. The method of claim 1 , further comprising, before illuminating the qubit with the excitation beam, combining the excitation beam with a reference beam.
3. The method of claim 2 , further comprising, before combining the excitation beam with the reference beam, spatially modulating the reference beam.
4. The method of claim 2 , wherein combining the excitation beam with the reference beam causes destructive interference between the excitation beam and the reference beam.
5. The method of claim 4 , wherein the reference beam has an amplitude and/or a phase selected to suppress the excitation beam by at least 30 dB.
6. The method of claim 1 , further comprising, before coupling the excitation beam into the resonator, spatially modulating the excitation beam.
7. The method of claim 1 , wherein modulating the excitation beam with the resonator comprises driving the resonator at a mechanical resonance frequency of the resonator.
8. The method of claim 1 , wherein:
coupling the excitation beam into the resonator comprises directing the excitation beam through a first port of a polarizing beam splitter towards the resonator, and
illuminating the qubit with the excitation beam comprises directing the excitation beam from the resonator through a second port of a polarizing beam splitter towards the qubit.
9. A system for controlling an array of qubits, the system comprising:
a spatial light modulator (SLM) to fan out an excitation beam into an array of excitation beams in a first polarization state;
a polarizing beam splitter (PBS), in optical communication with the SLM, to direct the array of excitation beams; and
an atom-control photonic integrated circuit (APIC), in optical communication with the PBS, to generate an array of pulses in a second polarization state orthogonal to the first polarization state from the array of excitation beams and to project the array of pulses onto the array of qubits via the PBS.
10. The system of claim 9 , wherein the APIC comprises:
an array of modulators, formed in the APIC, to produce the array of pulses from the array of excitation beams;
an array of input couplers, formed in the APIC in optical communication with the array of modulators, to couple the array of excitation beams into the array of modulators; and
an array of output couplers, formed in the APIC in optical communication with the array of modulators, to couple the array of pulses out of the APIC.
11. The system of claim 10 , wherein each modulator in the array of modulators comprises a dual-ring Mach-Zehnder modulator (DRMZM) having ring resonators with resonant frequencies tuned by respective piezoelectric elements and respective integrated heaters.
12. The system of claim 10 , wherein the APIC further comprises:
a complementary metal-oxide-semiconductor (CMOS) substrate supporting the array of modulators and containing electronic components, operably coupled to the array of modulators, to drive the array of modulators.
13. The system of claim 9 , wherein the SLM is a first SLM, and further comprising:
a second SLM to fan out a reference beam into an array of reference beams; and
a beam splitter, in optical communication with the APIC and the second SLM, to combine the array of reference beams with the array of pulses.
14. The system of claim 9 , wherein the SLM comprises:
an array of pixels, each pixel in the array of pixels comprising:
a resonant photonic structure to reflect incident light at a resonance frequency; and
a piezoelectric actuator, in mechanical communication with the resonant photonic structure, to strain the resonant photonic structure, thereby changing a reflectance of the resonant photonic structure.
15. The system of claim 14 , wherein the resonant photonic structure comprises at least one of a grating, a dielectric structure defining a cavity, a nanoantenna, a photonic crystal, or a plasmonic structure.
16. The system of claim 14 , wherein the piezoelectric actuator comprises a layer of piezoelectric material and the resonant photonic structure is disposed on the layer of piezoelectric material.
17. The system of claim 14 , wherein the piezoelectric actuator is a first piezoelectric actuator on a first side of the resonant photonic structure and further comprises:
a second piezoelectric actuator, on a second side of the resonant photonic structure, to laterally strain the resonant photonic structure with the first piezoelectric actuator.
18. The system of claim 14 , further comprising:
a layer of liquid crystal material, in electromagnetic communication with the resonant photonic structure, to tune the resonance frequency of the resonant photonic structure.
19. The system of claim 14 , further comprising:
a heater, in thermal communication with the resonant photonic structure, to tune the resonance frequency of the resonant photonic structure.
20. The system of claim 14 , further comprising:
a complementary metal-oxide-semiconductor (CMOS) substrate supporting the array of pixels and containing electronic components, operably coupled to the array of pixels, to drive the array of pixels.