Granted Patent B2

US 12,449,470 · App. 18/249,039 · Granted Oct 21, 2025

Inventors: Daniel Monteiro Diniz Reis (Esslingen am Neckar, DE); Frank Schatz (Kornwestheim, DE); Mathias Mews (Reutlingen, DE); Timo Schary (Aichtal-Neuenhaus, DE)

Assignee: ROBERT BOSCH GMBH

G01R31/2601G01R31/52

Abstract

Claims (36)

1. A method for monitoring a semiconductor component, comprising the following steps:

detecting, by a measuring device during operation of the semiconductor component, a leakage current which flows through a first electrode and a second electrode of the semiconductor component;

i) comparing, by a computing device, the leakage current with a first limit value for the leakage current and determining an output based on a result of the comparison and/or ii) determining, by the computing device, a time at which a maximum point of the leakage current occurs and determining the output based on the time, wherein the output includes a state of the semiconductor component; and

outputting, by an output device, the output.

2. The method according to claim 1 , wherein the first limit value which the leakage current exceeds or falls below is determined from a plurality of limit values, wherein a residual value of a service life of the semiconductor component is determined depending on the first limit value, and wherein the output includes the residual value.

3. The method according to claim 2 , wherein the leakage current is detected during operation of the semiconductor component in a first operating mode, wherein the operation of the semiconductor component in the first operating mode is continued based on the leakage current exceeding the first limit value or based on the residual value of the service life being greater than a first threshold value.

4. The method according to claim 3 , wherein a second limit value is determined from the plurality of limit values, wherein the operation of the semiconductor component is continued in a second operating mode or the operation is terminated based on the leakage current exceeding the second threshold value or the operation of the semiconductor component is continued in a second operating mode or the operation is terminated based on the residual value of the service life is greater than a second threshold value.

5. The method according to claim 4 , wherein a reference limit value and a reference temperature are specified, a current temperature of the semiconductor component or an environment of the semiconductor component is determined, a factor is determined depending on the current temperature and the reference temperature, the reference limit value is scaled with the factor and the first limit value and/or the second limit value is determined depending on the reference limit value scaled with the factor.

6. The method according to claim 1 , wherein a residual value of a service life of the semiconductor component is determined depending on the time at which the maximum point of the leakage current occurs, wherein the output includes the residual value.

7. The method according to claim 1 , wherein a text including the state of the semiconductor component and an indication of a remaining service life is determined, wherein the text is sent in a message or output at a human-machine interface.

8. The method according to claim 1 , further comprising:

determining a control signal specifying an operating mode for the semiconductor component; and

outputting the control signal to control the semiconductor component or a device including the semiconductor component to operate in the operating mode.

9. The method according to claim 1 , wherein the leakage current is compared with the first limit value for the leakage current and the output is determined based on the result of the comparison.

10. The method according to claim 1 , wherein the time at which the maximum point of the leakage current occurs is determined and the output is determined based on the time.

11. An apparatus configured to monitor a semiconductor component, comprising:

a measuring device;

a computing device; and

an output device;

wherein the measuring device is configured to detect, during operation of the semiconductor component, a leakage current which flows through a first electrode and a second electrode of the semiconductor component;

wherein: (i) the computing device is configured to compare the leakage current with a first limit value for the leakage current and determine an output depending on a result of the comparison, and/or (ii) the computing device is configured to determine a time at which a maximum point of the leakage current occurs and determine the output depending on the time;

wherein the output includes a state of the semiconductor component; and

wherein the output device is configured to output the output.

12. The apparatus of claim 11 , wherein the computing device compares the leakage current with the first limit value for the leakage current and determines the output depending on the result of the comparison.

13. The apparatus of claim 11 , wherein the computing device determines the time at which the maximum point of the leakage current occurs and determines the output depending on the time.

14. A microelectromechanical system (MEMS) or memory or actuator or micromirror or printhead or speaker, comprising,

apparatus configured to monitor a semiconductor component, comprising:

a measuring device;

a computing device; and

an output device;

wherein the measuring device is configured to detect, during operation of the semiconductor component, a leakage current which flows through a first electrode and a second electrode of the semiconductor component;

wherein: (i) the computing device is configured to compare the leakage current with a first limit value for the leakage current and determine an output depending on a result of the comparison, and/or (ii) the computing device is configured to determine a time at which a maximum point of the leakage current occurs and determine the output depending on the time;

wherein the output includes a state of the semiconductor component; and

wherein the output device is configured to output the output.

15. The MEMS or memory or actuator or micromirror or printhead or speaker of claim 14 , wherein the computing device compares the leakage current with the first limit value for the leakage current and determines the output depending on the result of the comparison.

16. The MEMS or memory or actuator or micromirror or printhead or speaker of claim 14 , wherein the computing device determines the time at which the maximum point of the leakage current occurs and determines the output depending on the time.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (27)