IP Library › Granted Patent US 12,444,644
Granted Patent B2
US 12,444,644 · App. 18/640,411 · Granted Oct 14, 2025

Lift pin assembly

Inventors: Yogananda Sarode Vishwanath (Bangalore, IN); Anand Kumar (Bangalore, IN)
Assignee: Applied Materials, Inc.
H01L21/68742C23C16/4401H01J37/32715H01L21/67017H01L21/67103H01L21/67109H01L21/6831H01L21/6833H01L21/68757H01L21/68785H01J37/32449H01L21/67069
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Quick Facts
Patent No.
US 12,444,644
App. No.
18/640,411
Granted
Oct 14, 2025
Kind
B2
Abstract

Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

Claims (33)

1. A lift pin assembly comprising:

a lift pin guide;

a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough that is configured to receive a lift pin suitable for lifting a substrate, wherein the purge cylinder comprises:

a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder that receives the lift pin, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil; and

a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

2. The lift pin assembly of claim 1 , wherein the purge cylinder comprises a ceramic material.

3. The lift pin assembly of claim 1 , wherein the lift pin guide is disposed above the purge cylinder.

4. The lift pin assembly of claim 1 , wherein the lift pin is disposed in the passage, wherein the lift pin is fabricated from sapphire.

5. The lift pin assembly of claim 1 , wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin.

6. The lift pin assembly of claim 1 , wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin.

7. The lift pin assembly of claim 1 , further comprising a hoop assembly disposed below the purge cylinder.

8. The lift pin assembly of claim 7 , wherein the purge cylinder is disposed between the lift pin guide and the hoop assembly.

9. The lift pin assembly of claim 1 , further comprising a facility plate comprising a conduit, a circumferential plenum, and the purge cylinder, wherein the conduit is fluidly coupled to the circumferential plenum, and the circumferential plenum is fluidly coupled to and disposed radially outward from the plurality of nozzles.

10. A substrate processing assembly comprising:

a substrate support;

a facility plate disposed below the substrate support; and

a lift pin assembly disposed within the substrate support and the facility plate, the lift pin assembly comprising:

a lift pin guide;

a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough that is configured to receive a lift pin suitable for lifting a substrate, wherein the purge cylinder comprises:

a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder that receives the lift pin, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil; and

a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

11. The lift pin assembly of claim 10 , wherein the lift pin is fabricated from sapphire.

12. The lift pin assembly of claim 10 , wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin.

13. The lift pin assembly of claim 10 , wherein the purge cylinder comprises a ceramic material.

14. The lift pin assembly of claim 10 , wherein the purge cylinder is disposed below the lift pin guide.

15. The lift pin assembly of claim 10 , wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin.

16. The lift pin assembly of claim 10 , further comprising a hoop assembly disposed below the purge cylinder, wherein the purge cylinder is disposed between the lift pin guide and the hoop assembly.

17. A lift pin assembly comprising:

a lift pin guide;

a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough, wherein the purge cylinder is disposed below the lift pin guide, and wherein the purge cylinder comprises:

a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil;

a lift pin disposed in the passage and configured to lift a substrate; and

a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2024
From: VISHWANATH, YOGANANDA SARODE; KUMAR, ANAND
To: APPLIED MATERIALS, INC.
Reel/Frame 067602/0838 →
Continuity (3)
Continuation 17227066 · Apr 9, 2021
Division 16010250 · Jun 15, 2018
Related Publication 20240266206A1 · Aug 8, 2024
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